Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage

Industry

CPC
H05K7/20272

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fluid machine
- Patent number 11,973,381
- Issue date Apr 30, 2024
- Kabushiki Kaisha Toyota Jidoshokki
- Katsutoshi Shiromaru
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Heat sink, heat sink arrangement and module for liquid immersion co...
- Patent number 11,968,802
- Issue date Apr 23, 2024
- ICEOTOPE GROUP LIMITED
- David Amos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid-cooling block and liquid-cooling block assembly and liquid-c...
- Patent number 11,963,330
- Issue date Apr 16, 2024
- DONGGUAN HANXU HARDWARE PLASTIC TECHNOLOGY CO., LTD.
- Tsung-Hsien Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contactless device and chip thermal management plate
- Patent number 11,963,337
- Issue date Apr 16, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High temperature electronic device thermal management system
- Patent number 11,963,341
- Issue date Apr 16, 2024
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Server device
- Patent number 11,956,929
- Issue date Apr 9, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Chun-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid-cooled plate radiator
- Patent number 11,956,920
- Issue date Apr 9, 2024
- Shenzhen MicroBT Electronics Technology Co., Ltd.
- Qian Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support structure designs for MEMS-based active cooling
- Patent number 11,956,921
- Issue date Apr 9, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multiple chambers connection module for cooling streams
- Patent number 11,956,922
- Issue date Apr 9, 2024
- BAIDU USA LLC
- Tianyi Gao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power device and cooling plate
- Patent number 11,956,923
- Issue date Apr 9, 2024
- Thermo King LLC
- Subrahmanya Mv
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Liquid-cooled assembly and method
- Patent number 11,950,394
- Issue date Apr 2, 2024
- GE Aviation Systems LLC
- Brian Magann Rush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling electronic components of a vehicle
- Patent number 11,943,903
- Issue date Mar 26, 2024
- BorgWarner Luxembourg Automotive Systems SA
- Pascal David
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling device and electronic device
- Patent number 11,943,895
- Issue date Mar 26, 2024
- Cooler Master Co., Ltd.
- Shui-Fa Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dielectric liquid immersion cooling container
- Patent number 11,943,897
- Issue date Mar 26, 2024
- SLICIP, Inc.
- Gary D. Testa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Water-cooling radiator
- Patent number 11,943,896
- Issue date Mar 26, 2024
- Dongguan Keepro Electronics Co., Ltd.
- Liangcheng Xie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Server, liquid cooling device and cold plate assembly
- Patent number 11,937,399
- Issue date Mar 19, 2024
- SQ Technology(Shanghai) Corporation
- Shuai Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Photo-etched chassis cooling walls
- Patent number 11,937,407
- Issue date Mar 19, 2024
- Hewlett Packard Enterprise Development LP
- John Franz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System design and operation for liquid cooling
- Patent number 11,937,401
- Issue date Mar 19, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation device and cooling unit
- Patent number 11,937,400
- Issue date Mar 19, 2024
- Nidec Corporation
- Naoyuki Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling head and liquid cooling device with the same
- Patent number 11,930,618
- Issue date Mar 12, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chien-Yu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced information handling system component immersion cooling vi...
- Patent number 11,930,617
- Issue date Mar 12, 2024
- Dell Products, L.P.
- Robert Boyd Curtis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plug-in pump installation structure of cooling distribution unit
- Patent number 11,930,619
- Issue date Mar 12, 2024
- Ablecom Technology Inc.
- Chien-Fa Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid delivery wand
- Patent number 11,925,946
- Issue date Mar 12, 2024
- GREEN REVOLUTION COOLING, INC.
- John Bean
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Textile weave redundant loop cold plate design
- Patent number 11,924,997
- Issue date Mar 5, 2024
- Rockwell Collins, Inc.
- Joseph Turney
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Symmetrical dual fluid distribution unit for server rack
- Patent number 11,924,999
- Issue date Mar 5, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid-cooling devices, and systems, to cool multi-chip modules
- Patent number 11,924,996
- Issue date Mar 5, 2024
- Brad Zakaib
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for pneumatic release manifold sealing
- Patent number 11,925,005
- Issue date Mar 5, 2024
- Eagle Technology, LLC
- Clarke O. Fowler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tank, liquid circulation system and operating method
- Patent number 11,920,613
- Issue date Mar 5, 2024
- HITACHI ENERGY LTD
- Kim Missing
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Components for a fluid cooling system and fluid cooling system havi...
- Patent number 11,925,000
- Issue date Mar 5, 2024
- TECHN GmbH
- Nikolaus Kohl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods for constraining liquid cooling tubes in liquid...
- Patent number 11,913,576
- Issue date Feb 27, 2024
- ZT GROUP INT'L, INC.
- Anthony Villafuerte
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
AXIAL PUMP WITH ADJUSTABLE IMPELLER
- Publication number 20240141926
- Publication date May 2, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- John P. FRANZ
