Apparatus for placing on an insulating substrate

Industry

CPC
H01L21/67132

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67132Apparatus for placing on an insulating substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and system for manufacturing a semiconductor package structure
- Patent number 12,183,712
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Che-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for bonding a plurality of dies to a carrier p...
- Patent number 12,183,620
- Issue date Dec 31, 2024
- PYXIS CF PTE. LTD.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus and method of controlling the same
- Patent number 12,154,819
- Issue date Nov 26, 2024
- ZEUS CO., LTD.
- Seung Dae Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pickup apparatus and method of using the same
- Patent number 12,142,499
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Affixing method and affixing apparatus
- Patent number 12,128,664
- Issue date Oct 29, 2024
- Disco Corporation
- Yohei Masuda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Manufacturing apparatus of semiconductor device
- Patent number 12,131,921
- Issue date Oct 29, 2024
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallelism-adjustable bonding machine
- Patent number 12,125,721
- Issue date Oct 22, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive transfer stamp and method for transferring a semiconductor...
- Patent number 12,106,980
- Issue date Oct 1, 2024
- Osram Opto Semiconductors GmbH
- Hubert Halbritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for transferring electronic components from a...
- Patent number 12,094,736
- Issue date Sep 17, 2024
- Muehlbauer GmbH & Co. KG
- Marcel Freimuth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming semiconductor die having edge with multiple grad...
- Patent number 12,087,618
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component producing method, holding film, and holding tool forming...
- Patent number 12,068,188
- Issue date Aug 20, 2024
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Inspection unit of a transfer device for transferring components be...
- Patent number 12,046,491
- Issue date Jul 23, 2024
- Muehlbauer GmbH & Co. KG
- Konrad Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems of applying materials to components
- Patent number 12,040,306
- Issue date Jul 16, 2024
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Detape apparatus for an optical alignment machine
- Patent number 12,020,959
- Issue date Jun 25, 2024
- ASMPT SINGAPORE PTE. LTD.
- Po Lam Au
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer tool and method for transferring semiconductor chips
- Patent number 12,020,973
- Issue date Jun 25, 2024
- Osram Opto Semiconductors GmbH
- Andreas Plöβl
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method for transferring missing semiconductor chips using an adhesi...
- Patent number 12,014,941
- Issue date Jun 18, 2024
- Osram Opto Semiconductors GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-bonding device
- Patent number 11,961,753
- Issue date Apr 16, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet attaching apparatus
- Patent number 11,942,339
- Issue date Mar 26, 2024
- Disco Corporation
- Yoshinori Kakinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic release tapes for assembly of discrete components
- Patent number 11,942,354
- Issue date Mar 26, 2024
- Uniqarta, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for attaching protective tape on semiconductor wafer
- Patent number 11,935,768
- Issue date Mar 19, 2024
- DISCO HI-TEC EUROPE GMBH
- Karl Heinz Priewasser
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor packaging apparatus and method of manufacturing semic...
- Patent number 11,923,214
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Junghyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 11,901,201
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Shunichi Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective member attaching apparatus and protective member attachi...
- Patent number 11,894,248
- Issue date Feb 6, 2024
- Disco Corporation
- Yoshinori Kakinuma
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus of manufacturing display device and method of manufacturi...
- Patent number 11,889,742
- Issue date Jan 30, 2024
- Samsung Display Co., Ltd.
- Seungkuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part package body and peeling method for electronic part...
- Patent number 11,805,632
- Issue date Oct 31, 2023
- Taiyo Yuden Co., Ltd.
- Kazuo Sugai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective sheet sticking apparatus
- Patent number 11,769,676
- Issue date Sep 26, 2023
- Disco Corporation
- Yoshinori Kakinuma
- B32 - LAYERED PRODUCTS
Information Patent Grant
Processing apparatus
- Patent number 11,764,085
- Issue date Sep 19, 2023
- Disco Corporation
- Yukiyasu Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for vacuum processing a substrate
- Patent number 11,756,925
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape attaching apparatus
- Patent number 11,756,809
- Issue date Sep 12, 2023
- Disco Corporation
- Yoshinobu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 11,749,541
- Issue date Sep 5, 2023
- Shinkawa Ltd.
