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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85121Active alignment, i.e. by apparatus steering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Signal routing in complex quantum systems
- Patent number 10,658,340
- Issue date May 19, 2020
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding apparatus and method of estimating position of landing poin...
- Patent number 10,586,781
- Issue date Mar 10, 2020
- Shinkawa Ltd.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for routing signals in complex quantum systems
- Patent number 10,347,605
- Issue date Jul 9, 2019
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonding connection of semiconductor device
- Patent number 9,059,182
- Issue date Jun 16, 2015
- Infineon Technologies AG
- Hubert Maier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wire interconnect (TWI) for semiconductor components having...
- Patent number 9,013,044
- Issue date Apr 21, 2015
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor component having through wire interconnect (T...
- Patent number 8,513,797
- Issue date Aug 20, 2013
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having through wire interconnect (TWI) with...
- Patent number 8,193,646
- Issue date Jun 5, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of teaching eyepoints for wire bonding and related semicondu...
- Patent number 8,100,317
- Issue date Jan 24, 2012
- Kulicke and Soffa Industries, Inc.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 8,091,761
- Issue date Jan 10, 2012
- Shinkawa Ltd.
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of teaching eyepoints for wire bonding and related semicondu...
- Patent number 7,931,186
- Issue date Apr 26, 2011
- Kulicke and Soffa Industries, Inc.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging device and method for a bonding apparatus
- Patent number 7,848,022
- Issue date Dec 7, 2010
- Kabushiki Kaisha Shinkawa
- Shigeru Hayata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of correcting bonding coordinates using reference bond pads
- Patent number 7,817,846
- Issue date Oct 19, 2010
- Samsung Techwin Co., Ltd.
- Yong-bok Chung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor components with through wire interconnects (TWI)
- Patent number 7,786,605
- Issue date Aug 31, 2010
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device handler for a bonding apparatus
- Patent number 7,677,431
- Issue date Mar 16, 2010
- ASM Technology Singapore Pte. Ltd.
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,659,635
- Issue date Feb 9, 2010
- Renesas Technology Corp.
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding system utilizing multiple positioning tables
- Patent number 7,654,436
- Issue date Feb 2, 2010
- ASM Assembly Automation Ltd.
- Wing Cheung James Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration apparatus for bondhead of wire bonding machine
- Patent number 7,624,904
- Issue date Dec 1, 2009
- Kulicke and Soffa Industries, Inc.
- John J. Smith
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for fabricating semiconductor components with t...
- Patent number 7,579,267
- Issue date Aug 25, 2009
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment key structure in a semiconductor device and method of for...
- Patent number 7,573,142
- Issue date Aug 11, 2009
- Samsung Electronics Co., Ltd.
- Seok-Han Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,456,091
- Issue date Nov 25, 2008
- Renesas Technology Corp.
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding program
- Patent number 7,330,582
- Issue date Feb 12, 2008
- Kabushiki Kaisha Shinkawa
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus
- Patent number 7,324,684
- Issue date Jan 29, 2008
- Kabushiki Kaisha Shinkawa
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor components having through wire interconnects (TWI)
- Patent number 7,307,348
- Issue date Dec 11, 2007
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, bonding apparatus and bonding program
- Patent number 7,209,583
- Issue date Apr 24, 2007
- Kabushiki Kaisha Shinkawa
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor devices using a bond program...
- Patent number 7,029,929
- Issue date Apr 18, 2006
- National Semiconductor Corporation
- Qin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for integrated circuit ball bonding using sta...
- Patent number 7,009,305
- Issue date Mar 7, 2006
- Agere Systems Inc.
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond program verification system
- Patent number 6,789,235
- Issue date Sep 7, 2004
- National Semiconductor Corporation
- Qin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball detection method and apparatus for wire-bonded parts
- Patent number 5,870,489
- Issue date Feb 9, 1999
- Kabushiki Kaisha Shinkawa
- Nobuto Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL ROUTING IN COMPLEX QUANTUM SYSTEMS
- Publication number 20190287946
- Publication date Sep 19, 2019
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR ROUTING SIGNALS IN COMPLEX QUANTUM SYSTEMS
- Publication number 20190164935
- Publication date May 30, 2019
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...
- Publication number 20150255444
- Publication date Sep 10, 2015
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Wire Interconnect (TWI) For Semiconductor Components Having...
- Publication number 20130299983
- Publication date Nov 14, 2013
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...
- Publication number 20120228781
- Publication date Sep 13, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON...
- Publication number 20120024089
- Publication date Feb 2, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jeremiah Couey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...
- Publication number 20110174865
- Publication date Jul 21, 2011
- KULICKE AND SOFFA INDUSTRIES, INC.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding apparatus and bonding method
- Publication number 20110114704
- Publication date May 19, 2011
- Shinkawa Ltd.
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Component Having Through Wire Interconnect (TWI) With...
- Publication number 20100264521
- Publication date Oct 21, 2010
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...
- Publication number 20100181365
- Publication date Jul 22, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Imaging device and method for a bonding apparatus
- Publication number 20090124028
- Publication date May 14, 2009
- KABUSHIKI KAISHA SHINKAWA
- Shigeru Hayata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRE BONDING SYSTEM UTILIZING MULTIPLE POSITIONING TABLES
- Publication number 20090078743
- Publication date Mar 26, 2009
- Wing Cheung James HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Imaging device and method for a bonding apparatus
- Publication number 20090059361
- Publication date Mar 5, 2009
- KABUSHIKI KAISHA SHINKAWA
- Shigeru Hayata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090001572
- Publication date Jan 1, 2009
- Renesas Technology Corp.
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HANDLER FOR A BONDING APPARATUS
- Publication number 20080093004
- Publication date Apr 24, 2008
- ASM Technology Singapore Pte Ltd
- Yam Mo WONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked Semiconductor Components With Through Wire Interconnects (TWI)
- Publication number 20080042247
- Publication date Feb 21, 2008
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of correcting bonding coordinates using reference bond pads
- Publication number 20070230771
- Publication date Oct 4, 2007
- Samsung Techwin Co., Ltd.
- Yong-bok Chung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and systems for fabricating semiconductor components with t...
- Publication number 20070167000
- Publication date Jul 19, 2007
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor components having through wire interconnects (TWI)
- Publication number 20070126091
- Publication date Jun 7, 2007
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device for bonding connection
- Publication number 20070063318
- Publication date Mar 22, 2007
- Infineon Technologies AG
- Hubert Maier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding program
- Publication number 20070041632
- Publication date Feb 22, 2007
- KABUSHIKI KAISHA SHINKAWA
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding apparatus
- Publication number 20070036425
- Publication date Feb 15, 2007
- KABUSHIKI KAISHA SHINKAWA
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20060261495
- Publication date Nov 23, 2006
- Renesas Technology Corp.
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment key structure in a semiconductor device and method of for...
- Publication number 20060246648
- Publication date Nov 2, 2006
- SAMSUNG ELECTRONICS CO., LTD.
- Seok-Han Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND POSITIONING METHOD FOR WIRE-BONDING PROCESS AND SUBSTRATE FOR...
- Publication number 20060128040
- Publication date Jun 15, 2006
- Siliconware Precision Industries Co., Ltd.
- Chih-Feng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR INTEGRATED CIRCUIT BALL BONDING USING STA...
- Publication number 20060001157
- Publication date Jan 5, 2006
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method, bonding apparatus and bonding program
- Publication number 20050167471
- Publication date Aug 4, 2005
- KABUSHIKI KAISHA SHINKAWA
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Active alignment, i.e. by apparatus steering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Signal routing in complex quantum systems

