Air gaps

Industry

CPC
H01L21/764

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/764Air gaps

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Inductors with airgap electrical isolation
- Patent number 12,211,886
- Issue date Jan 28, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Prateek Kumar Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,207,470
- Issue date Jan 21, 2025
- Kioxia Corporation
- Shinya Arai
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory device and production method thereof
- Patent number 12,200,931
- Issue date Jan 14, 2025
- Kioxia Corporation
- Tadashi Iguchi
- G11 - INFORMATION STORAGE
Information Patent Grant
Laterally-diffused metal-oxide-semiconductor devices with an air gap
- Patent number 12,191,351
- Issue date Jan 7, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Bong Woong Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and film forming appar...
- Patent number 12,191,193
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Tatsuya Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device with capped air-gap spacer
- Patent number 12,191,373
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Sangkoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising an air chamber and method of man...
- Patent number 12,183,622
- Issue date Dec 31, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jingwen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having deep trench structure and method of man...
- Patent number 12,183,639
- Issue date Dec 31, 2024
- SK keyfoundry Inc.
- Yang Beom Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with air gap on gate structure and method for...
- Patent number 12,183,784
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tien-Lu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric capping structure overlying a conductive structure to in...
- Patent number 12,176,246
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect transistors with airgap spacers
- Patent number 12,176,405
- Issue date Dec 24, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Khee Yong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain feature separation structure
- Patent number 12,178,032
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chun Keng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 12,176,387
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with an air gap and method of forming the same
- Patent number 12,176,440
- Issue date Dec 24, 2024
- Winbond Electronics Corp.
- Shang-Rong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with air gap and method sealing the air gap
- Patent number 12,165,912
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor having airgap and method for manufactur...
- Patent number 12,165,925
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sai-Hooi Yeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having air gap structures integrated with i...
- Patent number 12,148,690
- Issue date Nov 19, 2024
- Tahoe Research, LTD.
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structures having conductive structures along pillars of...
- Patent number 12,142,680
- Issue date Nov 12, 2024
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the semiconductor...
- Patent number 12,137,563
- Issue date Nov 5, 2024
- SK hynix Inc.
- Kang Sik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having epitaxial structure
- Patent number 12,131,943
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sai-Hooi Yeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and memory
- Patent number 12,125,802
- Issue date Oct 22, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure incorporating air gap
- Patent number 12,125,848
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered insulating film stack
- Patent number 12,119,268
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chieh-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid isolation regions having upper and lower portions with seams
- Patent number 12,112,988
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor memory device
- Patent number 12,100,617
- Issue date Sep 24, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with air gaps between metal gates and method o...
- Patent number 12,100,625
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure and semiconductor...
- Patent number 12,100,670
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengmeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FETs and methods of forming FETs
- Patent number 12,094,761
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ru Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structures in transistor devices and methods of forming same
- Patent number 12,087,775
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Gang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method for air spacer layer and semiconductor structure
- Patent number 12,087,617
- Issue date Sep 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kang You
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250022955
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20250024680
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Kang Sik CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED INSULATING FILM STACK
- Publication number 20250006560
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FETS and Methods of Forming FETS
- Publication number 20250006549
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ru Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR BRIDGE PREPARATION METHOD, QUANTUM CHIP, AND QUANTUM COMPUTER
- Publication number 20240423103
- Publication date Dec 19, 2024
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Kunliang BU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240395599
- Publication date Nov 28, 2024
- DB HiTek Co., Ltd.
- Jong Won Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCORPORATING AIR GAP
- Publication number 20240395808
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ching WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING EPITAXIAL STRUCTURE
- Publication number 20240395604
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sai-Hooi YEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240395605
- Publication date Nov 28, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240387328
- Publication date Nov 21, 2024
- STMicroelectronics International N.V.
- Pascal Fornara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387237
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAPS BETWEEN METAL GATES AND METHOD O...
- Publication number 20240387281
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20240387621
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Structure with Reduced Leakage Current
- Publication number 20240379859
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL
- Publication number 20240379407
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices with Air Gaps and the Method Thereof
- Publication number 20240379813
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ko-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE FOR SEMICONDUCTOR STRUCTURES SUITABLE FOR A TRANS...
- Publication number 20240371669
- Publication date Nov 7, 2024
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Ralf LERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET DEVICES WITH EMBEDDED AIR GAPS AND THE FABRICATION THEREOF
- Publication number 20240371682
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING SAME
- Publication number 20240371875
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Gang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID ISOLATION REGIONS HAVING UPPER AND LOWER PORTIONS WITH SEAMS
- Publication number 20240363432
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE DEVICE AND RELATED METHODS
- Publication number 20240347627
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Lin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF REDUCING PARASITIC CAPACITANCE IN SEMICONDUTOR DEVICES
- Publication number 20240332084
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
- Publication number 20240321890
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Hsin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING PARASITIC CAPACITANCE IN FIELD-EFFECT TRANSISTORS
- Publication number 20240312832
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...
- Publication number 20240312876
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP IN INNER SPACERS AND METHODS OF FABRICATING THE SAME IN FIE...
- Publication number 20240313082
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Ning Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240306369
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...
- Publication number 20240304523
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR FRINGING CAPACITANCE CONTROL
- Publication number 20240304497
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Keng-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...
- Publication number 20240304522
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Inductors with airgap electrical isolation

