Apparatus for connecting with strap connectors

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CPC
H01L2224/77

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/77Apparatus for connecting with strap connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Providing multifunctional shutter disk above the workpiece in the m...
- Patent number 11,920,237
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hao Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chip packaging device, chip packaging method, and package chip
- Patent number 11,764,184
- Issue date Sep 19, 2023
- HOSIN GLOBAL ELECTRONICS CO., LTD
- Chen-Nan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip bond semiconductor packages and assembly tools
- Patent number 11,676,934
- Issue date Jun 13, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adsorption device, method for making same, and transferring system...
- Patent number 11,498,779
- Issue date Nov 15, 2022
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shutter disk having lamp, power, and/or gas modules arranged at the...
- Patent number 11,492,700
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Co.
- Wen-Hao Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing perovskite solar cell module and perovskit...
- Patent number 11,114,252
- Issue date Sep 7, 2021
- CPC CORPORATION, TAIWAN
- Kuan-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Photoelectric conversion device and manufacturing method and appara...
- Patent number 10,950,391
- Issue date Mar 16, 2021
- Kabushiki Kaisha Toshiba
- Shigehiko Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip mounting method and device
- Patent number 10,910,530
- Issue date Feb 2, 2021
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive pattern printer for downhole tools
- Patent number 10,799,908
- Issue date Oct 13, 2020
- Halliburton Energy Services, Inc.
- Robert L. Reynolds
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Integrated circuit (IC) die attached between an offset lead frame d...
- Patent number 10,553,524
- Issue date Feb 4, 2020
- Microchip Technology Incorporated
- Man Kit Lam
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic probe
- Patent number 10,143,441
- Issue date Dec 4, 2018
- SOCIONEXT INC.
- Masato Yoshioka
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Window clamp
- Patent number 9,997,490
- Issue date Jun 12, 2018
- Texas Instruments Incorporated
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,609,775
- Issue date Mar 28, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,530,723
- Issue date Dec 27, 2016
- Renesas Electronics Corporation
- Akira Muto
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power converter
- Patent number 9,455,238
- Issue date Sep 27, 2016
- Honda Motor Co., Ltd.
- Asako Yoneguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,402,311
- Issue date Jul 26, 2016
- NSK Ltd.
- Takashi Sunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module
- Patent number 9,397,030
- Issue date Jul 19, 2016
- NSK Ltd.
- Takashi Sunaga
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding systems and methods of using the same
- Patent number 8,746,537
- Issue date Jun 10, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked leadframe implementation for DC/DC convertor power module i...
- Patent number 8,450,149
- Issue date May 28, 2013
- Texas Instruments Incorporated
- Jaime A. Bayan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor power conversion apparatus and method of manufacturin...
- Patent number 8,058,554
- Issue date Nov 15, 2011
- Toyota Jidosha Kabushiki Kaisha
- Hideo Nakamura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power semiconductor module with MOS chip
- Patent number 7,719,100
- Issue date May 18, 2010
- Hitachi, Ltd.
- Shiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device...
- Patent number 6,919,644
- Issue date Jul 19, 2005
- Kabushiki Kaisha Toshiba
- Shotaro Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting a circuit component and joint structure therefor
- Patent number 6,822,331
- Issue date Nov 23, 2004
- Delphi Technologies, Inc.
- Charles T. Eytcheson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCT...
- Publication number 20240379612
- Publication date Nov 14, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTIONAL SHUTTER DISK FOR THIN FILM DEPOSITION CHAMBER
- Publication number 20240167149
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230395555
- Publication date Dec 7, 2023
- HYUNDAI MOBIS CO., LTD.
- Se Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEX BONDED INTEGRATED CIRCUITS
- Publication number 20230299035
- Publication date Sep 21, 2023
- META PLATFORMS, INC.
- Sandeep Rekhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET
- Publication number 20230154889
- Publication date May 18, 2023
- Fuji Electric Co., Ltd.
- Manabu ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTIONAL SHUTTER DISK FOR THIN FILM DEPOSITION CHAMBER
- Publication number 20220356562
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hao Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CLIP BOND SEMICONDUCTOR PACKAGES AND ASSEMBLY TOOLS
- Publication number 20210118840
- Publication date Apr 22, 2021
- UTAC Headquarters Pte. Ltd.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window Clamp
- Publication number 20180261568
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window Clamp
- Publication number 20180261567
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Power Device Having a Heat Sink
- Publication number 20140312360
- Publication date Oct 23, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER
- Publication number 20140284809
- Publication date Sep 25, 2014
- Honda Motor Co., Ltd.
- Asako YONEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20140084438
- Publication date Mar 27, 2014
- FUJI ELECTRIC CO., LTD.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20140048584
- Publication date Feb 20, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL BONDING APPARATUS
- Publication number 20130284794
- Publication date Oct 31, 2013
- Sanyo Electric Co., Ltd.
- Takashi SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Contact Clip Having Protrusions an...
- Publication number 20130009295
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED LEADFRAME IMPLEMENTATION FOR DC/DC CONVERTOR POWER MODULE I...
- Publication number 20120119343
- Publication date May 17, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER CONVERSION APPARATUS AND METHOD OF MANUFACTURIN...
- Publication number 20100089607
- Publication date Apr 15, 2010
- Toyota Jidosha Kabushiki Kaisha
- Hideo Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soldering Container and Production Method of Semiconductor Device
- Publication number 20090275174
- Publication date Nov 5, 2009
- Masahiko Kimbara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering Method, Semiconductor Module Manufacturing Method, and So...
- Publication number 20090184152
- Publication date Jul 23, 2009
- Masahiko Kimbara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor module
- Publication number 20070069344
- Publication date Mar 29, 2007
- Shiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method and semiconductor device...
- Publication number 20050121799
- Publication date Jun 9, 2005
- Shotaro Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of mounting a circuit component and joint structure therefor
- Publication number 20050093115
- Publication date May 5, 2005
- DELPHI TECHNOLOGIES, INC.
- Charles T. Eytcheson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of mounting a circuit component and joint structure therefor
- Publication number 20020190388
- Publication date Dec 19, 2002
- Charles Tyler Eytcheson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method and semiconductor device...
- Publication number 20020033541
- Publication date Mar 21, 2002
- Shotaro Uchida
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for connecting with strap connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip bonding apparatus and securing assembly therefor