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
MANIFOLD, RACK AND DATA CENTER COOLING SYSTEM
- Publication number 20240147660
- Publication date May 2, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- YU-CHIA TING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AXIAL PUMP WITH SPLIT PRINTED CIRCUIT BOARD ASSEMBLY (PCA)
- Publication number 20240141899
- Publication date May 2, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- John P. FRANZ
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
COOLING DEVICE AND COOLING METHOD APPLIED TO RACK SERVER
- Publication number 20240147673
- Publication date May 2, 2024
- SUPER MICRO COMPUTER, INC.
- Chia-Wei CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ZONED HEAT DISSIPATION CONTROL SYSTEM FOR WATER COOLING RADIATOR AN...
- Publication number 20240147661
- Publication date May 2, 2024
- GIGA-BYTE TECHNOLOGY CO.,LTD.
- SHUN-CHIH HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANOSECOND PULSER ADC SYSTEM
- Publication number 20240136152
- Publication date Apr 25, 2024
- Eagle Harbor Technologies, Inc.
- Kenneth Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR THERMAL MANAGEMENT OF AN ELECTRONIC DEVICE
- Publication number 20240138107
- Publication date Apr 25, 2024
- Dana Canada Corporation
- Jingyuan LIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STANDALONE AND SCALABLE LIQUID COOLING MODULES
- Publication number 20240138120
- Publication date Apr 25, 2024
- Tyler Baxter Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING
- Publication number 20240138105
- Publication date Apr 25, 2024
- Dell Products L.P.
- Tyler Baxter Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATER BLOCK WITH AIR-COOLING MODULE AND MULTI-LAYER HEAT-CONDUCTING...
- Publication number 20240138110
- Publication date Apr 25, 2024
- Huizhou Xunshuo Technology Co., Ltd
- Yanzhun LIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR PER-TENANT REDUNDANT THERMAL MANAGEMENT USING...
- Publication number 20240138119
- Publication date Apr 25, 2024
- Dell Products L.P.
- Tyler Baxter Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE AND CASE
- Publication number 20240138109
- Publication date Apr 25, 2024
- DENSO CORPORATION
- Shinichi MIURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADJUSTABLE HINGED MOUNTING BRACKET FOR A COMPUTING DEVICE
- Publication number 20240138122
- Publication date Apr 25, 2024
- Tyler Baxter Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...
- Publication number 20240136252
- Publication date Apr 25, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
THERMAL MANAGEMENT SYSTEM
- Publication number 20240138108
- Publication date Apr 25, 2024
- Rolls-Royce plc
- Chandana J. GAJANAYAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING APPARATUS AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240138111
- Publication date Apr 25, 2024
- Formerica Optoelectronics, Inc.
- Joseph Chen-Kwo Liu
- G08 - SIGNALLING
Information Patent Application
COOLING AND SHOCK ISOLATION ARCHITECTURE FOR STANDALONE AND SCALABL...
- Publication number 20240138106
- Publication date Apr 25, 2024
- Tyler Baxter Duncan
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING
- Publication number 20240138123
- Publication date Apr 25, 2024
- Dell Products L.P.
- Tyler Baxter Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid Manifold Assembly for Electronics Cabinet
- Publication number 20240130079
- Publication date Apr 18, 2024
- Hoffman Enclosures Inc.
- Scott Stammer
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
FLUID COOLING SYSTEM FOR COMPUTER CABINETS
- Publication number 20240130088
- Publication date Apr 18, 2024
- POLINKE INTERNATIONAL CO., LTD.
- CHUN-LIN CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADAPTIVE CASCADE COOLING METHOD FOR DATACENTERS
- Publication number 20240130089
- Publication date Apr 18, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Munther Salim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTICHANNEL MANIFOLD COLD PLATE
- Publication number 20240130077
- Publication date Apr 18, 2024
- 3M Innovative Properties Company
- Qihong Nie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIMODE IMMERSION COOLING
- Publication number 20240130086
- Publication date Apr 18, 2024
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Wai Chung LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR A COOLING SYSTEM
- Publication number 20240130078
- Publication date Apr 18, 2024
- Microsoft Technology Licensing, LLC
- Fang DONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WATER-COOLED HEAT DISSIPATION MODULE ASSEMBLY
- Publication number 20240121924
- Publication date Apr 11, 2024
- DONG YANG PISTON CO., LTD.
- Kwan Ho RYU
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Multiple PCB Cooling Module Assembly
- Publication number 20240121918
- Publication date Apr 11, 2024
- Panasonic Automotive Systems Company of America, Division of Panasonic Corpor...
- MICHAEL DARRILL MOORE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING DEVICE
- Publication number 20240121915
- Publication date Apr 11, 2024
- ERWIN QUARDER SYSTEMTECHNIK GMBH
- Georg Siewert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEMS HAVING A CONDUIT AND A HEAT TRANSFER DEVICE FOR TRA...
- Publication number 20240114651
- Publication date Apr 4, 2024
- Lenovo Global Technology (United States) Inc.
- Jeffrey Holland
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING SYSTEMS HAVING COOLING AND AUGMENTATION LOOPS FOR ELECTRONI...
- Publication number 20240114652
- Publication date Apr 4, 2024
- Lenovo Global Technology (United States) Inc.
- Vinod KAMATH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Device With Connected Component Carrier and Fluid Coolin...
- Publication number 20240114656
- Publication date Apr 4, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fluid machine