Semiconductor device and method for manufacturing same

Semiconductor memory device and production method thereof

Laterally-diffused metal-oxide-semiconductor devices with an air gap

Method of manufacturing semiconductor device and film forming appar...

Method of forming a semiconductor device with capped air-gap spacer

Semiconductor structure comprising an air chamber and method of man...

Semiconductor device having deep trench structure and method of man...

Semiconductor device with air gap on gate structure and method for...

Dielectric capping structure overlying a conductive structure to in...

Field-effect transistors with airgap spacers

Source/drain feature separation structure

Trench capacitor profile to decrease substrate warpage

Semiconductor structure with an air gap and method of forming the same

Semiconductor structure with air gap and method sealing the air gap

Fin field effect transistor having airgap and method for manufactur...

Microelectronic devices having air gap structures integrated with i...

Transistor structures having conductive structures along pillars of...

Semiconductor device and manufacturing method of the semiconductor...

Semiconductor structure having epitaxial structure

Chip and memory

Semiconductor device structure incorporating air gap

Multi-layered insulating film stack

Hybrid isolation regions having upper and lower portions with seams

Method of manufacturing semiconductor memory device

Semiconductor device with air gaps between metal gates and method o...

Method for manufacturing semiconductor structure and semiconductor...

FETs and methods of forming FETs

Gate structures in transistor devices and methods of forming same

Formation method for air spacer layer and semiconductor structure

Patents Applicationslast 30 patents

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

MULTI-LAYERED INSULATING FILM STACK

FETS and Methods of Forming FETS

AIR BRIDGE PREPARATION METHOD, QUANTUM CHIP, AND QUANTUM COMPUTER

HIGH VOLTAGE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE STRUCTURE INCORPORATING AIR GAP

SEMICONDUCTOR STRUCTURE HAVING EPITAXIAL STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

FINFET DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE WITH AIR GAPS BETWEEN METAL GATES AND METHOD O...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Device Structure with Reduced Leakage Current

TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL

Semiconductor Devices with Air Gaps and the Method Thereof

CARRIER SUBSTRATE FOR SEMICONDUCTOR STRUCTURES SUITABLE FOR A TRANS...

FINFET DEVICES WITH EMBEDDED AIR GAPS AND THE FABRICATION THEREOF

GATE STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING SAME

HYBRID ISOLATION REGIONS HAVING UPPER AND LOWER PORTIONS WITH SEAMS

MULTI-GATE DEVICE AND RELATED METHODS

METHODS OF REDUCING PARASITIC CAPACITANCE IN SEMICONDUTOR DEVICES

FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME

REDUCING PARASITIC CAPACITANCE IN FIELD-EFFECT TRANSISTORS

Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...

AIR GAP IN INNER SPACERS AND METHODS OF FABRICATING THE SAME IN FIE...

SEMICONDUCTOR DEVICE

CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...

STRUCTURE FOR FRINGING CAPACITANCE CONTROL

CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...