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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8012Aligning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 12,224,262
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,813
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for manufacturing stacked substrate
- Patent number 12,107,068
- Issue date Oct 1, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor struct...
- Patent number 12,100,677
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating hybrid bonded structure
- Patent number 12,021,103
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 11,990,444
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding apparatus and method
- Patent number 11,955,454
- Issue date Apr 9, 2024
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,837,579
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for direct bonding in semiconductor die manufac...
- Patent number 11,817,420
- Issue date Nov 14, 2023
- Micron Technology, Inc.
- Chia Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for bonding semiconductor devices
- Patent number 11,756,921
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,705,426
- Issue date Jul 18, 2023
- Semes Co., Ltd.
- Gil Yong Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with through substrate via (TSV)
- Patent number 11,658,172
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical overlay measurement methods and structures for wafer-to-...
- Patent number 11,621,202
- Issue date Apr 4, 2023
- Western Digital Technologies, Inc.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,488,917
- Issue date Nov 1, 2022
- GHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device including first pads on a first chip t...
- Patent number 11,482,514
- Issue date Oct 25, 2022
- Kioxia Corporation
- Hiromitsu Harashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded structure
- Patent number 11,437,422
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interconnect for laser bonding using nanoporous metal tips
- Patent number 11,424,214
- Issue date Aug 23, 2022
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing an LED-based emissive display device
- Patent number 11,404,401
- Issue date Aug 2, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Ivan-Christophe Robin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for arranging two substrates
- Patent number 11,121,091
- Issue date Sep 14, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 11,088,268
- Issue date Aug 10, 2021
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and imaging device
- Patent number 11,069,735
- Issue date Jul 20, 2021
- Sony Corporation
- Kengo Kotoo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connectivity detection for wafer-to-wafer alignment and bonding
- Patent number 11,031,308
- Issue date Jun 8, 2021
- SanDisk Technologies LLC
- Seungpil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-induced selective heating for microLED placement and bonding
- Patent number 10,998,286
- Issue date May 4, 2021
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 10,998,293
- Issue date May 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Location displacement detection method, location displacement detec...
- Patent number 10,991,666
- Issue date Apr 27, 2021
- SHARP KABUSHIKI KAISHA
- Yuta Ikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro device
- Patent number 10,964,662
- Issue date Mar 30, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Three-dimensional integrated circuit and method of manufacturing th...
- Patent number 10,790,248
- Issue date Sep 29, 2020
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face three-dimensional integrated circuit of simplified str...
- Patent number 10,777,537
- Issue date Sep 15, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Didier Lattard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND DEVICE FOR MANUFACTURING STACKED SUBSTRATE
- Publication number 20240404987
- Publication date Dec 5, 2024
- Nikon Corporation
- Hajime MITSUISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROENTGEN INTEGRATED METROLOGY FOR HYBRID BONDING PROCESS CONTROL IN...
- Publication number 20240387448
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Francisco MACHUCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING
- Publication number 20240347501
- Publication date Oct 17, 2024
- Haris Khan Niazi
- G05 - CONTROLLING REGULATING
Information Patent Application
COMPENSATION METHOD FOR WAFER BONDING
- Publication number 20240332246
- Publication date Oct 3, 2024
- Macronix International Co., Ltd.
- Tien Chu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20240313026
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20240312820
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Yoshio MIZUTA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240266317
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS AND METHOD
- Publication number 20240194637
- Publication date Jun 13, 2024
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CIRCUITRY FORMED FROM REMOTE RESERVOIRS
- Publication number 20240071989
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...
- Publication number 20240063172
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Chia Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20230387071
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS
- Publication number 20230352437
- Publication date Nov 2, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME
- Publication number 20230343743
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCT...
- Publication number 20230145031
- Publication date May 11, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PLACING IN PACKAGING
- Publication number 20230137490
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS AND METHOD
- Publication number 20230131499
- Publication date Apr 27, 2023
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
- Publication number 20230030272
- Publication date Feb 2, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK AND PLACE METHOD AND APPARATUS THEREOF
- Publication number 20230025157
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...
- Publication number 20230020037
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Chia Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005866
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20220359601
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20220302078
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-...
- Publication number 20220285233
- Publication date Sep 8, 2022
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Liang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220045030
- Publication date Feb 10, 2022
- SEMES CO., LTD.
- Gil Yong MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20210343862
- Publication date Nov 4, 2021
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20210257340
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20210082896
- Publication date Mar 18, 2021
- KIOXIA Corporation
- Hiromitsu HARASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20210057373
- Publication date Feb 25, 2021
- SAMSUNG ELECTRONICS CO,. LTD.
- TAEYEONG KIM
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate bonding apparatus and method of manufacturing semiconduct...

Semiconductor structure and manufacturing method thereof

Method and device for manufacturing stacked substrate

Semiconductor structure and method for forming semiconductor struct...

Methods and devices for fabricating and assembling printable semico...

Method for fabricating hybrid bonded structure

Substrate bonding apparatus and method of manufacturing semiconduct...

Wafer bonding apparatus and method

Semiconductor structure

Systems and methods for direct bonding in semiconductor die manufac...

System and method for bonding semiconductor devices

Bonding apparatus and bonding method

Hybrid bonding with through substrate via (TSV)

Electrical overlay measurement methods and structures for wafer-to-...

Semiconductor structure and manufacturing method thereof

Semiconductor storage device including first pads on a first chip t...

Hybrid bonded structure

Hybrid interconnect for laser bonding using nanoporous metal tips

Process for manufacturing an LED-based emissive display device

Method for arranging two substrates

Methods and devices for fabricating and assembling printable semico...

Semiconductor device and imaging device

Connectivity detection for wafer-to-wafer alignment and bonding

Laser-induced selective heating for microLED placement and bonding

Method of fabricating semiconductor structure

Location displacement detection method, location displacement detec...

Method of transferring micro device

Bonding system

Three-dimensional integrated circuit and method of manufacturing th...

Face-to-face three-dimensional integrated circuit of simplified str...

Patents Applicationslast 30 patents

METHOD AND DEVICE FOR MANUFACTURING STACKED SUBSTRATE

System and Method for Bonding Semiconductor Devices

ROENTGEN INTEGRATED METROLOGY FOR HYBRID BONDING PROCESS CONTROL IN...

METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING

COMPENSATION METHOD FOR WAFER BONDING

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

WAFER BONDING APPARATUS AND METHOD

SEMICONDUCTOR DEVICE CIRCUITRY FORMED FROM REMOTE RESERVOIRS

SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...

System and Method for Bonding Semiconductor Devices

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS

FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCT...

SEMICONDUCTOR PLACING IN PACKAGING

WAFER BONDING APPARATUS AND METHOD

BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE

PICK AND PLACE METHOD AND APPARATUS THEREOF

SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

System and Method for Bonding Semiconductor Devices

ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-...

BONDING APPARATUS AND BONDING METHOD

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STORAGE DEVICE

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...