Aluminium nitride [AlN]

Industry

CPC
H01L2924/10323

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10323Aluminium nitride [AlN]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Reusable wide bandgap semiconductor substrate
- Patent number 11,710,662
- Issue date Jul 25, 2023
- United Silicon Carbide, Inc.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor substrate
- Patent number 11,201,217
- Issue date Dec 14, 2021
- COORSTEK KK
- Kenichi Eriguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies and cooling structures having metalized exte...
- Patent number 11,121,060
- Issue date Sep 14, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered composite bonding materials and power electronics ass...
- Patent number 10,886,251
- Issue date Jan 5, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reusable wide bandgap semiconductor substrate
- Patent number 10,825,733
- Issue date Nov 3, 2020
- United Silicon Carbide, Inc.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies and cooling structures having metalized exte...
- Patent number 10,615,100
- Issue date Apr 7, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancement-mode III-nitride devices
- Patent number 10,535,763
- Issue date Jan 14, 2020
- Transphorm Inc.
- Rakesh K. Lal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multilayer composite bonding materials and power electronics assemb...
- Patent number 10,381,223
- Issue date Aug 13, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assemblies having a semiconductor cooling chip an...
- Patent number 10,224,265
- Issue date Mar 5, 2019
- North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor with indium nitride layer
- Patent number 10,079,296
- Issue date Sep 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancement-mode III-nitride devices
- Patent number 10,043,898
- Issue date Aug 7, 2018
- Transphorm Inc.
- Rakesh K. Lal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating diamond-semiconductor composite substrates
- Patent number 10,043,700
- Issue date Aug 7, 2018
- RFHIC CORPORATION
- Daniel Francis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assemblies having a semiconductor cooling chip an...
- Patent number 10,032,694
- Issue date Jul 24, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assemblies having a wide bandgap semiconductor de...
- Patent number 10,020,243
- Issue date Jul 10, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,673,109
- Issue date Jun 6, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package for III-nitride transistor stacked with diode
- Patent number 9,530,774
- Issue date Dec 27, 2016
- Infineon Technologies Americas Corp.
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive clips
- Patent number 9,520,341
- Issue date Dec 13, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chromium/titanium/aluminum-based semiconductor device contact fabri...
- Patent number 9,514,947
- Issue date Dec 6, 2016
- Sensor Electronic Technology, Inc.
- Remigijus Gaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor with indium nitride layer
- Patent number 9,368,610
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride device and FET in a package
- Patent number 9,312,245
- Issue date Apr 12, 2016
- Infineon Technologies Americas Corp.
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,269,655
- Issue date Feb 23, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a chromium/titanium/aluminum-based semicondu...
- Patent number 9,064,845
- Issue date Jun 23, 2015
- Sensor Electronic Technology, Inc.
- Remigijus Gaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride transistor stacked with diode in a package
- Patent number 8,963,338
- Issue date Feb 24, 2015
- International Rectifier Corporation
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride transistor stacked with FET in a package
- Patent number 8,847,408
- Issue date Sep 30, 2014
- International Rectifier Corporation
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package with conductive clip and flip chip...
- Patent number 8,749,034
- Issue date Jun 10, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package with multiple conductive clips
- Patent number 8,664,754
- Issue date Mar 4, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method
- Patent number 8,641,859
- Issue date Feb 4, 2014
- Thin Materials AG
- Franz Richter
- B32 - LAYERED PRODUCTS
Information Patent Grant
Power semiconductor device module
- Patent number 8,569,890
- Issue date Oct 29, 2013
- Mitsubishi Electric Corporation
- Kazuhiro Morishita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REUSABLE WIDE BANDGAP SEMICONDUCTOR SUBSTRATE
- Publication number 20210005517
- Publication date Jan 7, 2021
- UNITED SILICON CARBIDE, INC.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ASSEMBLIES AND COOLING STRUCTURES HAVING METALIZED EXTE...
- Publication number 20200194342
- Publication date Jun 18, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REUSABLE WIDE BANDGAP SEMICONDUCTOR SUBSTRATE
- Publication number 20200135565
- Publication date Apr 30, 2020
- UNITED SILICON CARBIDE, INC.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER COMPOSITE BONDING MATERIALS AND POWER ELECTRONICS ASSEMB...
- Publication number 20190164760
- Publication date May 30, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION
- Publication number 20180366417
- Publication date Dec 20, 2018
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCEMENT-MODE III-NITRIDE DEVICES
- Publication number 20180315843
- Publication date Nov 1, 2018
- TRANSPHORM INC.
- Rakesh K. Lal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronics Assemblies and Cooling Structures Having Metalized Exte...
- Publication number 20180166359
- Publication date Jun 14, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DIAMOND-SEMICONDUCTOR COMPOSITE SUBSTRATES
- Publication number 20180151404
- Publication date May 31, 2018
- RFHIC Corporation
- Daniel FRANCIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING A SEMICONDUCTOR COOLING CHIP AN...
- Publication number 20170263532
- Publication date Sep 14, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Fabricating a Semiconductor Package with Conductive Carr...
- Publication number 20150348887
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Heat Spreader
- Publication number 20150348888
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...
- Publication number 20150200265
- Publication date Jul 16, 2015
- Sumitomo Electric Industries, Ltd.
- Tetsuya Kumano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Clips
- Publication number 20150194369
- Publication date Jul 9, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE OF SEMICONDUCTOR AND METHOD FOR FORMING THE SAME
- Publication number 20150171052
- Publication date Jun 18, 2015
- CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS BUREAU, M.N.D.
- Yang-Kuao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chromium/Titanium/Aluminum-based Semiconductor Device Contact
- Publication number 20140308766
- Publication date Oct 16, 2014
- SENSOR ELECTRONIC TECHNOLOGY, INC.
- Remigijus Gaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Multiple Conductive Clips
- Publication number 20140175630
- Publication date Jun 26, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC SOLDER BARRIER FOR SEMICONDUCTOR DEVICES
- Publication number 20140175664
- Publication date Jun 26, 2014
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Carrier Integrated Heat Spreader
- Publication number 20140110796
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE MODULE
- Publication number 20130249100
- Publication date Sep 26, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Kazuhiro MORISHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-Nitride Transistor Stacked with Diode in a Package
- Publication number 20120223322
- Publication date Sep 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-Nitride Transistor Stacked with FET in a Package
- Publication number 20120223321
- Publication date Sep 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Heny Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clip
- Publication number 20120168922
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clip on Multiple T...
- Publication number 20120168923
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clips and Flip Chi...
- Publication number 20120168925
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clip and Flip Chip...
- Publication number 20120168926
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Multiple Conductive Clips
- Publication number 20120168924
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20110272092
- Publication date Nov 10, 2011
- THIN MATERIALS AG
- Franz Richter
- B32 - LAYERED PRODUCTS