Substrate bonding apparatus and method of manufacturing a semicondu...

Providing multifunctional shutter disk above the workpiece in the m...

Chip packaging device, chip packaging method, and package chip

Clip bond semiconductor packages and assembly tools

Adsorption device, method for making same, and transferring system...

Shutter disk having lamp, power, and/or gas modules arranged at the...

Method for manufacturing perovskite solar cell module and perovskit...

Method for electrically contacting a component by galvanic connecti...

Photoelectric conversion device and manufacturing method and appara...

LED chip mounting method and device

Electrically conductive pattern printer for downhole tools

Curtain airbag device mounting structure and curtain airbag deploym...

Integrated circuit (IC) die attached between an offset lead frame d...

Method of manufacturing a semiconductor device

Ultrasonic probe

Window clamp

Semiconductor device, method of manufacturing a semiconductor devic...

Semiconductor module

Semiconductor device and manufacturing method thereof

Power converter

Semiconductor module

Semiconductor module

Semiconductor device using diffusion soldering

Ultrasonic bonding systems and methods of using the same

Stacked leadframe implementation for DC/DC convertor power module i...

Semiconductor power conversion apparatus and method of manufacturin...

Power semiconductor module with MOS chip

Semiconductor device manufacturing method and semiconductor device...

Method of mounting a circuit component and joint structure therefor

Patents Applicationslast 30 patents

APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCT...

MULTI-FUNCTIONAL SHUTTER DISK FOR THIN FILM DEPOSITION CHAMBER

PACKAGE DEVICE PREVENTING SOLDER OVERFLOW

POWER MODULE

FLEX BONDED INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET

MULTI-FUNCTIONAL SHUTTER DISK FOR THIN FILM DEPOSITION CHAMBER

CLIP BOND SEMICONDUCTOR PACKAGES AND ASSEMBLY TOOLS

Window Clamp

Window Clamp

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor Power Device Having a Heat Sink

POWER CONVERTER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

METAL BONDING APPARATUS

Semiconductor Device Using Diffusion Soldering

Semiconductor Device Including a Contact Clip Having Protrusions an...

STACKED LEADFRAME IMPLEMENTATION FOR DC/DC CONVERTOR POWER MODULE I...

SEMICONDUCTOR POWER CONVERSION APPARATUS AND METHOD OF MANUFACTURIN...

Soldering Container and Production Method of Semiconductor Device

Soldering Method, Semiconductor Module Manufacturing Method, and So...

Semiconductor module

Semiconductor device manufacturing method and semiconductor device...

Method of mounting a circuit component and joint structure therefor

Method of mounting a circuit component and joint structure therefor

Semiconductor device manufacturing method and semiconductor device...