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LIQUID-COOLING HEAT DISSIPATION DEVICE
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Publication number 20250081387
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Publication date Mar 6, 2025
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JWS TECHNOLOGY CO., LTD.
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Pang-Hung LIAO
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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JOINT MODULE, SERVER, AND COMPUTING SYSTEM
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Publication number 20250081393
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Publication date Mar 6, 2025
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Fulian Precision Electronics (Tianjin) Co., LTD.
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CHANG-JU WU
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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LIQUID IMMERSION COOLING SYSTEMS
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Publication number 20250081396
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Publication date Mar 6, 2025
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Intel Corporation
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Guangying Zhang
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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HEAT-DISSIPATING PLATES AND DISPLAY DEVICES
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Publication number 20250081420
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Publication date Mar 6, 2025
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WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
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Wenqiang WANG
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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OPTIMIZED CHIP COOLING INFRASTRUCTURE
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Publication number 20250063688
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Publication date Feb 20, 2025
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Microsoft Technology Licensing, LLC
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Eric C. PETERSON
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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HEAT-PUMP HEAT SOURCE APPARATUS
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Publication number 20250063690
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Publication date Feb 20, 2025
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Mitsubishi Electric Corporation
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Naoto ISHII
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F24 - HEATING RANGES VENTILATING
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COOLING DEVICE
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Publication number 20250063705
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Publication date Feb 20, 2025
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MAGNA POWERTRAIN GMBH & CO KG
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Werner Ness
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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IMMERSION COOLING APPARATUS
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Publication number 20250056758
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Publication date Feb 13, 2025
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NEC Corporation
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Atsuki TOKUDA
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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