against alpha rays

Industry

CPC
H01L23/556

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/556against alpha rays

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with oxide-nitride stack
- Patent number 11,935,839
- Issue date Mar 19, 2024
- Icemos Technology Corporation
- Kiraneswar Muthuseenu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with oxide-nitride stack
- Patent number 11,362,042
- Issue date Jun 14, 2022
- Icemos Technology Corporation
- Kiraneswar Muthuseenu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device and current sensing circui...
- Patent number 11,031,349
- Issue date Jun 8, 2021
- Semiconductor Components Industries, LLC
- Johan Camiel Julia Janssens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground shield plane for ball grid array (BGA) package
- Patent number 10,971,455
- Issue date Apr 6, 2021
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,964,632
- Issue date Mar 30, 2021
- TOSHIBA MEMORY CORPORATION
- Takeshi Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with radiation shield
- Patent number 10,916,508
- Issue date Feb 9, 2021
- TOSHIBA MEMORY CORPORATION
- Yasuo Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ionizing radiation blocking in IC chip to reduce soft errors
- Patent number 10,784,200
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simulation methods and systems for predicting SER
- Patent number 10,783,306
- Issue date Sep 22, 2020
- Samsung Electronics Co., Ltd.
- Udit Monga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Radiation-tolerant unit MOSFET hardened against single event effect...
- Patent number 10,756,028
- Issue date Aug 25, 2020
- Korea Advanced Institute of Science and Technology
- Hee Chul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing low alpha-ray emitting bismuth, and low alpha-r...
- Patent number 10,711,358
- Issue date Jul 14, 2020
- JX Nippon Mining & Metals Corporation
- Yu Hosokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,658,305
- Issue date May 19, 2020
- TOSHIBA MEMORY CORPORATION
- Motoshi Seto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming FinFET device structure
- Patent number 10,615,260
- Issue date Apr 7, 2020
- Silicon Space Technology Corporation
- Steven Howard Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designing and fabricating semiconductor devices with specific terre...
- Patent number 10,403,711
- Issue date Sep 3, 2019
- General Electric Company
- Alexander Viktorovich Bolotnikov
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Radiation-hardened latch circuit
- Patent number 10,348,302
- Issue date Jul 9, 2019
- BAE Systems Information and Electronic Systems Integration Inc.
- Jason F. Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Radiation-hard electronic device and method for protecting an elect...
- Patent number 10,319,686
- Issue date Jun 11, 2019
- STMicroelectronics S.r.l.
- Ignazio Bruno Mirabella
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
System and method for power electronics with a high and low tempera...
- Patent number 10,276,512
- Issue date Apr 30, 2019
- General Electric Company
- Hendrik Pieter Jacobus de Bock
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Radiation hardened microelectronic chip packaging technology
- Patent number 10,262,951
- Issue date Apr 16, 2019
- National Institute of Aerospace Associates
- Jin Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,164,058
- Issue date Dec 25, 2018
- Fuji Electric Co., Ltd.
- Shuhei Tatemichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu core ball
- Patent number 10,147,695
- Issue date Dec 4, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and electronic component
- Patent number 10,109,609
- Issue date Oct 23, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device structure and method for forming same
- Patent number 10,038,058
- Issue date Jul 31, 2018
- Silicon Space Technology Corporation
- Steven Howard Voldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,842,912
- Issue date Dec 12, 2017
- Fuji Electric Co., Ltd.
- Shuhei Tatemichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure for electronic integrated circuit manufacturing
- Patent number 9,799,653
- Issue date Oct 24, 2017
- Aeroflex Colorado Springs Inc.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tiered tamper-resistant assembly system and method
- Patent number 9,756,273
- Issue date Sep 5, 2017
- Sensors Unlimited, Inc.
- John T. Foster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packaged semiconductor chips with array
- Patent number 9,548,254
- Issue date Jan 17, 2017
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit having capacitor coupled with memory element
- Patent number 9,484,067
- Issue date Nov 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hao Shaw
- G11 - INFORMATION STORAGE
Information Patent Grant
Formation of alpha particle shields in chip packaging
- Patent number 9,299,665
- Issue date Mar 29, 2016
- GLOBALFOUNDRIES Inc.
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to ensure correct operation of an integrated c...
- Patent number 9,223,037
- Issue date Dec 29, 2015
- GLOBALFOUNDRIES Inc.
- Ethan H. Cannon
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE ALPHA PARTICLE SHIELD FOR SEMICONDUCTOR PACKAGES
- Publication number 20240347478
