Alignment aids

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CPC
H01L2224/10135

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/10135Alignment aids

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 12,027,479
- Issue date Jul 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 11,894,328
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over bonding pad
- Patent number 11,605,606
- Issue date Mar 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,569,190
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated mechanical aids for high accuracy alignable-electrical c...
- Patent number 11,562,984
- Issue date Jan 24, 2023
- HRL Laboratories, LLC
- Peter Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over bonding pad
- Patent number 11,521,945
- Issue date Dec 6, 2022
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) with support structures
- Patent number 11,424,194
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including metal holder and method of manufactu...
- Patent number 11,322,468
- Issue date May 3, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning bumps in fan-out packaging process
- Patent number 11,217,555
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,867,952
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 10,692,832
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) with support structures
- Patent number 10,510,684
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection structures
- Patent number 10,468,367
- Issue date Nov 5, 2019
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip alignment utilizing superomniphobic surface treatment of silic...
- Patent number 10,396,050
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress vias
- Patent number 10,283,449
- Issue date May 7, 2019
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming dummy pillars between se...
- Patent number 10,096,540
- Issue date Oct 9, 2018
- STATS ChipPAC Pte. Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,024,907
- Issue date Jul 17, 2018
- TOSHIBA MEMORY CORPORATION
- Shinya Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,008,467
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 9,893,036
- Issue date Feb 13, 2018
- TOSHIBA MEMORY CORPORATION
- Koji Ogiso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection technology
- Patent number 9,848,490
- Issue date Dec 19, 2017
- Intel Corporation
- Chuan Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for aligning micro-electronic components
- Patent number 9,799,632
- Issue date Oct 24, 2017
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, solid-state imaging device, and imaging device
- Patent number 9,748,178
- Issue date Aug 29, 2017
- Olympus Corporation
- Mitsuhiro Tsukimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress vias
- Patent number 9,659,858
- Issue date May 23, 2017
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for aligning micro-electronic components
- Patent number 9,601,459
- Issue date Mar 21, 2017
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic contacts
- Patent number 9,601,468
- Issue date Mar 21, 2017
- Intel Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 9,570,414
- Issue date Feb 14, 2017
- Kabushiki Kaisha Toshiba
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking of multiple dies for forming three dimensional integrated...
- Patent number 9,570,421
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having magnetic alignment marks and underfill...
- Patent number 9,548,290
- Issue date Jan 17, 2017
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection structures
- Patent number 9,530,747
- Issue date Dec 27, 2016
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
- Publication number 20240153908
- Publication date May 9, 2024
- HKC Corporation Limited
- YANG PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-GUIDED PLACEMENT OF MEMORY DEVICE COMPONENT PACKAGES
- Publication number 20230156921
- Publication date May 18, 2023
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230078429
- Publication date Mar 16, 2023
- Kabushiki Kaisha Toshiba
- Yoshiharu TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING
- Publication number 20230058638
- Publication date Feb 23, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly Packaging Method, Semiconductor Assembly and...
- Publication number 20220216176
- Publication date Jul 7, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aligning Bumps in Fan-Out Packaging Process
- Publication number 20220130794
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210335742
- Publication date Oct 28, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210091031
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200286846
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNING BUMPS IN FAN-OUT PACKAGING PROCESS
- Publication number 20190103375
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20180308817
- Publication date Oct 25, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
- Publication number 20180151529
- Publication date May 31, 2018
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ALIGNMENT UTILIZING SUPEROMNIPHOBIC SURFACE TREATMENT OF SILIC...
- Publication number 20180082969
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Eric J. CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS VIAS
- Publication number 20170250132
- Publication date Aug 31, 2017
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Aligning Micro-Electronic Components
- Publication number 20170186733
- Publication date Jun 29, 2017
- IMEC vzw
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20150123270
- Publication date May 7, 2015
- Kabushiki Kaisha Toshiba
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND...
- Publication number 20140361427
- Publication date Dec 11, 2014
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140357025
- Publication date Dec 4, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS VIAS
- Publication number 20140332981
- Publication date Nov 13, 2014
- Ilyas MOHAMMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140252604
- Publication date Sep 11, 2014
- TOHOKU-MICROTEC CO., LTD
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY
- Publication number 20140240943
- Publication date Aug 28, 2014
- Chuan Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140206144
- Publication date Jul 24, 2014
- KABUSHIKI KAISHA TOSHIBA
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY
- Publication number 20140144690
- Publication date May 29, 2014
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Gabriel Pares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In System Reflow of Low Temperature Eutectic Bond Balls
- Publication number 20140144971
- Publication date May 29, 2014
- Research Triangle Institute
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANFAC...
- Publication number 20140103522
- Publication date Apr 17, 2014
- OLYMPUS CORPORATION
- Yoshiaki Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Self-Assembly of Substrates and Devices Obtained Thereof
- Publication number 20140054771
- Publication date Feb 27, 2014
- IMEC
- Philippe Soussan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20130256889
- Publication date Oct 3, 2013
- OLYMPUS CORPORATION
- Yoshiaki Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
- Publication number 20130256895
- Publication date Oct 3, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY
- Publication number 20130206820
- Publication date Aug 15, 2013
- Chuan Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND PRODUCTION METHOD
- Publication number 20130176686
- Publication date Jul 11, 2013
- EPCOS AG
- Kim Choong Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Alignment aids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with edge-protecting spacers over bonding pad

