Additional lead-in metallisation on a device or substrate

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/32Additional lead-in metallisation on a device or substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and method for detecting broken fanout wire of di...
- Patent number 11,972,989
- Issue date Apr 30, 2024
- BOE Technology Group Co., Ltd.
- Li Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,961,774
- Issue date Apr 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, and tiled display device including the display device
- Patent number 11,961,822
- Issue date Apr 16, 2024
- Samsung Display Co., Ltd.
- Hyun Joon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Bonded wafer device structure and methods for making the same
- Patent number 11,961,826
- Issue date Apr 16, 2024
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for measuring device inside through-silicon via s...
- Patent number 11,955,392
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuo-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device test circuits and methods of use
- Patent number 11,935,798
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,923,317
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Changjoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,915,975
- Issue date Feb 27, 2024
- Renesas Electronics Corporation
- Tetsuya Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 11,903,298
- Issue date Feb 13, 2024
- BOE Technology Group Co., Ltd.
- Junbo Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interwafer connection structure for coupling wafers in a wafer stack
- Patent number 11,901,338
- Issue date Feb 13, 2024
- Xilinx, Inc.
- Myongseob Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stress monitoring structure and semiconductor chip
- Patent number 11,894,279
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chien-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,887,935
- Issue date Jan 30, 2024
- Renesas Electronics Corporation
- Takehiro Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power electronics
- Patent number 11,887,953
- Issue date Jan 30, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test pad
- Patent number 11,887,900
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Hyuek Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor die with die region and seal-ring...
- Patent number 11,887,892
- Issue date Jan 30, 2024
- MagnaChip Semiconductor, Ltd.
- Jin Won Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having vias on a scribe lane region
- Patent number 11,876,043
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Jooncheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component and package structure having the same
- Patent number 11,869,819
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical light emitting diode chip package with electrical detectio...
- Patent number 11,869,817
- Issue date Jan 9, 2024
- Excellence Opto. Inc.
- Fu-Bang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor package and method of manufacturing same
- Patent number 11,869,818
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package with multiple test pads and parallel circuit elements
- Patent number 11,869,816
- Issue date Jan 9, 2024
- Excellence Opto. Inc.
- Fu-Bang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the same
- Patent number 11,864,454
- Issue date Jan 2, 2024
- Samsung Display Co., Ltd.
- Won-Kyu Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting defects in semiconductor device
- Patent number 11,854,913
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a chip pad having a connection port...
- Patent number 11,854,912
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,855,066
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of testing memory devices
- Patent number 11,854,914
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistance patterns for an On-Die EPM
- Patent number 11,837,512
- Issue date Dec 5, 2023
- SK hynix Inc.
- Oh Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor base plate and test method thereof
- Patent number 11,821,937
- Issue date Nov 21, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing carrier
- Patent number 11,823,965
- Issue date Nov 21, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, manufacturing method thereof, and semiconductor...
- Patent number 11,817,363
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE PERFORATED PLATE FOR ELECTRICAL TEST
- Publication number 20240142496
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Wolfgang Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING TEST PADS
- Publication number 20240145317
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Joongwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD
- Publication number 20240136237
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Changui Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Device Dies With Measurement Structures
- Publication number 20240128261
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING
- Publication number 20240128132
- Publication date Apr 18, 2024
- SANDISK TECHNOLOGIES LLC
- Toru Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240128236
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE W...
- Publication number 20240128133
- Publication date Apr 18, 2024
- ROBERT BOSCH GmbH
- Jens Baringhaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING
- Publication number 20240128134
- Publication date Apr 18, 2024
- SANDISK TECHNOLOGIES LLC
- Toru Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DIE AND SEMICONDUCTOR DEVICE THEREOF
- Publication number 20240128123
- Publication date Apr 18, 2024
- Magnachip Semiconductor, Ltd.
- Jin Won JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN OF VOLTAGE CONTRAST PROCESS MONITOR
- Publication number 20240112962
- Publication date Apr 4, 2024
- Intel Corporation
- Xiao WEN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240112963
- Publication date Apr 4, 2024
- MEDIATEK INC.
- Yu-Tung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...
- Publication number 20240113088
- Publication date Apr 4, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240113171
- Publication date Apr 4, 2024
- RENESAS ELECTRONICS CORPORATION
- Yanzhe WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20240105526
- Publication date Mar 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240103070
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240107869
- Publication date Mar 28, 2024
- SAMSUNG DISPLAY CO., LTD.
- Won-Kyu KWAK
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096717
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- AE-NEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTKEY STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240096718
- Publication date Mar 21, 2024
- WINBOND ELECTRONICS CORP.
- Chung-Hsuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096841
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Ohguk KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT METHOD AND ALIGNMENT DEVICE
- Publication number 20240096716
- Publication date Mar 21, 2024
- STAR TECHNOLOGIES (WUHAN) CO., LTD.
- CHOON LEONG LOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088124
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20240087967
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFAC...
- Publication number 20240071841
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Sumin PARK
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE LAYOUT STRUCTURE, METHOD FOR FORMING SAME, AND...
- Publication number 20240071844
- Publication date Feb 29, 2024
- Changxin Memory Technologies, Inc.
- Yizhi ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME
- Publication number 20240071845
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Jaesun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING AN ASYMMETRIC PAD ARRAYS, A SEMICONDUCT...
- Publication number 20240071967
- Publication date Feb 29, 2024
- SK HYNIX INC.
- Choung Ki SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND METHOD OF MANUFACTURING SAME, AND SPLICED DISPLAY...
- Publication number 20240063351
- Publication date Feb 22, 2024
- Yongchao ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING LIGHT-EMITTING DIODE AND LIGHT-EMITTING BAS...
- Publication number 20240055548
- Publication date Feb 15, 2024
- HUIZHOU CHINA STAR OPTOELECTRONICS DISPLAY CO., LTD.
- Bo Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PERFORMANCE HYBRID BONDED INTERCONNECT SYSTEMS
- Publication number 20240038702
- Publication date Feb 1, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SE...
- Publication number 20240038604
- Publication date Feb 1, 2024
- STMicroelectronics S.r.l
- Luca CECCHETTO
- H01 - BASIC ELECTRIC ELEMENTS