Bonding apparatus and method of estimating position of landing poin...

Method of manufacturing a semiconductor device

System and method for routing signals in complex quantum systems

Semiconductor device, method of manufacturing a semiconductor devic...

Method for producing bonding connection of semiconductor device

Through wire interconnect (TWI) for semiconductor components having...

Stacked semiconductor component having through wire interconnect (T...

Semiconductor component having through wire interconnect (TWI) with...

Method of teaching eyepoints for wire bonding and related semicondu...

Bonding apparatus and bonding method

Method of teaching eyepoints for wire bonding and related semicondu...

Imaging device and method for a bonding apparatus

Method of correcting bonding coordinates using reference bond pads

Stacked semiconductor components with through wire interconnects (TWI)

Electronic device handler for a bonding apparatus

Semiconductor device and method of manufacturing the same

Wire bonding system utilizing multiple positioning tables

Calibration apparatus for bondhead of wire bonding machine

Methods and systems for fabricating semiconductor components with t...

Alignment key structure in a semiconductor device and method of for...

Semiconductor device and method of manufacturing the same

Bonding program

Bonding apparatus

Semiconductor components having through wire interconnects (TWI)

Bonding method, bonding apparatus and bonding program

Method of manufacturing semiconductor devices using a bond program...

Methods and apparatus for integrated circuit ball bonding using sta...

Bond program verification system

Ball detection method and apparatus for wire-bonded parts

Patents Applicationslast 30 patents

SIGNAL ROUTING IN COMPLEX QUANTUM SYSTEMS

SYSTEM AND METHOD FOR ROUTING SIGNALS IN COMPLEX QUANTUM SYSTEMS

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...

Through Wire Interconnect (TWI) For Semiconductor Components Having...

STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON...

METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...

Bonding apparatus and bonding method

Semiconductor Component Having Through Wire Interconnect (TWI) With...

METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...

Imaging device and method for a bonding apparatus

WIRE BONDING SYSTEM UTILIZING MULTIPLE POSITIONING TABLES

Imaging device and method for a bonding apparatus

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE HANDLER FOR A BONDING APPARATUS

Stacked Semiconductor Components With Through Wire Interconnects (TWI)

Method of correcting bonding coordinates using reference bond pads

Methods and systems for fabricating semiconductor components with t...

Semiconductor components having through wire interconnects (TWI)

Semiconductor device for bonding connection

Bonding program

Bonding apparatus

Semiconductor device and method of manufacturing the same

Alignment key structure in a semiconductor device and method of for...

BOND POSITIONING METHOD FOR WIRE-BONDING PROCESS AND SUBSTRATE FOR...

METHODS AND APPARATUS FOR INTEGRATED CIRCUIT BALL BONDING USING STA...

Bonding method, bonding apparatus and bonding program