- Shigeyuki Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP WET TRANSFER METHOD AND EQUIPMENT USING MAGNETIC FORCE
- Publication number 20250006542
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Youngtek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...
- Publication number 20250006520
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM, ELECTROSTATIC CARRIER, AND PROCESSING METHOD
- Publication number 20240429073
- Publication date Dec 26, 2024
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM REMOVAL APPARATUS AND UNCOVERING MECHANISM
- Publication number 20240429072
- Publication date Dec 26, 2024
- WISTRON CORP.
- ZESHAN YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET RELEASE APPARATUS
- Publication number 20240404847
- Publication date Dec 5, 2024
- Tokyo Seimitsu Co., Ltd.
- Hitoshi AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKUP METHOD AND PICKUP APPARATUS
- Publication number 20240395575
- Publication date Nov 28, 2024
- Disco Corporation
- Yuya MATSUOKA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND DEVICE FOR TRANSFERRING AND PREPARING COMPONENTS
- Publication number 20240395576
- Publication date Nov 28, 2024
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING AND DETECTING APPARATUS
- Publication number 20240387211
- Publication date Nov 21, 2024
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKUP APPARATUS AND METHOD OF USING THE SAME
- Publication number 20240387206
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS
- Publication number 20240363398
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE TAPE REMOVING
- Publication number 20240355651
- Publication date Oct 24, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jinhua YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A DETACHABLE FOIL, POWER ELECTRONICS AR...
- Publication number 20240332055
- Publication date Oct 3, 2024
- Infineon Technologies Austria AG
- Gerardo Pantoja
- B32 - LAYERED PRODUCTS
Information Patent Application
HEAT STAMP AND METHOD FOR RELEASING PROTECTIVE TAPE USING HEAT STAMP
- Publication number 20240321606
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Shinsuke KOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO SEMICONDUCTOR CHIP TRANSFER METHOD AND MICRO SEMICONDUCTOR CH...
- Publication number 20240322068
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Youngtek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING A...
- Publication number 20240312823
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Die Ejector for Die Attach Ejector Devices
- Publication number 20240312808
- Publication date Sep 19, 2024
- Western Digital Technologies, Inc.
- Simon Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKUP APPARATUS AND METHOD OF USING THE SAME
- Publication number 20240304474
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT TRANSFER SYSTEM
- Publication number 20240234179
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jeong Won HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIPER FOR TRANSFERRING MICRO SEMICONDUCTOR CHIP AND APPARATUS FOR C...
- Publication number 20240234180
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A DIE STRUCTURE INCLUDING A CONTROLLED THICKNESS...
- Publication number 20240222351
- Publication date Jul 4, 2024
- Canon Kabushiki Kaisha
- Anshuman CHERALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR STRETCHING A DIE SOURCE, AND RELATED METHODS
- Publication number 20240222164
- Publication date Jul 4, 2024
- KULICKE & SOFFA NETHERLANDS B.V.
- Hendrikus Antonius Fransen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLEANING APPARATUS AND BONDING SYSTEM
- Publication number 20240203758
- Publication date Jun 20, 2024
- Yamaha Robotics Holdings Co., Ltd.
- Hiroshi KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DIE-TRANSFER TOOL AND METHOD
- Publication number 20240203764
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Wei SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER METHOD AND TRANSFER DEVICE OF LIGHT-EMITTING ELEMENT FOR D...
- Publication number 20240178017
- Publication date May 30, 2024
- Seoul Viosys Co., Ltd.
- Ik Kyu YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE D...
- Publication number 20240178015
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PROCESS FLOWS FOR HYBRID BONDING
- Publication number 20240170443
- Publication date May 23, 2024
- Ruiping WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER RELEASE STACK FOR LIGHT INDUCED TRANSFER OF COMPONENTS
- Publication number 20240140081
- Publication date May 2, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED WAFER AND DICING METHOD OF STACKED WAFER
- Publication number 20240145309
- Publication date May 2, 2024
- Canon Kabushiki Kaisha
- TETSURO YASUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT TRANSFER SYSTEM
- Publication number 20240136208
- Publication date Apr 25, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jeong Won HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME
- Publication number 20240128098
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Young Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for placing on an insulating substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and system for manufacturing a semiconductor package structure

Apparatus and method for bonding a plurality of dies to a carrier p...

