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Apparatus for placing on an insulating substrate
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H01L21/67132
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/67132
Apparatus for placing on an insulating substrate
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last 30 patents
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Patent Grant
Substrate-bonding device
Patent number
11,961,753
Issue date
Apr 16, 2024
SKY TECH INC.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sheet attaching apparatus
Patent number
11,942,339
Issue date
Mar 26, 2024
Disco Corporation
Yoshinori Kakinuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dynamic release tapes for assembly of discrete components
Patent number
11,942,354
Issue date
Mar 26, 2024
Uniqarta, Inc.
Val Marinov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for attaching protective tape on semiconductor wafer
Patent number
11,935,768
Issue date
Mar 19, 2024
DISCO HI-TEC EUROPE GMBH
Karl Heinz Priewasser
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Semiconductor packaging apparatus and method of manufacturing semic...
Patent number
11,923,214
Issue date
Mar 5, 2024
Samsung Electronics Co., Ltd.
Junghyun Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
Patent number
11,901,201
Issue date
Feb 13, 2024
Mitsubishi Electric Corporation
Shunichi Kawakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protective member attaching apparatus and protective member attachi...
Patent number
11,894,248
Issue date
Feb 6, 2024
Disco Corporation
Yoshinori Kakinuma
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Apparatus of manufacturing display device and method of manufacturi...
Patent number
11,889,742
Issue date
Jan 30, 2024
Samsung Display Co., Ltd.
Seungkuk Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic part package body and peeling method for electronic part...
Patent number
11,805,632
Issue date
Oct 31, 2023
Taiyo Yuden Co., Ltd.
Kazuo Sugai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protective sheet sticking apparatus
Patent number
11,769,676
Issue date
Sep 26, 2023
Disco Corporation
Yoshinori Kakinuma
B32 - LAYERED PRODUCTS
Information
Patent Grant
Processing apparatus
Patent number
11,764,085
Issue date
Sep 19, 2023
Disco Corporation
Yukiyasu Masuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for vacuum processing a substrate
Patent number
11,756,925
Issue date
Sep 12, 2023
Applied Materials, Inc.
Ying Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tape attaching apparatus
Patent number
11,756,809
Issue date
Sep 12, 2023
Disco Corporation
Yoshinobu Saito
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus
Patent number
11,749,541
Issue date
Sep 5, 2023
Shinkawa Ltd.
Shigeyuki Sekiguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die processing
Patent number
11,742,315
Issue date
Aug 29, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus to control transfer parameters during transfer of semicon...
Patent number
11,728,189
Issue date
Aug 15, 2023
Rohinni, Inc.
Justin Wendt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for connecting electronic assemblies
Patent number
11,676,843
Issue date
Jun 13, 2023
Pink GmbH Thermosysteme
Stefan Müssig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protective sheet for use in processing wafer, handling system for w...
Patent number
11,676,833
Issue date
Jun 13, 2023
Disco Corporation
Karl Heinz Priewasser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin sheet fixing apparatus
Patent number
11,664,248
Issue date
May 30, 2023
Disco Corporation
Yoshinobu Saito
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protective sheet application apparatus and method
Patent number
11,651,978
Issue date
May 16, 2023
Disco Corporation
Kazuma Sekiya
B32 - LAYERED PRODUCTS
Information
Patent Grant
Photoelectric device
Patent number
11,640,913
Issue date
May 2, 2023
Ultra Display Technology Corp.
Hsien-Te Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reusable die catch materials, reusable die release materials, relat...
Patent number
11,615,972
Issue date
Mar 28, 2023
Kulicke and Soffa Industries, Inc.
Thomas Colosimo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die ejector height adjustment
Patent number
11,600,516
Issue date
Mar 7, 2023
ASMPT SINGAPORE PTE. LTD.
Chi Wah Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cold fluid semiconductor device release during pick and place opera...
Patent number
11,594,432
Issue date
Feb 28, 2023
Micron Technology, Inc.
Jeremy E. Minnich
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Systems for direct transfer of semiconductor device die
Patent number
11,562,990
Issue date
Jan 24, 2023
Rohinni, Inc.
Andrew Huska
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device release during pick and place operations, and...
Patent number
11,562,922
Issue date
Jan 24, 2023
Micron Technology, Inc.
Andy E. Hooper
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of attaching die to substrate using compliant die attach sy...
Patent number
11,557,567
Issue date
Jan 17, 2023
Assembleon B.V.
Rudolphus H. Hoefs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plasma processing apparatus
Patent number
11,551,943
Issue date
Jan 10, 2023
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Tetsuhiro Iwai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, semiconductor manufacturing apparatus and met...
Patent number
11,552,021
Issue date
Jan 10, 2023
Fuji Electric Co., Ltd.
Yuhei Nishida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transferring of electronic components from a first to a second carrier
Patent number
11,545,374
Issue date
Jan 3, 2023
Muehlbauer GmbH & Co. KG
Marcel Freimuth
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LIGHT-EMITTING ELEMENT TRANSFER SYSTEM
Publication number
20240136208
Publication date
Apr 25, 2024
SAMSUNG DISPLAY CO., LTD.
