Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies

Industry

CPC
H01L24/74

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fluxless gang die bonding arrangement
- Patent number 11,972,968
- Issue date Apr 30, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach process and dispenser head
- Patent number 11,972,956
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor products, corresponding subst...
- Patent number 11,967,544
- Issue date Apr 23, 2024
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding apparatus and method
- Patent number 11,955,454
- Issue date Apr 9, 2024
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Emissive element harvest
- Patent number 11,929,356
- Issue date Mar 12, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting components on a substrate
- Patent number 11,924,974
- Issue date Mar 5, 2024
- Besi Switzerland AG
- Norbert Bilewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum deposition system and method thereof
- Patent number 11,916,036
- Issue date Feb 27, 2024
- INTLVAC INC.
- Michael Nagy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Alignment mechanism and alignment method of bonding machine
- Patent number 11,869,792
- Issue date Jan 9, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,855,036
- Issue date Dec 26, 2023
- Kioxia Corporation
- Masaharu Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for the characterization of emissive elements
- Patent number 11,855,051
- Issue date Dec 26, 2023
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using processing oven
- Patent number 11,850,672
- Issue date Dec 26, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for transfer of micro-devices
- Patent number 11,843,025
- Issue date Dec 12, 2023
- Applied Materials, Inc.
- Mingwei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing semiconductor package structure
- Patent number 11,837,572
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun-Min Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 11,813,688
- Issue date Nov 14, 2023
- LASERSSEL CO., LTD.
- Jae Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Producing apparatus
- Patent number 11,784,158
- Issue date Oct 10, 2023
- GALLANT MICRO. MACHINING CO., LTD.
- Tun-Chih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for bonding of chips
- Patent number 11,764,198
- Issue date Sep 19, 2023
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing electronic device using device chip
- Patent number 11,749,636
- Issue date Sep 5, 2023
- SHASHIN KAGAKU CO., LTD.
- Hiroyuki Kitazawa
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 11,721,562
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,705,426
- Issue date Jul 18, 2023
- Semes Co., Ltd.
- Gil Yong Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding method with corner or side contact without impact force
- Patent number 11,694,989
- Issue date Jul 4, 2023
- SAULTECH TECHNOLOGY CO., LTD.
- Yen Hao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for mounting components on a substrate
- Patent number 11,696,429
- Issue date Jul 4, 2023
- Besi Switzerland AG
- Norbert Bilewicz
- G05 - CONTROLLING REGULATING
Information Patent Grant
Clip bond semiconductor packages and assembly tools
- Patent number 11,676,934
- Issue date Jun 13, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable and self-healing solders for dies and components in man...
- Patent number 11,664,338
- Issue date May 30, 2023
- Anwar A. Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonding apparatus and method and substrate bonding apparatus an...
- Patent number 11,600,593
- Issue date Mar 7, 2023
- Semes Co., Ltd.
- Hanglim Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of attaching die to substrate using compliant die attach sy...
- Patent number 11,557,567
- Issue date Jan 17, 2023
- Assembleon B.V.
- Rudolphus H. Hoefs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding device and ultrasonic bonding method
- Patent number 11,541,477
- Issue date Jan 3, 2023
- TDK Corporation
- Seijiro Sunaga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING MATERIAL APPLICATION APPARATUS AND BONDING MATERIAL APPLICA...
- Publication number 20240153907
- Publication date May 9, 2024
- Fuji Electric Co., Ltd.
- Narumi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20240153906
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Byeongtak PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROMAGNETIC CONTROL OF WAFER BONDING
- Publication number 20240153910
- Publication date May 9, 2024
- MICRON TECHNOLGY, INC.
- Andrew M. BAYLESS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240136231
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING M...
- Publication number 20240127423
- Publication date Apr 18, 2024
- SHINKAWA LTD.
- Yoshiyuki OGATA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE
- Publication number 20240105497
- Publication date Mar 28, 2024
- TOKYO ELECTRON LIMITED
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20240079373
- Publication date Mar 7, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20240079374
- Publication date Mar 7, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICO...
- Publication number 20240079375
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Hiroaki HOKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Bonding Apparatus and Method of Manufacturing a Package Usin...
- Publication number 20240071982
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING PROCESSING OVEN
- Publication number 20240066618
- Publication date Feb 29, 2024
- Yield Engineering Systems, Inc.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-...
- Publication number 20240055389
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES
- Publication number 20240033840
- Publication date Feb 1, 2024
- LASERSSEL CO., LTD.
- Jae Joon CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING TOOL AND BONDING METHOD THEREOF
- Publication number 20240030179
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...
- Publication number 20240021436
- Publication date Jan 18, 2024
- ZF Friedrichshafen AG
- Ake Ewald
- B60 - VEHICLES IN GENERAL
Information Patent Application
THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DI...
- Publication number 20240017955
- Publication date Jan 18, 2024
- RESONAC CORPORATION
- Mika KOBUNE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20240006193
- Publication date Jan 4, 2024
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF
- Publication number 20230420406
- Publication date Dec 28, 2023
- KULICKE AND SOFFA HI-TECH CO., LTD.
- Lu-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME
- Publication number 20230343743
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SURFACE TREATMENT APPARATUS AND DIE BONDING SYSTEM INCLUDING TH...
- Publication number 20230343740
- Publication date Oct 26, 2023
- SEMES CO., LTD.
- Min Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...
- Publication number 20230340686
- Publication date Oct 26, 2023
- LAM RESEARCH CORPORATION
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230335415
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CHAMBER WITH UV IRRADIANCE
- Publication number 20230294190
- Publication date Sep 21, 2023
- Yield Engineering Systems, Inc.
- Tapani Laaksonen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for mounting components on a substrate
- Publication number 20230284426
- Publication date Sep 7, 2023
- Besi Switzerland AG
- Norbert BILEWICZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20230275062
- Publication date Aug 31, 2023
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...
- Publication number 20230230847
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER BONDING DEVICE AND WAFER BONDING METHOD
- Publication number 20230223377
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES
- Publication number 20230207513
- Publication date Jun 29, 2023
- EV GROUP E. THALLNER GMBH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR DIE BOND CONTROL
- Publication number 20230207514
- Publication date Jun 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20230197672
- Publication date Jun 22, 2023
- KIOXIA Corporation
- Ai MORI
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fluxless gang die bonding arrangement

