Ambient temperature

Industry

CPC
H01L2224/80099

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80099Ambient temperature

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing an LED-based emissive display device
- Patent number 11,404,401
- Issue date Aug 2, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Ivan-Christophe Robin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods for forming same
- Patent number 11,195,748
- Issue date Dec 7, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method with electron-stimulated desorption
- Patent number 11,081,463
- Issue date Aug 3, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface structures and methods for forming same
- Patent number 10,784,191
- Issue date Sep 22, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bonded semiconductor structures in 3D integratio...
- Patent number 8,617,925
- Issue date Dec 31, 2013
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Region divided substrate and semiconductor device
- Patent number 8,455,973
- Issue date Jun 4, 2013
- Denso Corporation
- Tetsuo Fujii
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF A THIN SEMICONDUCTOR DIE
- Publication number 20240170442
- Publication date May 23, 2024
- ASMPT Singapore Pte. Ltd.
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20230140107
- Publication date May 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME
- Publication number 20220130714
- Publication date Apr 28, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MANUFACTURING AN LED-BASED EMISSIVE DISPLAY DEVICE
- Publication number 20200303359
- Publication date Sep 24, 2020
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Ivan-Christophe Robin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD WITH ELECTRON-STIMULATED DESORPTION
- Publication number 20200152597
- Publication date May 14, 2020
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20190237419
- Publication date Aug 1, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES IN 3D INTEGRATIO...
- Publication number 20130037960
- Publication date Feb 14, 2013
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME
- Publication number 20120273940
- Publication date Nov 1, 2012
- Hynix Semiconductor Inc.
- Seung Hee JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REGION DIVIDED SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20110133295
- Publication date Jun 9, 2011
- DENSO CORPORATION
- Tetsuo Fujii
- G01 - MEASURING TESTING

Ambient temperature

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive barrier direct hybrid bonding

Process for manufacturing an LED-based emissive display device

Conductive barrier direct hybrid bonding

Interconnect structures and methods for forming same

Bonding method with electron-stimulated desorption

Interface structures and methods for forming same

Method for bonding substrates

Methods of forming bonded semiconductor structures in 3D integratio...

Region divided substrate and semiconductor device

Patents Applicationslast 30 patents

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

HYBRID BONDING OF A THIN SEMICONDUCTOR DIE

DIRECT BONDING METHODS AND STRUCTURES

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME

PROCESS FOR MANUFACTURING AN LED-BASED EMISSIVE DISPLAY DEVICE

BONDING METHOD WITH ELECTRON-STIMULATED DESORPTION

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES IN 3D INTEGRATIO...

SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME

REGION DIVIDED SUBSTRATE AND SEMICONDUCTOR DEVICE