Additional lead-in metallisation on a device or substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked via structure

Display substrate and method for detecting broken fanout wire of di...

Semiconductor device and method for manufacturing same

Display device, and tiled display device including the display device

Bonded wafer device structure and methods for making the same

System and method for measuring device inside through-silicon via s...

Stacked semiconductor device test circuits and methods of use

Semiconductor devices

Method of manufacturing semiconductor device

Display panel and display device

Interwafer connection structure for coupling wafers in a wafer stack

Semiconductor stress monitoring structure and semiconductor chip

Semiconductor device and manufacturing method thereof

Package for power electronics

Semiconductor package including test pad

Method for forming semiconductor die with die region and seal-ring...

Semiconductor devices having vias on a scribe lane region

Integrated circuit component and package structure having the same

Vertical light emitting diode chip package with electrical detectio...

Chip-stacked semiconductor package and method of manufacturing same

LED package with multiple test pads and parallel circuit elements

Display device and method of fabricating the same

Method for detecting defects in semiconductor device

Semiconductor package including a chip pad having a connection port...

Semiconductor structure and manufacturing method thereof

Systems and methods of testing memory devices

Resistance patterns for an On-Die EPM

Semiconductor base plate and test method thereof

Substrate processing carrier

Semiconductor die, manufacturing method thereof, and semiconductor...

Patents Applicationslast 30 patents

CONDUCTIVE PERFORATED PLATE FOR ELECTRICAL TEST

SEMICONDUCTOR PACKAGES HAVING TEST PADS

TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD

Passive Device Dies With Measurement Structures

SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE W...

SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING

METHOD FOR FORMING SEMICONDUCTOR DIE AND SEMICONDUCTOR DEVICE THEREOF

DESIGN OF VOLTAGE CONTRAST PROCESS MONITOR

SEMICONDUCTOR STRUCTURE

INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

TESTKEY STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ALIGNMENT METHOD AND ALIGNMENT DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFAC...

SEMICONDUCTOR DEVICE LAYOUT STRUCTURE, METHOD FOR FORMING SAME, AND...

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME

SEMICONDUCTOR DIE INCLUDING AN ASYMMETRIC PAD ARRAYS, A SEMICONDUCT...

DISPLAY PANEL AND METHOD OF MANUFACTURING SAME, AND SPLICED DISPLAY...

METHOD FOR TRANSFERRING LIGHT-EMITTING DIODE AND LIGHT-EMITTING BAS...

HIGH-PERFORMANCE HYBRID BONDED INTERCONNECT SYSTEMS

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SE...