Semiconductor device with edge-protecting spacers over bonding pad

Semiconductor device with spacer over bonding pad

Semiconductor structure and manufacturing method thereof

Integrated mechanical aids for high accuracy alignable-electrical c...

Semiconductor device with spacer over bonding pad

Three dimensional integrated circuit (3DIC) with support structures

Semiconductor device including metal holder and method of manufactu...

Aligning bumps in fan-out packaging process

Mechanisms for forming hybrid bonding structures with elongated bumps

Semiconductor structure and manufacturing method thereof

Manufacturing method of semiconductor structure

Three dimensional integrated circuit (3DIC) with support structures

Solder in cavity interconnection structures

Chip alignment utilizing superomniphobic surface treatment of silic...

Low stress vias

Semiconductor device and method of forming dummy pillars between se...

Semiconductor device and manufacturing method of semiconductor device

Semiconductor structure and manufacturing method thereof

Semiconductor device and manufacturing method of semiconductor device

Solder in cavity interconnection technology

Method for aligning micro-electronic components

Semiconductor device, solid-state imaging device, and imaging device

Low-stress vias

Method for aligning micro-electronic components

Magnetic contacts

Semiconductor device and method of manufacturing the semiconductor...

Stacking of multiple dies for forming three dimensional integrated...

Semiconductor device having magnetic alignment marks and underfill...

Solder in cavity interconnection structures

Patents Applicationslast 30 patents

DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...

SELF-GUIDED PLACEMENT OF MEMORY DEVICE COMPONENT PACKAGES

SEMICONDUCTOR DEVICE

SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING

Semiconductor Assembly Packaging Method, Semiconductor Assembly and...

Aligning Bumps in Fan-Out Packaging Process

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ALIGNING BUMPS IN FAN-OUT PACKAGING PROCESS

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

SOLDER IN CAVITY INTERCONNECTION STRUCTURES

CHIP ALIGNMENT UTILIZING SUPEROMNIPHOBIC SURFACE TREATMENT OF SILIC...

LOW STRESS VIAS

Method for Aligning Micro-Electronic Components

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

LOW-STRESS VIAS

STACKED DEVICE AND METHOD OF MANUFACTURING THE SAME

SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY

In System Reflow of Low Temperature Eutectic Bond Balls

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANFAC...

Method for Self-Assembly of Substrates and Devices Obtained Thereof

SUBSTRATE AND SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT

SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY

MODULE AND PRODUCTION METHOD