Antimony [Sb] as principal constituent

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H01L2224/8142

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8142Antimony [Sb] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,790,206
- Issue date Oct 17, 2023
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Quad flat no-lead (QFN) package without leadframe and direct contac...
- Patent number 11,749,534
- Issue date Sep 5, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 11,670,618
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,288,564
- Issue date Mar 29, 2022
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,195,726
- Issue date Dec 7, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic...
- Patent number 11,179,748
- Issue date Nov 23, 2021
- Seiko Epson Corporation
- Koji Ohashi
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 11,043,463
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,991,649
- Issue date Apr 27, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
- Patent number RE48420
- Issue date Feb 2, 2021
- Texas Instruments Incorporated
- Bernhard P. Lange
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 10,797,024
- Issue date Oct 6, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated bump structures in package structure
- Patent number 10,784,223
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages with sintered interconnects formed out of pads
- Patent number 10,777,496
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 10,714,442
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOSFET with reduced resistance
- Patent number 10,707,327
- Issue date Jul 7, 2020
- Great Wall Semiconductor Corporation
- Patrick M. Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 10,636,761
- Issue date Apr 28, 2020
- Electronics and Telecommunications Reearch Institute
- Kwang-Seong Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System-in-package with double-sided molding
- Patent number 10,636,765
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra thin multi-die fac...
- Patent number 10,573,600
- Issue date Feb 25, 2020
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,553,451
- Issue date Feb 4, 2020
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic light-emitting diode display and method of manufacturing th...
- Patent number 10,529,790
- Issue date Jan 7, 2020
- Samsung Display Co., Ltd.
- Kyung Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection structures
- Patent number 10,468,367
- Issue date Nov 5, 2019
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071847
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230154877
- Publication date May 18, 2023
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230119406
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd
- Pilsung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230091632
- Publication date Mar 23, 2023
- Rohm Co., Ltd.
- Satoshi KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230068587
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Yae Jung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...
- Publication number 20220392869
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION PAD WITH ENHANCED SOLDERABILITY AND CORRESPON...
- Publication number 20220369455
- Publication date Nov 17, 2022
- TECHNISCHE HOCHSCHULE ASCHAFFENBURG
- Stefan Rung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20200343209
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200118916
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TSUNG-YUAN YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...
- Publication number 20190252338
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20190244920
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180308712
- Publication date Oct 25, 2018
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20180226373
- Publication date Aug 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180226312
- Publication date Aug 9, 2018
- Amkor Technology, Inc.
- Young Rae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
- Publication number 20180151529
- Publication date May 31, 2018
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
- Publication number 20180068937
- Publication date Mar 8, 2018
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180047691
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Hiroyuki UTSUNOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elongated Bump Structures in Package Structure
- Publication number 20180047690
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS
- Publication number 20170358547
- Publication date Dec 14, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...
- Publication number 20170309572
- Publication date Oct 26, 2017
- STATS ChipPAC Pte Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20150024555
- Publication date Jan 22, 2015
- FUJITSU LIMITED
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...
- Publication number 20140328032
- Publication date Nov 6, 2014
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device and Method of Forming Stress-Reduced Conductiv...
- Publication number 20140319695
- Publication date Oct 30, 2014
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20140306339
- Publication date Oct 16, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Hikaru Ohira
- H01 - BASIC ELECTRIC ELEMENTS

Antimony [Sb] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fingerprint sensor and manufacturing method thereof

Solderless interconnection structure and method of forming same

Semiconductor device and manufacturing method thereof

High-speed RFID tag assembly using impulse heating

Quad flat no-lead (QFN) package without leadframe and direct contac...

Semiconductor device and method of making wafer level chip scale pa...

System-in-package with double-sided molding

Multi-die package with bridge layer

Fingerprint sensor and manufacturing method thereof

High-speed RFID tag assembly using impulse heating

Semiconductor device and manufacturing method thereof

Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic...

Solderless interconnection structure and method of forming same

Interconnect structures and methods of forming same

Semiconductor device and method of manufacturing semiconductor device

Method for fabricating low resistance, low inductance interconnecti...

Protrusion bump pads for bond-on-trace processing

System-in-package with double-sided molding

Elongated bump structures in package structure

Semiconductor devices and semiconductor devices including a redistr...

Chip packages with sintered interconnects formed out of pads

Interconnect structures and methods of forming same

MOSFET with reduced resistance

Methods for making multi-die package with bridge layer

Method of fabricating a semiconductor package

System-in-package with double-sided molding

Semiconductor device and method of forming ultra thin multi-die fac...

Semiconductor device and manufacturing method thereof

Organic light-emitting diode display and method of manufacturing th...

Solder in cavity interconnection structures

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...

ELECTRICAL CONNECTION PAD WITH ENHANCED SOLDERABILITY AND CORRESPON...

Solderless Interconnection Structure and Method of Forming Same

Interconnect Structures and Methods of Forming Same

Methods for Making Multi-Die Package With Bridge Layer

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Solderless Interconnection Structure and Method of Forming Same

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...

Interconnect Structures and Methods of Forming Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Interconnect Structures and Methods of Forming Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SOLDER IN CAVITY INTERCONNECTION STRUCTURES

Semiconductor Device and Method of Forming a POP Device with Embedd...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Elongated Bump Structures in Package Structure

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS

Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...

Semiconductor Device and Method of Forming Stress-Reduced Conductiv...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE