Additional lead-in metallisation on a device or substrate

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/32Additional lead-in metallisation on a device or substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting diode packages
- Patent number 12,176,472
- Issue date Dec 24, 2024
- CreeLED, Inc.
- Roshan Murthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PID test structure and semiconductor test structure
- Patent number 12,176,254
- Issue date Dec 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ChihCheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage contrast metrology mark
- Patent number 12,169,366
- Issue date Dec 17, 2024
- ASML Netherlands B.V.
- Cyrus Emil Tabery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and display device
- Patent number 12,167,647
- Issue date Dec 10, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Bo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond damage detector including a detection bond pad over a fir...
- Patent number 12,159,808
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Hung-Yun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for measuring device inside through-silicon via s...
- Patent number 12,159,809
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuo-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scan testable through silicon VIAs
- Patent number 12,154,835
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring light-emitting diode and light-emitting bas...
- Patent number 12,155,003
- Issue date Nov 26, 2024
- HUIZHOU CHINA STAR OPTOELECTRONICS DISPLAY CO., LTD.
- Bo Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device, semiconductor package, and me...
- Patent number 12,154,834
- Issue date Nov 26, 2024
- Fuji Electric Co., Ltd.
- Makoto Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,148,712
- Issue date Nov 19, 2024
- Mitsubishi Electric Corporation
- Kazuya Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of semiconductor device
- Patent number 12,148,723
- Issue date Nov 19, 2024
- United Microelectronics Corp.
- Zhirui Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 12,142,553
- Issue date Nov 12, 2024
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for regulating plasma dicing rates
- Patent number 12,142,527
- Issue date Nov 12, 2024
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus including antennas and directors
- Patent number 12,136,593
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package with board level reliability
- Patent number 12,131,967
- Issue date Oct 29, 2024
- Texas Instruments Incorporated
- Naweed Anjum
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transmission circuit, interface circuit, and memory
- Patent number 12,132,018
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Feng Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 12,119,299
- Issue date Oct 15, 2024
- Fuji Electric Co., Ltd.
- Sho Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,119,329
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on wafer assembly structure and assembly method thereof
- Patent number 12,112,991
- Issue date Oct 8, 2024
- ZHEJIANG LAB
- Qingwen Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of testing memory devices
- Patent number 12,107,022
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test pad and bonding pad structure...
- Patent number 12,094,844
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Analog sense points for measuring circuit die
- Patent number 12,094,789
- Issue date Sep 17, 2024
- Micron Technology, Inc.
- Christopher F. Kinney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-dispersion component in an electronic chip
- Patent number 12,087,683
- Issue date Sep 10, 2024
- STMicroelectronics (Rousset) SAS
- François Tailliet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,074,152
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Dae Hyuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,074,136
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with through via extending through redistribution...
- Patent number 12,068,212
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURES WITH COVER LAYERS
- Publication number 20250006564
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN FOR ASYMMETRIC PADS STRUCTURE AND TEST ELEMENT GROUP MODULE
- Publication number 20240429109
- Publication date Dec 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240421080
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF
- Publication number 20240413102
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING A PLURALITY OF PADS AND METHOD OF DETECTING...
- Publication number 20240402248
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Dojong CHUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR MEASURING DEVICE INSIDE THROUGH-SILICON VIA S...
- Publication number 20240395640
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuo-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE
- Publication number 20240395639
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF TESTING MEMORY DEVICES
- Publication number 20240387303
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INVERTER DEVICE
- Publication number 20240387302
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Yu FUKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387457
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240387367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20240387390
- Publication date Nov 21, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Four-Terminal Resistance Testing Structure
- Publication number 20240379472
- Publication date Nov 14, 2024
- Shanghai Huali Integrated Circuit Corporation
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTOR FOR MULTI DEVICE SOCKETS AND RELATED
- Publication number 20240377454
- Publication date Nov 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Raffy CELIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MEASURING SEMICONDUCTOR DEVICES
- Publication number 20240371706
- Publication date Nov 7, 2024
- Lodestar Licensing Group LLC
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF TESTING THE SAME
- Publication number 20240371709
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- RUEI-JYUN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES
- Publication number 20240371710
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lan-Chou Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PROBING PAD DESIGN IN SCRIBE LINE STRUCTURE AND METHOD FOR...
- Publication number 20240363454
- Publication date Oct 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240363483
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TING-YU YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND LEAD FRAME
- Publication number 20240363507
- Publication date Oct 31, 2024
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Test Pad and Bonding Pad Structure...
- Publication number 20240363565
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PROBING PAD DESIGN IN SCRIBE LINE STRUCTURE AND METHOD FOR...
- Publication number 20240363453
- Publication date Oct 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM PEELING TEST STRUCTURE AND THIN FILM PEELING TEST METHOD...
- Publication number 20240363455
- Publication date Oct 31, 2024
- SK hynix system ic (Wuxi) Co., Ltd.
- Kyung Wook KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363464
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240355782
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347492
- Publication date Oct 17, 2024
- Mitsubishi Electric Corporation
- Shin Chaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240339366
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DUAL DAMASCENE AND DUMMY PADS
- Publication number 20240332229
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS

