Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies

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H01L24/74

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer bonding device and wafer bonding method
- Patent number 12,315,839
- Issue date May 27, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including a plurality of heads and a method of using the...
- Patent number 12,317,421
- Issue date May 27, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,300,663
- Issue date May 13, 2025
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor packaging system with enhanced dielectric-...
- Patent number 12,272,670
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system and bonding method
- Patent number 12,261,147
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding system and method of using the same
- Patent number 12,255,171
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic bonding gap control and tool for wafer bonding
- Patent number 12,249,592
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,243,847
- Issue date Mar 4, 2025
- Semes Co., Ltd.
- Gil Yong Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for improving fusion bonding
- Patent number 12,243,848
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Ta Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 12,224,262
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus, method of reading position o...
- Patent number 12,224,196
- Issue date Feb 11, 2025
- SK hynix Inc.
- Chan Ho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for the alignment of substrates
- Patent number 12,199,062
- Issue date Jan 14, 2025
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder head with improved sealing performance
- Patent number 12,166,008
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-type solder ball placement system
- Patent number 12,151,315
- Issue date Nov 26, 2024
- S.S.P. INC.
- Kyouho Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package having metal thermal interface material
- Patent number 12,119,237
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems of applying materials to components
- Patent number 12,040,306
- Issue date Jul 16, 2024
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding tool and bonding method thereof
- Patent number 12,009,337
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Yuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for bonding chips
- Patent number 11,990,463
- Issue date May 21, 2024
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 11,990,444
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxless gang die bonding arrangement
- Patent number 11,972,968
- Issue date Apr 30, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach process and dispenser head
- Patent number 11,972,956
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor products, corresponding subst...
- Patent number 11,967,544
- Issue date Apr 23, 2024
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding apparatus and method
- Patent number 11,955,454
- Issue date Apr 9, 2024
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Emissive element harvest
- Patent number 11,929,356
- Issue date Mar 12, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting components on a substrate
- Patent number 11,924,974
- Issue date Mar 5, 2024
- Besi Switzerland AG
- Norbert Bilewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum deposition system and method thereof
- Patent number 11,916,036
- Issue date Feb 27, 2024
- INTLVAC INC.
- Michael Nagy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
CHIP ATTACHING DEVICE, CHIP PROCESSING SYSTEM, AND CHIP PROCESSING...
- Publication number 20250183222
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Yasutaka Mizomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING
- Publication number 20250174595
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Ta Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD OF MAN...
- Publication number 20250167015
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Donguk KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM INCLUDING A PLURALITY OF DIE HEADS WITH RELEASABLY COUPLED D...
- Publication number 20250167165
- Publication date May 22, 2025
- Canon Kabushiki Kaisha
- Byung-Jin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL AND CHIP-ON-WAFER BONDING PROCESS
- Publication number 20250149497
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING EQUIPMENT, BONDING EQUIPMENT, POSITIONING METHOD AND BO...
- Publication number 20250140736
- Publication date May 1, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- RYO FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20250140739
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Kashyap Mohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS CHIP STACKING STRUCTURE
- Publication number 20250105186
- Publication date Mar 27, 2025
- Shine Optics Technology Company Limited
- KUNG-AN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS CHIP STACKING DEVICE
- Publication number 20250105202
- Publication date Mar 27, 2025
- Shine Optics Technology Company Limited
- KUNG-AN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS CHIP STACKING METHOD
- Publication number 20250105204
- Publication date Mar 27, 2025
- Shine Optics Technology Company Limited
- KUNG-AN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Apparatus, Mounting Method, and Method for Manufacturin...
- Publication number 20250096188
- Publication date Mar 20, 2025
- Fasford Technology Co., Ltd.
- Keita YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANU...
- Publication number 20250087624
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD
- Publication number 20250079397
- Publication date Mar 6, 2025
- Canon Kabushiki Kaisha
- SHUN TOKAIRIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compensating for registration error in vertical die stacking
- Publication number 20250079394
- Publication date Mar 6, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE SUPPLY MODULE AND WIRE BONDING MACHINE INCLUDING THE SAME
- Publication number 20250066154
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Doojin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
- Publication number 20250070080
- Publication date Feb 27, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT...
- Publication number 20250062274
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
- Publication number 20250062275
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20250062263
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD AND BONDING SYSTEM
- Publication number 20250029950
- Publication date Jan 23, 2025
- TOKYO ELECTRON LIMITED
- Yuji MIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING CHUCK WITH DISCRETE ACTUATORS
- Publication number 20250029866
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Craig A. Hickman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE
- Publication number 20250022826
- Publication date Jan 16, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM OF PERFORMING COLLECTIVE DIE-TO-WAFER BONDING
- Publication number 20250022839
- Publication date Jan 16, 2025
- IHP GmbH-Innovations for High Performance Microelectronics/Leibniz-Instit. fu...
- Sebastian SCHULZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20250015039
- Publication date Jan 9, 2025
- TORAY ENGINEERING CO., LTD.
- Tatsuya OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
- Publication number 20240421117
- Publication date Dec 19, 2024
- Canon Kabushiki Kaisha
- KIYOTAKA NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF BONDING SE...
- Publication number 20240395764
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Gyeongjae JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING SYSTEM AND METHOD OF USING THE SAME
- Publication number 20240387445
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING
- Publication number 20240379616
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE PACKAGE HAVING METAL THERMA...
- Publication number 20240371656
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Li KUO
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer bonding device and wafer bonding method

