Aluminium [Al] as principal constituent

Industry

CPC
H01L2224/13324

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13324Aluminium [Al] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Forming of bump structure
- Patent number 11,329,018
- Issue date May 10, 2022
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,966,322
- Issue date May 8, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hisao Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component built-in board and method of manufacturing the same, and...
- Patent number 9,591,767
- Issue date Mar 7, 2017
- Fujikura Ltd.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-mounted structure, IC card and COF package
- Patent number 9,516,749
- Issue date Dec 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshiyuki Wada
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
- Patent number 9,240,331
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal nanoink and process for producing the metal nanoink, and die...
- Patent number 8,328,928
- Issue date Dec 11, 2012
- Shinkawa Ltd.
- Toru Maeda
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System for forming contacts on a semiconductor component by alignin...
- Patent number 6,283,358
- Issue date Sep 4, 2001
- Micron Technology, Inc.
- Michael Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for forming contacts on a semiconductor component...
- Patent number 6,186,392
- Issue date Feb 13, 2001
- Micron Technology, Inc.
- Michael Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FORMING OF BUMP STRUCTURE
- Publication number 20210125950
- Publication date Apr 29, 2021
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...
- Publication number 20140328032
- Publication date Nov 6, 2014
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20130001280
- Publication date Jan 3, 2013
- SHINKAWA LTD.
- Toru MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20110114708
- Publication date May 19, 2011
- SHINKAWAL LTD
- Toru Maeda
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Optical display package and the method thereof
- Publication number 20070241435
- Publication date Oct 18, 2007
- Wintek Corporation
- Chih-Yuan Wang
- G02 - OPTICS

Aluminium [Al] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sintering materials and attachment methods using same

Forming of bump structure

Conductive connecting member and manufacturing method of same

Method for producing metal ball, joining material, and metal ball

Semiconductor device

Methods for forming pillar bumps on semiconductor wafers

Component built-in board and method of manufacturing the same, and...

Electronic component-mounted structure, IC card and COF package

Semiconductor device and method of making bumpless flipchip interco...

Metal nanoink and process for producing the metal nanoink, and die...

System for forming contacts on a semiconductor component by alignin...

Method and system for forming contacts on a semiconductor component...

Patents Applicationslast 30 patents

FORMING OF BUMP STRUCTURE

CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

Optical display package and the method thereof