Apparatus for connecting with build-up interconnects

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CPC
H01L2224/76

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/76Apparatus for connecting with build-up interconnects

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device and method for manufacturing display device
- Patent number 12,155,022
- Issue date Nov 26, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck design and method for wafer
- Patent number 12,148,651
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ink leveling device and method of manufacturing display device usin...
- Patent number 12,113,047
- Issue date Oct 8, 2024
- Samsung Display Co., Ltd.
- Jung Hyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure and semico...
- Patent number 12,100,686
- Issue date Sep 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Yun Di Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnection of circuit elements on a substrate witho...
- Patent number 11,881,466
- Issue date Jan 23, 2024
- Orbotech Ltd.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electrically conductive connection on a sub...
- Patent number 11,855,037
- Issue date Dec 26, 2023
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip bond semiconductor packages and assembly tools
- Patent number 11,676,934
- Issue date Jun 13, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chuck design and method for wafer
- Patent number 11,587,818
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Adsorption device, method for making same, and transferring system...
- Patent number 11,498,779
- Issue date Nov 15, 2022
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for cooling substrate
- Patent number 11,456,192
- Issue date Sep 27, 2022
- Semigear, Inc.
- Jonghoon Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing perovskite solar cell module and perovskit...
- Patent number 11,114,252
- Issue date Sep 7, 2021
- CPC CORPORATION, TAIWAN
- Kuan-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,018,028
- Issue date May 25, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photoelectric conversion device and manufacturing method and appara...
- Patent number 10,950,391
- Issue date Mar 16, 2021
- Kabushiki Kaisha Toshiba
- Shigehiko Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive pattern printer for downhole tools
- Patent number 10,799,908
- Issue date Oct 13, 2020
- Halliburton Energy Services, Inc.
- Robert L. Reynolds
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 10,600,652
- Issue date Mar 24, 2020
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 10,475,779
- Issue date Nov 12, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed three-dimensional (3D) functional part and method of making
- Patent number 10,462,907
- Issue date Oct 29, 2019
- President and Fellows of Harvard College
- Jennifer A. Lewis
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Interconnection structures and methods for transfer-printed integra...
- Patent number 10,418,331
- Issue date Sep 17, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,418,319
- Issue date Sep 17, 2019
- Infineon Technologies AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for surface attachment of flipped active components
- Patent number 10,262,966
- Issue date Apr 16, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid-suspended microcomponent harvest, distribution, and reclamation
- Patent number 10,242,977
- Issue date Mar 26, 2019
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sub-assembly and method for the production of an electro...
- Patent number 10,229,895
- Issue date Mar 12, 2019
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 10,165,677
- Issue date Dec 25, 2018
- Palo Alto Research Center Incorporated
- Ping Mei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Ultrasonic probe
- Patent number 10,143,441
- Issue date Dec 4, 2018
- SOCIONEXT INC.
- Masato Yoshioka
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Laminate electronic device
- Patent number 10,020,245
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chuck Design and Method for Wafer
- Publication number 20240395595
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chuck Design and Method for Wafer
- Publication number 20220359260
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
INK LEVELING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USIN...
- Publication number 20220223562
- Publication date Jul 14, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jung Hyun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICO...
- Publication number 20220139866
- Publication date May 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Yun Di HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220102604
- Publication date Mar 31, 2022
- SAMSUNG DISPLAY CO., LTD.
- Young Rag DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUB...
- Publication number 20210358880
- Publication date Nov 18, 2021
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnection Of Circuit Elements On A Substrate Witho...
- Publication number 20210028141
- Publication date Jan 28, 2021
- ORBOTECH LTD.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chuck Design and Method for Wafer
- Publication number 20210020492
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...
- Publication number 20190124757
- Publication date Apr 25, 2019
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20180334708
- Publication date Nov 22, 2018
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
INTERCONNECTION STRUCTURES AND METHODS FOR TRANSFER-PRINTED INTEGRA...
- Publication number 20180130751
- Publication date May 10, 2018
- X-Celeprint Limited
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid-Suspended Microcomponent Harvest, Distribution, and Reclamation
- Publication number 20180102352
- Publication date Apr 12, 2018
- eLux Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20180026023
- Publication date Jan 25, 2018
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
- Publication number 20180012859
- Publication date Jan 11, 2018
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Process Tools and Packaging Methods for Semiconductor Dev...
- Publication number 20140331462
- Publication date Nov 13, 2014
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS ELECTRIC POWER SUPPLY TYPE LIGHT-EMITTING ELEMENT AND LIGH...
- Publication number 20140327356
- Publication date Nov 6, 2014
- NITTO DENKO CORPORATION
- Takahiro Nakai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE INK FOR FILLING VIAS
- Publication number 20140138846
- Publication date May 22, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Richard A. Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly with Three Dimensional Inkjet Printed Traces
- Publication number 20140127856
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE
- Publication number 20140123486
- Publication date May 8, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Soo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE ELECTRONIC DEVICE
- Publication number 20140117565
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...
- Publication number 20140069697
- Publication date Mar 13, 2014
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETEN
- Jeroen Van Den Brand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly With Three Dimensional Inkjet Printed Traces
- Publication number 20140054795
- Publication date Feb 27, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device with a Carrier Havin...
- Publication number 20140021634
- Publication date Jan 23, 2014
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNT BOARD AND ELECTRONIC DEVICE
- Publication number 20140003015
- Publication date Jan 2, 2014
- NEC CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20130338046
- Publication date Dec 19, 2013
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
ELECTRONIC DEVICE INCLUDING A CARRIER AND A SEMICONDUCTOR CHIP ATTA...
- Publication number 20130328213
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFID TAGS AND PROCESSES FOR PRODUCING RFID TAGS
- Publication number 20130265134
- Publication date Oct 10, 2013
- Glenn W. Gengel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20130252382
- Publication date Sep 26, 2013
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130244379
- Publication date Sep 19, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Woojin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL SENSOR ARRAY HAVING MULTIPLE SENSORS PER WELL
- Publication number 20130244908
- Publication date Sep 19, 2013
- Life Technologies Corporation
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...