Additional lead-in metallisation on a device or substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting diode packages

PID test structure and semiconductor test structure

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor package and method of fabricating the same

Voltage contrast metrology mark

Display substrate and display device

Semiconductor device

Wire bond damage detector including a detection bond pad over a fir...

System and method for measuring device inside through-silicon via s...

Scan testable through silicon VIAs

Method for transferring light-emitting diode and light-emitting bas...

Silicon carbide semiconductor device, semiconductor package, and me...

Semiconductor device and method of manufacturing semiconductor device

Structure of semiconductor device

Guard ring design enabling in-line testing of silicon bridges for s...

Method and system for regulating plasma dicing rates

Electronic apparatus including antennas and directors

Electronic device package with board level reliability

Transmission circuit, interface circuit, and memory

Semiconductor device and manufacturing method for the same

Semiconductor package and method of fabricating the same

System on wafer assembly structure and assembly method thereof

Systems and methods of testing memory devices

Semiconductor package including test pad and bonding pad structure...

Analog sense points for measuring circuit die

Low-dispersion component in an electronic chip

Metal-free frame design for silicon bridges for semiconductor packages

Display device

Package structure and method of manufacturing the same

Package structure with through via extending through redistribution...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURES WITH COVER LAYERS

DESIGN FOR ASYMMETRIC PADS STRUCTURE AND TEST ELEMENT GROUP MODULE

HIGH BANDWIDTH MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF

MEMORY DEVICE INCLUDING A PLURALITY OF PADS AND METHOD OF DETECTING...

SYSTEM AND METHOD FOR MEASURING DEVICE INSIDE THROUGH-SILICON VIA S...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE

SYSTEMS AND METHODS OF TESTING MEMORY DEVICES

SEMICONDUCTOR DEVICE AND INVERTER DEVICE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING ELECTRONIC APPARATUS

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

Four-Terminal Resistance Testing Structure

CONTACTOR FOR MULTI DEVICE SOCKETS AND RELATED

METHODS AND SYSTEMS FOR MEASURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF TESTING THE SAME

TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES

CIRCUIT PROBING PAD DESIGN IN SCRIBE LINE STRUCTURE AND METHOD FOR...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND LEAD FRAME

Semiconductor Package Including Test Pad and Bonding Pad Structure...

CIRCUIT PROBING PAD DESIGN IN SCRIBE LINE STRUCTURE AND METHOD FOR...

THIN FILM PEELING TEST STRUCTURE AND THIN FILM PEELING TEST METHOD...

PACKAGE STRUCTURE

INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

SEMICONDUCTOR DEVICE WITH DUAL DAMASCENE AND DUMMY PADS