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Chen-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FORMING RADIATION HARDENED CIRCUITRY
- Publication number 20230275585
- Publication date Aug 31, 2023
- Cerium Laboratories LLC
- CLAYTON FULLWOOD
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor Device with Oxide-Nitride Stack
- Publication number 20220293531
- Publication date Sep 15, 2022
- Icemos Technology Corporation
- Kiraneswar MUTHUSEENU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200303290
- Publication date Sep 24, 2020
- Toshiba Memory Corporation
- Takeshi FUJIMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY AND SEMICONDUCTOR MEMORY MANUFACTURING METHOD
- Publication number 20200091087
- Publication date Mar 19, 2020
- Toshiba Memory Corporation
- Shinji YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200075505
- Publication date Mar 5, 2020
- Toshiba Memory Corporation
- Motoshi SETO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190287922
- Publication date Sep 19, 2019
- Toshiba Memory Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION-TOLERANT UNIT MOSFET HARDENED AGAINST SINGLE EVENT EFFECT...
- Publication number 20190287923
- Publication date Sep 19, 2019
- Korea Advanced Institute of Science and Technology
- Hee Chul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR POWER ELECTRONICS WITH A HIGH AND LOW TEMPERA...
- Publication number 20180348831
- Publication date Dec 6, 2018
- GENERAL ELECTRIC COMPANY
- Hendrik Pieter Jacobus de Bock
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINFET DEVICE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20170323942
- Publication date Nov 9, 2017
- Silicon Space Technology Corporation, d.b.a. Vorago Technologies, Inc.
- STEVEN HOWARD VOLDMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNING AND FABRICATING SEMICONDUCTOR DEVICES WITH SPECIFIC TERRE...
- Publication number 20170243935
- Publication date Aug 24, 2017
- GENERAL ELECTRIC COMPANY
- Alexander Viktorovich Bolotnikov
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RADIATION-HARD ELECTRONIC DEVICE AND METHOD FOR PROTECTING AN ELECT...
- Publication number 20170141048
- Publication date May 18, 2017
- STMicroelectronics S.r.l.
- Ignazio Bruno Mirabella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170054000
- Publication date Feb 23, 2017
- Fuji Electric Co., Ltd.
- Shuhei TATEMICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20160300837
- Publication date Oct 13, 2016
- AEROFLEX COLORADO SPRINGS INC.
- David B. Kerwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY
- Publication number 20150380336
- Publication date Dec 31, 2015
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection Structure and Electronic Component
- Publication number 20150200178
- Publication date Jul 16, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF ALPHA PARTICLE SHIELDS IN CHIP PACKAGING
- Publication number 20150171023
- Publication date Jun 18, 2015
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION HARDENED MICROELECTRONIC CHIP PACKAGING TECHNOLOGY
- Publication number 20150069588
- Publication date Mar 12, 2015
- National Institute of Aerospace Associates
- Jin Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT HAVING CAPACITOR COUPLED WITH MEMORY ELEMENT
- Publication number 20140339618
- Publication date Nov 20, 2014
- Ching-Hao SHAW
- G11 - INFORMATION STORAGE
Information Patent Application
Thin-Film Transistor Active Device
- Publication number 20140197404
- Publication date Jul 17, 2014
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Chenglung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY
- Publication number 20140151881
- Publication date Jun 5, 2014
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20140138852
- Publication date May 22, 2014
- J-DEVICES CORPORATION
- Toru SUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BACKSIDE DOPING FOR THERMAL NEUTRON SHIELDING
- Publication number 20140027887
- Publication date Jan 30, 2014
- Stephen J. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO ENSURE CORRECT OPERATION OF AN INTEGRATED C...
- Publication number 20140032135
- Publication date Jan 30, 2014
- International Business Machines Corporation
- ETHAN H. CANNON
- G01 - MEASURING TESTING
Information Patent Application
SOFT ERROR RESISTANT CIRCUITRY
- Publication number 20130306885
- Publication date Nov 21, 2013
- SPANSION LLC
- Richard C. Blish
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130234337
- Publication date Sep 12, 2013
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALPHA SHIELDING TECHNIQUES AND CONFIGURATIONS
- Publication number 20130143366
- Publication date Jun 6, 2013
- Nelson Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE RADIATION SOURCE
- Publication number 20130062740
- Publication date Mar 14, 2013
- International Business Machines Corporation
- Michael A. Gaynes
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR IMPROVING PROMPT DOSE RADIATION RESPONSE OF MIXED-SIGNAL...
- Publication number 20120306050
- Publication date Dec 6, 2012
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- John C. Rodgers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALPHA-PARTICLE EMITTER REMOVAL
- Publication number 20120298586
- Publication date Nov 29, 2012
- DOW GLOBAL TECHNOLOGIES LLC
- Matthew L. Grandbois
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