Aluminium nitride [AlN]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reusable wide bandgap semiconductor substrate

Nitride semiconductor substrate

Electronics assemblies and cooling structures having metalized exte...

Multi-layered composite bonding materials and power electronics ass...

Reusable wide bandgap semiconductor substrate

Electronics assemblies and cooling structures having metalized exte...

Enhancement-mode III-nitride devices

Method for applying a bonding layer

Multilayer composite bonding materials and power electronics assemb...

Power electronics assemblies having a semiconductor cooling chip an...

High electron mobility transistor with indium nitride layer

Enhancement-mode III-nitride devices

Method of fabricating diamond-semiconductor composite substrates

Power electronics assemblies having a semiconductor cooling chip an...

Power electronics assemblies having a wide bandgap semiconductor de...

Method for fabricating a semiconductor package with conductive carr...

Method for applying a bonding layer

Semiconductor package for III-nitride transistor stacked with diode

Semiconductor package with conductive clips

Chromium/titanium/aluminum-based semiconductor device contact fabri...

High electron mobility transistor with indium nitride layer

III-nitride device and FET in a package

Method for fabricating a semiconductor package with conductive carr...

Methods of fabricating a chromium/titanium/aluminum-based semicondu...

III-nitride transistor stacked with diode in a package

III-nitride transistor stacked with FET in a package

High power semiconductor package with conductive clip and flip chip...

High power semiconductor package with multiple conductive clips

Bonding method

Power semiconductor device module

Patents Applicationslast 30 patents

REUSABLE WIDE BANDGAP SEMICONDUCTOR SUBSTRATE

ELECTRONICS ASSEMBLIES AND COOLING STRUCTURES HAVING METALIZED EXTE...

REUSABLE WIDE BANDGAP SEMICONDUCTOR SUBSTRATE

MULTILAYER COMPOSITE BONDING MATERIALS AND POWER ELECTRONICS ASSEMB...

STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION

ENHANCEMENT-MODE III-NITRIDE DEVICES

Electronics Assemblies and Cooling Structures Having Metalized Exte...

METHOD OF FABRICATING DIAMOND-SEMICONDUCTOR COMPOSITE SUBSTRATES

POWER ELECTRONICS ASSEMBLIES HAVING A SEMICONDUCTOR COOLING CHIP AN...

METHOD FOR APPLYING A BONDING LAYER

Method for Fabricating a Semiconductor Package with Conductive Carr...

Semiconductor Package with Integrated Heat Spreader

SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...

Semiconductor Package with Conductive Clips

SUBSTRATE OF SEMICONDUCTOR AND METHOD FOR FORMING THE SAME

Chromium/Titanium/Aluminum-based Semiconductor Device Contact

Semiconductor Package with Multiple Conductive Clips

DIELECTRIC SOLDER BARRIER FOR SEMICONDUCTOR DEVICES

Semiconductor Package with Conductive Carrier Integrated Heat Spreader

POWER SEMICONDUCTOR DEVICE MODULE

III-Nitride Transistor Stacked with Diode in a Package

III-Nitride Transistor Stacked with FET in a Package

High Power Semiconductor Package with Conductive Clip

High Power Semiconductor Package with Conductive Clip on Multiple T...

High Power Semiconductor Package with Conductive Clips and Flip Chi...

High Power Semiconductor Package with Conductive Clip and Flip Chip...

High Power Semiconductor Package with Multiple Conductive Clips

BONDING METHOD