Lid attach process and dispenser head

Bond enhancement structure in microelectronics for trapping contami...

Method of manufacturing semiconductor products, corresponding subst...

Wafer bonding apparatus and method

Emissive element harvest

Apparatus for mounting components on a substrate

Vacuum deposition system and method thereof

Alignment mechanism and alignment method of bonding machine

Bonding apparatus and bonding method

System for the characterization of emissive elements

Method of using processing oven

Methods for transfer of micro-devices

Apparatus and method for manufacturing semiconductor package structure

Laser bonding apparatus for three-dimensional molded sculptures

Bonding apparatus and method of fabricating display device using th...

Producing apparatus

Method and device for bonding of chips

Apparatus for manufacturing electronic device using device chip

Semiconductor device

Substrate bonding apparatus

Bonding apparatus and bonding method

Die bonding method with corner or side contact without impact force

Apparatus and method for mounting components on a substrate

Clip bond semiconductor packages and assembly tools

Stretchable and self-healing solders for dies and components in man...

Method of applying conductive adhesive and manufacturing device usi...

Die bonding apparatus and method and substrate bonding apparatus an...

Methods of attaching die to substrate using compliant die attach sy...

Ultrasonic bonding device and ultrasonic bonding method

Patents Applicationslast 30 patents

BONDING MATERIAL APPLICATION APPARATUS AND BONDING MATERIAL APPLICA...

SUBSTRATE BONDING APPARATUS

FERROMAGNETIC CONTROL OF WAFER BONDING

APPARATUS FOR MEASURING AN ADHESION FORCE

MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING M...

SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE

BONDING SYSTEM AND BONDING METHOD

BONDING SYSTEM AND BONDING METHOD

BONDING TOOL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICO...

Device Bonding Apparatus and Method of Manufacturing a Package Usin...

METHOD OF USING PROCESSING OVEN

INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-...

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES

BONDING TOOL AND BONDING METHOD THEREOF

METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...

THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DI...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF

FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME

DIE SURFACE TREATMENT APPARATUS AND DIE BONDING SYSTEM INCLUDING TH...

ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROCESS CHAMBER WITH UV IRRADIANCE

Apparatus for mounting components on a substrate

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...

WAFER BONDING DEVICE AND WAFER BONDING METHOD

DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES

APPARATUSES AND METHODS FOR DIE BOND CONTROL

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...