Apparatus including a plurality of heads and a method of using the...

Methods of forming wire interconnect structures and related wire bo...

Integrated semiconductor packaging system with enhanced dielectric-...

Bonding system and bonding method

Wafer bonding system and method of using the same

Dynamic bonding gap control and tool for wafer bonding

Bonding apparatus and bonding method

Methods and systems for improving fusion bonding

Substrate bonding apparatus and method of manufacturing semiconduct...

Semiconductor manufacturing apparatus, method of reading position o...

Device and method for the alignment of substrates

Injection molded solder head with improved sealing performance

Semiconductor wafer and method of ball drop on thin wafer with edge...

Dual-type solder ball placement system

Semiconductor device package having metal thermal interface material

Chip bonding apparatus and securing assembly therefor

Systems of applying materials to components

Bonding tool and bonding method thereof

Substrate bonding apparatus and method of manufacturing a semicondu...

Device for bonding chips

Substrate bonding apparatus and method of manufacturing semiconduct...

Fluxless gang die bonding arrangement

Lid attach process and dispenser head

Bond enhancement structure in microelectronics for trapping contami...

Method of manufacturing semiconductor products, corresponding subst...

Wafer bonding apparatus and method

Emissive element harvest

Apparatus for mounting components on a substrate

Vacuum deposition system and method thereof

Patents Applicationslast 30 patents

CHIP ATTACHING DEVICE, CHIP PROCESSING SYSTEM, AND CHIP PROCESSING...

METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING

APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD OF MAN...

SYSTEM INCLUDING A PLURALITY OF DIE HEADS WITH RELEASABLY COUPLED D...

BONDING TOOL AND CHIP-ON-WAFER BONDING PROCESS

POSITIONING EQUIPMENT, BONDING EQUIPMENT, POSITIONING METHOD AND BO...

LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES

HETEROGENEOUS CHIP STACKING STRUCTURE

HETEROGENEOUS CHIP STACKING DEVICE

HETEROGENEOUS CHIP STACKING METHOD

Die Bonding Apparatus, Mounting Method, and Method for Manufacturin...

SEMICONDUCTOR CHIP BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANU...

BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD

Compensating for registration error in vertical die stacking

WIRE SUPPLY MODULE AND WIRE BONDING MACHINE INCLUDING THE SAME

METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

BONDING APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT...

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

BONDING METHOD AND BONDING SYSTEM

WAFER BONDING CHUCK WITH DISCRETE ACTUATORS

SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE

METHOD AND SYSTEM OF PERFORMING COLLECTIVE DIE-TO-WAFER BONDING

BONDING DEVICE AND BONDING METHOD

BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD

BONDING APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF BONDING SE...

WAFER BONDING SYSTEM AND METHOD OF USING THE SAME

DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

METHOD FOR FORMING SEMICONDUCTOR DEVICE PACKAGE HAVING METAL THERMA...