Wafer cleaning apparatus and method of controlling the same

Pickup apparatus and method of using the same

Affixing method and affixing apparatus

Manufacturing apparatus of semiconductor device

Parallelism-adjustable bonding machine

Adhesive transfer stamp and method for transferring a semiconductor...

Apparatus and method for transferring electronic components from a...

Method for forming semiconductor die having edge with multiple grad...

Component producing method, holding film, and holding tool forming...

Inspection unit of a transfer device for transferring components be...

Systems of applying materials to components

Detape apparatus for an optical alignment machine

Transfer tool and method for transferring semiconductor chips

Method for transferring missing semiconductor chips using an adhesi...

Substrate-bonding device

Sheet attaching apparatus

Dynamic release tapes for assembly of discrete components

Device and method for attaching protective tape on semiconductor wafer

Semiconductor packaging apparatus and method of manufacturing semic...

Semiconductor manufacturing apparatus and method of manufacturing s...

Protective member attaching apparatus and protective member attachi...

Apparatus of manufacturing display device and method of manufacturi...

Electronic part package body and peeling method for electronic part...

Protective sheet sticking apparatus

Processing apparatus

Methods and apparatus for vacuum processing a substrate

Tape attaching apparatus

Bonding apparatus

Patents Applicationslast 30 patents

CHIP WET TRANSFER METHOD AND EQUIPMENT USING MAGNETIC FORCE

APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...

PROCESSING SYSTEM, ELECTROSTATIC CARRIER, AND PROCESSING METHOD

FILM REMOVAL APPARATUS AND UNCOVERING MECHANISM

SHEET RELEASE APPARATUS

PICKUP METHOD AND PICKUP APPARATUS

METHOD AND DEVICE FOR TRANSFERRING AND PREPARING COMPONENTS

PROCESSING AND DETECTING APPARATUS

PICKUP APPARATUS AND METHOD OF USING THE SAME

SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS

WORKPIECE TAPE REMOVING

SEMICONDUCTOR DEVICE HAVING A DETACHABLE FOIL, POWER ELECTRONICS AR...

HEAT STAMP AND METHOD FOR RELEASING PROTECTIVE TAPE USING HEAT STAMP

MICRO SEMICONDUCTOR CHIP TRANSFER METHOD AND MICRO SEMICONDUCTOR CH...

METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING A...

Integrated Die Ejector for Die Attach Ejector Devices

PICKUP APPARATUS AND METHOD OF USING THE SAME

LIGHT-EMITTING ELEMENT TRANSFER SYSTEM

WIPER FOR TRANSFERRING MICRO SEMICONDUCTOR CHIP AND APPARATUS FOR C...

METHOD OF FORMING A DIE STRUCTURE INCLUDING A CONTROLLED THICKNESS...

SYSTEMS FOR STRETCHING A DIE SOURCE, AND RELATED METHODS

WAFER CLEANING APPARATUS AND BONDING SYSTEM

WAFER-LEVEL DIE-TRANSFER TOOL AND METHOD

TRANSFER METHOD AND TRANSFER DEVICE OF LIGHT-EMITTING ELEMENT FOR D...

MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE D...

INTEGRATED PROCESS FLOWS FOR HYBRID BONDING

MULTI-LAYER RELEASE STACK FOR LIGHT INDUCED TRANSFER OF COMPONENTS

STACKED WAFER AND DICING METHOD OF STACKED WAFER

LIGHT-EMITTING ELEMENT TRANSFER SYSTEM

EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME