Applying energy for connecting

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H01L2224/832

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/832Applying energy for connecting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Driving backplane, transfer method for light-emitting diode chip, d...
- Patent number 12,368,144
- Issue date Jul 22, 2025
- BOE Technology Group Co., Ltd.
- Zhijun Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer sheet for mold underfill encapsulation, method for mold...
- Patent number 12,362,310
- Issue date Jul 15, 2025
- Nagase Chemtex Corporation
- Daisuke Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electric device
- Patent number 12,349,505
- Issue date Jul 1, 2025
- Electronics and Telecommunications Research Institute
- Jiho Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a conductive layer on an IC using non-lithogr...
- Patent number 12,347,800
- Issue date Jul 1, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Ken Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 12,347,803
- Issue date Jul 1, 2025
- Toray Engineering Co., Ltd.
- Katsumi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semifinished product for populating with components and, method for...
- Patent number 12,341,127
- Issue date Jun 24, 2025
- Siemens Aktiengesellschaft
- Nora Jeske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing display device using semiconductor light em...
- Patent number 12,328,979
- Issue date Jun 10, 2025
- LG Electronics Inc.
- Mihee Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and apparatus for manufactu...
- Patent number 12,308,259
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Dong Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid metal foam thermal interface material
- Patent number 12,300,567
- Issue date May 13, 2025
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,667
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- YeongBeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having connection unit
- Patent number 12,300,596
- Issue date May 13, 2025
- Samsung Display Co., Ltd.
- Myongsoo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for semiconductor circuit connection, adhesive...
- Patent number 12,286,564
- Issue date Apr 29, 2025
- LG Chem, Ltd.
- Youngsam Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing laminate
- Patent number 12,288,768
- Issue date Apr 29, 2025
- Lintec Corporation
- Isao Ichikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Flexible electronic structure
- Patent number 12,283,561
- Issue date Apr 22, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing nitride mesas each intended to form an electro...
- Patent number 12,278,224
- Issue date Apr 15, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Guy Feuillet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 12,272,667
- Issue date Apr 8, 2025
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate layered body and layered body
- Patent number 12,261,143
- Issue date Mar 25, 2025
- Mitsui Chemicals, Inc.
- Yasuhisa Kayaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressing group for a sintering press for sintering electronic compo...
- Patent number 12,257,801
- Issue date Mar 25, 2025
- AMX—AUTOMATRIX S.R.L.
- Nicola Schivalocchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package structure with stacked semiconductor dies
- Patent number 12,255,155
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,243,844
- Issue date Mar 4, 2025
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,243,861
- Issue date Mar 4, 2025
- LG Electronics Inc.
- Dohan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure including a support element
- Patent number 12,237,289
- Issue date Feb 25, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro-LED, and manufacturing method therefor
- Patent number 12,230,617
- Issue date Feb 18, 2025
- LG Electronics Inc.
- Bongchu Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, and semiconductor pa...
- Patent number 12,230,580
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible hybrid electronic system processing method and flexible hy...
- Patent number 12,224,246
- Issue date Feb 11, 2025
- Peking University
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,088
- Issue date Feb 4, 2025
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 12,211,818
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 12,205,870
- Issue date Jan 21, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Heterogeneous annealing method and device
- Patent number 12,199,069
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE SINTERING METHOD AND CORRESPONDING PRESSURE SINTERING APPA...
- Publication number 20250239565
- Publication date Jul 24, 2025
- BOSCHMAN TECHNOLOGIES B.V.
- Franciscus Gerardus Johannes BOSCHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BAKING SYSTEM FOR PROCESSING UNIT ASSEMBLY
- Publication number 20250239562
- Publication date Jul 24, 2025
- ZT Group Int’l, Inc. dba ZT Systems
- Sruti Chigullapalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233107
- Publication date Jul 17, 2025
- Fuji Electric Co., Ltd.
- Ryotaro TSURUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...
- Publication number 20250226243
- Publication date Jul 10, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dong Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING...
- Publication number 20250226359
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT FORMATION METHOD AND ELECTRICAL CIRCUIT FORMATIO...
- Publication number 20250226357
- Publication date Jul 10, 2025
- FUJI CORPORATION
- Ryo SAKAKIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE
- Publication number 20250219004
- Publication date Jul 3, 2025
- NITTO DENKO CORPORATION
- Masatoshi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBS...
- Publication number 20250219020
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Junho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250219007
- Publication date Jul 3, 2025
- Mitsubishi Electric Corporation
- Hiroya SANNAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210576
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250210577
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Yutaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...
- Publication number 20250197687
- Publication date Jun 19, 2025
- Resonac Corporation
- Yui KUNITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND BYPRODUCT OF SEMICONDUCTOR COMP...
- Publication number 20250201752
- Publication date Jun 19, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250191984
- Publication date Jun 12, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED CHIP REWORK DEVICE AND REWORK METHOD USING TRANSFER METHOD
- Publication number 20250194319
- Publication date Jun 12, 2025
- LASERSSEL CO.,LTD
- Jae Joon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES
- Publication number 20250174578
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER TRANSFER OF MICROELECTRONIC DEVICE AND ASSOCIATED CONDUCTIVE PAD
- Publication number 20250167170
- Publication date May 22, 2025
- COHERENT LASERSYSTEMS GMBH & CO. KG
- Muhammad FATAHILAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING...
- Publication number 20250157976
- Publication date May 15, 2025
- Resonac Corporation
- Tomoyo KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING RADIO-FREQUENCY MULTI-LAYER CIRCUITS ON FUSED...
- Publication number 20250157954
- Publication date May 15, 2025
- GE AVIATION SYSTEMS LIMITED
- Robert James MacDonald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20250149510
- Publication date May 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITAL SIGNAL PROCESSOR TO PHOTONICS INTERFACE
- Publication number 20250149521
- Publication date May 8, 2025
- MaxLinear, Inc.
- Abdelkrim El Amili
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR PRESSURE BONDING, SEMICONDUCTOR DEVICE, METHOD FOR...
- Publication number 20250149492
- Publication date May 8, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
- Publication number 20250140709
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20250132299
- Publication date Apr 24, 2025
- InnoLux Corporation
- Yuan-Lin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132276
- Publication date Apr 24, 2025
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...
- Publication number 20250132302
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kwun-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER
- Publication number 20250125302
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
- Publication number 20250112198
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyasha Mohapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...
- Publication number 20250112195
- Publication date Apr 3, 2025
- EPISTAR CORPORATION
- Wen-Chien WU
- H01 - BASIC ELECTRIC ELEMENTS

Applying energy for connecting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Driving backplane, transfer method for light-emitting diode chip, d...

Multi-layer sheet for mold underfill encapsulation, method for mold...

Method of manufacturing electric device

Method of fabricating a conductive layer on an IC using non-lithogr...

Mounting device and mounting method

Semifinished product for populating with components and, method for...

Method of manufacturing display device using semiconductor light em...

Method for manufacturing display device and apparatus for manufactu...

Solid metal foam thermal interface material

Semiconductor package and method of fabricating the same

Display device having connection unit

Adhesive composition for semiconductor circuit connection, adhesive...

Method of manufacturing laminate

Flexible electronic structure

Method for producing nitride mesas each intended to form an electro...

Adhesive member, display device, and manufacturing method of displa...

Method of manufacturing substrate layered body and layered body

Pressing group for a sintering press for sintering electronic compo...

Package structure with stacked semiconductor dies

Display device and method of manufacturing the same

Display device using micro LED, and manufacturing method therefor

Flexible electronic structure including a support element

Display device using micro-LED, and manufacturing method therefor

Method of manufacturing semiconductor package, and semiconductor pa...

Flexible hybrid electronic system processing method and flexible hy...

Semiconductor device

Manufacturing method of semiconductor package using jig

Semiconductor package and method for fabricating a semiconductor pa...

Selective micro device transfer to receiver substrate

Heterogeneous annealing method and device

Patents Applicationslast 30 patents

PRESSURE SINTERING METHOD AND CORRESPONDING PRESSURE SINTERING APPA...

BAKING SYSTEM FOR PROCESSING UNIT ASSEMBLY

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING...

ELECTRICAL CIRCUIT FORMATION METHOD AND ELECTRICAL CIRCUIT FORMATIO...

CONNECTING STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBS...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...

SEMICONDUCTOR PACKAGE STRUCTURE AND BYPRODUCT OF SEMICONDUCTOR COMP...

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

MICRO-LED CHIP REWORK DEVICE AND REWORK METHOD USING TRANSFER METHOD

SELECTIVE TRANSFER OF MICRO DEVICES

PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES

LASER TRANSFER OF MICROELECTRONIC DEVICE AND ASSOCIATED CONDUCTIVE PAD

FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING...

METHOD OF FABRICATING RADIO-FREQUENCY MULTI-LAYER CIRCUITS ON FUSED...

HETEROGENEOUS ANNEALING METHOD AND DEVICE

DIGITAL SIGNAL PROCESSOR TO PHOTONICS INTERFACE

COPPER PASTE FOR PRESSURE BONDING, SEMICONDUCTOR DEVICE, METHOD FOR...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...

LIGHT EMITTING DEVICE

SEMICONDUCTOR DEVICE

HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...

SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER

IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY

SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...