Heat sink, heat sink arrangement and module for liquid immersion co...

Liquid-cooling block and liquid-cooling block assembly and liquid-c...

Contactless device and chip thermal management plate

High temperature electronic device thermal management system

Server device

Liquid-cooled plate radiator

Support structure designs for MEMS-based active cooling

Multiple chambers connection module for cooling streams

Power device and cooling plate

Liquid-cooled assembly and method

Systems and methods for cooling electronic components of a vehicle

Liquid cooling device and electronic device

Dielectric liquid immersion cooling container

Water-cooling radiator

Server, liquid cooling device and cold plate assembly

Photo-etched chassis cooling walls

System design and operation for liquid cooling

Heat dissipation device and cooling unit

Liquid cooling head and liquid cooling device with the same

Enhanced information handling system component immersion cooling vi...

Plug-in pump installation structure of cooling distribution unit

Fluid delivery wand

Textile weave redundant loop cold plate design

Symmetrical dual fluid distribution unit for server rack

Liquid-cooling devices, and systems, to cool multi-chip modules

Systems and methods for pneumatic release manifold sealing

Tank, liquid circulation system and operating method

Components for a fluid cooling system and fluid cooling system havi...

Devices and methods for constraining liquid cooling tubes in liquid...

Patents Applicationslast 30 patents

AXIAL PUMP WITH ADJUSTABLE IMPELLER

MANIFOLD, RACK AND DATA CENTER COOLING SYSTEM

AXIAL PUMP WITH SPLIT PRINTED CIRCUIT BOARD ASSEMBLY (PCA)

COOLING DEVICE AND COOLING METHOD APPLIED TO RACK SERVER

ZONED HEAT DISSIPATION CONTROL SYSTEM FOR WATER COOLING RADIATOR AN...

NANOSECOND PULSER ADC SYSTEM

SYSTEMS FOR THERMAL MANAGEMENT OF AN ELECTRONIC DEVICE

STANDALONE AND SCALABLE LIQUID COOLING MODULES

SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING

WATER BLOCK WITH AIR-COOLING MODULE AND MULTI-LAYER HEAT-CONDUCTING...

SYSTEM AND METHOD FOR PER-TENANT REDUNDANT THERMAL MANAGEMENT USING...

ELECTRICAL DEVICE AND CASE

ADJUSTABLE HINGED MOUNTING BRACKET FOR A COMPUTING DEVICE

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...

THERMAL MANAGEMENT SYSTEM

IMMERSION COOLING APPARATUS AND MANUFACTURING METHOD OF THE SAME

COOLING AND SHOCK ISOLATION ARCHITECTURE FOR STANDALONE AND SCALABL...

SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING

Liquid Manifold Assembly for Electronics Cabinet

FLUID COOLING SYSTEM FOR COMPUTER CABINETS

ADAPTIVE CASCADE COOLING METHOD FOR DATACENTERS

MULTICHANNEL MANIFOLD COLD PLATE

MULTIMODE IMMERSION COOLING

DEVICES, SYSTEMS, AND METHODS FOR A COOLING SYSTEM

WATER-COOLED HEAT DISSIPATION MODULE ASSEMBLY

Multiple PCB Cooling Module Assembly

COOLING DEVICE

COOLING SYSTEMS HAVING A CONDUIT AND A HEAT TRANSFER DEVICE FOR TRA...

COOLING SYSTEMS HAVING COOLING AND AUGMENTATION LOOPS FOR ELECTRONI...

Electronic Device With Connected Component Carrier and Fluid Coolin...