Jeong Won HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME
Publication number
20240128098
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Young Hun KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP EJECTOR
Publication number
20240128097
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Hyeok KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT IRRADIATION APPARATUS, SUBSTRATE DEBONDING SYSTEM INCLUDING T...
Publication number
20240087921
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Jaehyuk CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING T...
Publication number
20240087923
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Minsung KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PROCESSING SEMICONDUCTOR WAFER
Publication number
20240087942
Publication date
Mar 14, 2024
ROHM CO., LTD.
Ryosuke YAMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TAPE AFFIXING APPARATUS
Publication number
20240087922
Publication date
Mar 14, 2024
Tokyo Seimitsu Co., Ltd.
Kiyotaka KIZAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE TAPE SHEET, METHOD OF MANUFACTURING THE SAME AND METHOD OF...
Publication number
20240079260
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
Hansol Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PEELING SYSTEM AND PEELING METHOD FOR FLEXIBLE FINGERPRINT COMPONENT
Publication number
20240075732
Publication date
Mar 7, 2024
BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
Yi DAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH CHIPS, AND SUBSTRATE PROCES...
Publication number
20240079403
Publication date
Mar 7, 2024
TOKYO ELECTRON LIMITED
Yoshihisa MATSUBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
Publication number
20240071789
Publication date
Feb 29, 2024
KIOXIA Corporation
Shoma OMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DE-TAPE TOOL
Publication number
20240055280
Publication date
Feb 15, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen Liang Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
A METHOD FOR FABRICATING SEMICONDUCTOR ARTICLES AND SYSTEM THEREOF
Publication number
20240038525
Publication date
Feb 1, 2024
Inari Technology Sdn Bhd
BOON SENG TEOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PICK-AND-PLACE APPARATUS AND METHOD
Publication number
20240030053
Publication date
Jan 25, 2024
NEXPERIA B.V.
Steven Verstoep
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE PROCESSING
Publication number
20240021572
Publication date
Jan 18, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP WET TRANSFER APPARATUS
Publication number
20240006199
Publication date
Jan 4, 2024
Samsung Electronics Co., Ltd.
Hyunjoon KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BRIDGE APPARATUS AND METHOD FOR SEMICONDUCTOR DIE TRANSFER
Publication number
20230411185
Publication date
Dec 21, 2023
Rohinni, LLC
Nicholas Steven Busch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REMOVAL METHOD, REMOVAL TOOL AND SEMICONDUCTOR COMPONENT
Publication number
20230402300
Publication date
Dec 14, 2023
ams-OSRAM International GmbH
Michael ZITZLSPERGER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TAPE AFFIXING APPARATUS AND TAPE MAGAZINE
Publication number
20230402301
Publication date
Dec 14, 2023
Tokyo Seimitsu Co., Ltd.
Kiyotaka KIZAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING APPARATUS AND SEMICONDUCTOR PAC...
Publication number
20230395404
Publication date
Dec 7, 2023
Samsung Electronics Co., Ltd.
Woo Ram MYUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF DETECTING PROCESS DEVIATIONS DURING MICROELECTRONIC DEVI...
Publication number
20230395419
Publication date
Dec 7, 2023
Micron Technology, Inc.
Ankur Harish Shah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR MULTIPLE AXIS DIRECT TRANSFERS OF SEMICOND...
Publication number
20230377917
Publication date
Nov 23, 2023
Rohinni, LLC
Sean Kupcow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PEELING APARATUS AND CHIP PEELING METHOD
Publication number
20230369078
Publication date
Nov 16, 2023
Samsung Electronics Co., Ltd.
Tatsuya ISHIMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE PLACEMENT FOR VARACTORS IN ANTENNAS AND METHOD FOR SAME
Publication number
20230360935
Publication date
Nov 9, 2023
Kymeta Corporation
Steven Howard Linn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO-TRANSFER PRINTING FROM ADHESIVE SURFACES
Publication number
20230356520
Publication date
Nov 9, 2023
X-CELEPRINT LIMITED
Prasanna Ramaswamy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
Publication number
20230352324
Publication date
Nov 2, 2023
SHINKAWA LTD.
Kohei SEYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PARALLELISM-ADJUSTABLE BONDING MACHINE
Publication number
20230352323
Publication date
Nov 2, 2023
JING-CHENG LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Device Transfer Method, Device Transfer Machine, Target Object Tran...
Publication number
20230343625
Publication date
Oct 26, 2023
Shin-Etsu Chemical Co., Ltd.
Hiroshi Yamaoka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TAPE STICKING SYSTEM, TAPE STICKING METHOD, TAPE PEELING SYSTEM, AN...
Publication number
20230317501
Publication date
Oct 5, 2023
EBARA CORPORATION
Kenya ITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP BONDING SYSTEM AND CHIP BONDING METHOD
Publication number
20230307284
Publication date
Sep 28, 2023
BONDTECH CO., LTD.
Akira YAMAUCHI
H01 - BASIC ELECTRIC ELEMENTS