against alpha rays

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with oxide-nitride stack

Semiconductor device with oxide-nitride stack

Method of forming a semiconductor device and current sensing circui...

Ground shield plane for ball grid array (BGA) package

Semiconductor device

Semiconductor device package with radiation shield

Ionizing radiation blocking in IC chip to reduce soft errors

Simulation methods and systems for predicting SER

Radiation-tolerant unit MOSFET hardened against single event effect...

Method of producing low alpha-ray emitting bismuth, and low alpha-r...

Semiconductor device

Method for forming FinFET device structure

Designing and fabricating semiconductor devices with specific terre...

Radiation-hardened latch circuit

Cu core ball, solder paste, formed solder, Cu core column, and sold...

Radiation-hard electronic device and method for protecting an elect...

System and method for power electronics with a high and low tempera...

Radiation hardened microelectronic chip packaging technology

Semiconductor device and method of manufacturing semiconductor device

Method for producing metal ball, joining material, and metal ball

Cu core ball

Connection structure and electronic component

FinFET device structure and method for forming same

Semiconductor device and method of manufacturing semiconductor device

Wafer structure for electronic integrated circuit manufacturing

Multi-tiered tamper-resistant assembly system and method

Packaged semiconductor chips with array

Circuit having capacitor coupled with memory element

Formation of alpha particle shields in chip packaging

Structure and method to ensure correct operation of an integrated c...

Patents Applicationslast 30 patents

SUBSTRATE ALPHA PARTICLE SHIELD FOR SEMICONDUCTOR PACKAGES

SYSTEM AND METHOD FOR FORMING RADIATION HARDENED CIRCUITRY

Semiconductor Device with Oxide-Nitride Stack

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY AND SEMICONDUCTOR MEMORY MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

RADIATION-TOLERANT UNIT MOSFET HARDENED AGAINST SINGLE EVENT EFFECT...

SYSTEM AND METHOD FOR POWER ELECTRONICS WITH A HIGH AND LOW TEMPERA...

FINFET DEVICE STRUCTURE AND METHOD FOR FORMING SAME

DESIGNING AND FABRICATING SEMICONDUCTOR DEVICES WITH SPECIFIC TERRE...

RADIATION-HARD ELECTRONIC DEVICE AND METHOD FOR PROTECTING AN ELECT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING

PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY

Connection Structure and Electronic Component

FORMATION OF ALPHA PARTICLE SHIELDS IN CHIP PACKAGING

RADIATION HARDENED MICROELECTRONIC CHIP PACKAGING TECHNOLOGY

CIRCUIT HAVING CAPACITOR COUPLED WITH MEMORY ELEMENT

Thin-Film Transistor Active Device

PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

WAFER BACKSIDE DOPING FOR THERMAL NEUTRON SHIELDING

STRUCTURE AND METHOD TO ENSURE CORRECT OPERATION OF AN INTEGRATED C...

SOFT ERROR RESISTANT CIRCUITRY

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

ALPHA SHIELDING TECHNIQUES AND CONFIGURATIONS

TUNABLE RADIATION SOURCE

METHOD FOR IMPROVING PROMPT DOSE RADIATION RESPONSE OF MIXED-SIGNAL...

ALPHA-PARTICLE EMITTER REMOVAL