Apparatus for connecting with build-up interconnects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method for manufacturing display device

Chuck design and method for wafer

Ink leveling device and method of manufacturing display device usin...

Method for manufacturing semiconductor package structure and semico...

Chip bonding apparatus and securing assembly therefor

Substrate bonding apparatus and method of manufacturing a semicondu...

Electrical interconnection of circuit elements on a substrate witho...

Method for producing an electrically conductive connection on a sub...

Clip bond semiconductor packages and assembly tools

Method of applying conductive adhesive and manufacturing device usi...

Chuck design and method for wafer

Adsorption device, method for making same, and transferring system...

Apparatus and method for cooling substrate

Bare die integration with printed components on flexible substrate...

Method for manufacturing perovskite solar cell module and perovskit...

Method of applying conductive adhesive and manufacturing device usi...

Photoelectric conversion device and manufacturing method and appara...

Electrically conductive pattern printer for downhole tools

Semiconductor device processing method for material removal

Semiconductor device and method of forming a vertical interconnect...

Printed three-dimensional (3D) functional part and method of making

Interconnection structures and methods for transfer-printed integra...

Method of manufacturing a semiconductor device

Methods for surface attachment of flipped active components

Fluid-suspended microcomponent harvest, distribution, and reclamation

Electronic sub-assembly and method for the production of an electro...

Laser assisted transfer welding process

Bare die integration with printed components on flexible substrate...

Ultrasonic probe

Laminate electronic device

Patents Applicationslast 30 patents

Chuck Design and Method for Wafer

Chuck Design and Method for Wafer

INK LEVELING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USIN...

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICO...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUB...

Electrical Interconnection Of Circuit Elements On A Substrate Witho...

Chuck Design and Method for Wafer

BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

INTERCONNECTION STRUCTURES AND METHODS FOR TRANSFER-PRINTED INTEGRA...

Fluid-Suspended Microcomponent Harvest, Distribution, and Reclamation

Semiconductor Device and Method of Forming a Vertical Interconnect...

SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP

Packaging Process Tools and Packaging Methods for Semiconductor Dev...

WIRELESS ELECTRIC POWER SUPPLY TYPE LIGHT-EMITTING ELEMENT AND LIGH...

CONDUCTIVE INK FOR FILLING VIAS

Electronic Assembly with Three Dimensional Inkjet Printed Traces

METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE

LAMINATE ELECTRONIC DEVICE

METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...

Electronic Assembly With Three Dimensional Inkjet Printed Traces

Method of Manufacturing a Semiconductor Device with a Carrier Havin...

MOUNT BOARD AND ELECTRONIC DEVICE

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

ELECTRONIC DEVICE INCLUDING A CARRIER AND A SEMICONDUCTOR CHIP ATTA...

RFID TAGS AND PROCESSES FOR PRODUCING RFID TAGS

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

CHEMICAL SENSOR ARRAY HAVING MULTIPLE SENSORS PER WELL