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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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Patents Grants
last 30 patents
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Patent Grant
Structure and formation method of chip package with protective lid
Patent number
11,978,715
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Meng-Tsung Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Energy augmentation structures, and their use in adhesive bonding
Patent number
11,964,166
Issue date
Apr 23, 2024
Immunolight, LLC
Frederic A Bourke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Energy augmentation structures for use with energy emitters and col...
Patent number
11,964,167
Issue date
Apr 23, 2024
Immunolight, LLC
Frederic A Bourke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive composition, film-like adhesive and production method ther...
Patent number
11,952,513
Issue date
Apr 9, 2024
Furukawa Electric Co., Ltd.
Minoru Morita
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Conductive feature with non-uniform critical dimension and method o...
Patent number
11,935,816
Issue date
Mar 19, 2024
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including binding agent adhering an integrated...
Patent number
11,929,345
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low warpage curing methodology by inducing curvature
Patent number
11,929,260
Issue date
Mar 12, 2024
Applied Materials, Inc.
Fang Jie Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film and connected structure
Patent number
11,923,335
Issue date
Mar 5, 2024
Dexerials Corporation
Seiichiro Shinohara
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Adhesive member, display device, and manufacturing method of displa...
Patent number
11,923,330
Issue date
Mar 5, 2024
Samsung Display Co., Ltd.
Jung Hoon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic electrically conductive film
Patent number
11,923,333
Issue date
Mar 5, 2024
Dexerials Corporation
Yasushi Akutsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for repairing a light-emitting device and a method for manuf...
Patent number
11,916,041
Issue date
Feb 27, 2024
ASTI GLOBAL INC., TAIWAN
Chien-Shou Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Profiled thermode
Patent number
11,910,533
Issue date
Feb 20, 2024
Pragmatic Printing Ltd
Neil Davies
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit package and method of forming same
Patent number
11,908,829
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Yao-Te Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer substrate
Patent number
11,901,325
Issue date
Feb 13, 2024
Dexerials Corporation
Seiichiro Shinohara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
Patent number
11,894,337
Issue date
Feb 6, 2024
Mitsubishi Electric Corporation
Keisuke Kawamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device manufacturing method
Patent number
11,887,975
Issue date
Jan 30, 2024
Daicel Corporation
Naoko Tsuji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
11,874,705
Issue date
Jan 16, 2024
LG Display Co., Ltd.
Mose Lee
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Die stack and integrated device structure including improved bondin...
Patent number
11,869,859
Issue date
Jan 9, 2024
Taiwan Semiconductor Manufacturing Company Limited
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
Patent number
11,855,065
Issue date
Dec 26, 2023
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and method of transferring electronic element usi...
Patent number
11,848,303
Issue date
Dec 19, 2023
Seoul National University R&DB Foundation
Yongtaek Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device having connection unit
Patent number
11,830,802
Issue date
Nov 28, 2023
Samsung Display Co., Ltd.
Myongsoo Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor manufacturing apparatus, and method of manufacturing...
Patent number
11,823,924
Issue date
Nov 21, 2023
Kioxia Corporation
Aoi Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Foldable display device and foldable electronic device
Patent number
11,824,050
Issue date
Nov 21, 2023
Innolux Corporation
Yuan-Lin Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sintering press for sintering electronic components on a substrate
Patent number
11,820,095
Issue date
Nov 21, 2023
AMX—AUTOMATRIX S.R.L.
Nicola Schivalocchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for fabricating semiconductor device with stacked dies
Patent number
11,824,047
Issue date
Nov 21, 2023
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
Patent number
11,817,415
Issue date
Nov 14, 2023
Nitto Denko Corporation
Satoshi Honda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor package using jig
Patent number
11,804,468
Issue date
Oct 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,792,941
Issue date
Oct 17, 2023
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
11,791,314
Issue date
Oct 17, 2023
Samsung Electronics Co., Ltd.
Seoeun Kyung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermosetting resin composition, semiconductor device, and electric...
Patent number
11,784,153
Issue date
Oct 10, 2023
Kyocera Corporation
Masakazu Fujiwara
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FERROMAGNETIC CONTROL OF WAFER BONDING
Publication number
20240153910
Publication date
May 9, 2024
MICRON TECHNOLGY, INC.
Andrew M. BAYLESS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240145417
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Hyeongwoo JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUT...
Publication number
20240145421
Publication date
May 2, 2024
SOLAR APPLIED MATERIALS TECHNOLOGY CORP.
Kuan-Neng CHEN
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20240145430
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yao-Te Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE COMPONENT
Publication number
20240136268
Publication date
Apr 25, 2024
Murata Manufacturing Co., Ltd.
Yoshiaki SATAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
Publication number
20240136325
Publication date
Apr 25, 2024
NHK Spring Co., Ltd.
Ryo TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
Publication number
20240136322
Publication date
Apr 25, 2024
LG Innotek Co., Ltd.
Tae Sup CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
Publication number
20240128224
Publication date
Apr 18, 2024
SAMSUNG DISPLAY CO., LTD.
Jung Hoon SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
Publication number
20240128227
Publication date
Apr 18, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Perceval COUDRAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
Publication number
20240128254
Publication date
Apr 18, 2024
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTOR...
Publication number
20240115878
Publication date
Apr 11, 2024
Immunolight, LLC
Frederic A. BOURKE
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
Publication number
20240120306
Publication date
Apr 11, 2024
UNITED MICROELECTRONICS CORP.
Kai-Kuang Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Fabricating a Power Semiconductor Device
Publication number
20240096842
Publication date
Mar 21, 2024
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...
Publication number
20240079365
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
Seungryong HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
Publication number
20240079371
Publication date
Mar 7, 2024
GLOBALFOUNDRIES U.S. Inc.
John C. MALINOWSKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20240071898
Publication date
Feb 29, 2024
Fuji Electric Co., Ltd.
Koji OSAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURED THROUGH A THERMOCOMPRESSION PROC...
Publication number
20240063167
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Hyunsoo CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240063096
Publication date
Feb 22, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Shigeki TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
Publication number
20240055422
Publication date
Feb 15, 2024
Fuji Electric Co., Ltd.
Tatsuo NISHIZAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
Publication number
20240047415
Publication date
Feb 8, 2024
NANO-X IMAGING LTD
Ukyo JEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packages with Liquid Metal as Heat-Dissipation Media and Method For...
Publication number
20240038627
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE
Publication number
20240038749
Publication date
Feb 1, 2024
InnoLux Corporation
Yuan-Lin WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED EMBEDDED DIE PACKAGE
Publication number
20240038619
Publication date
Feb 1, 2024
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20240030176
Publication date
Jan 25, 2024
Samsung Electronics Co., Ltd.
Ji-Yong PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM
Publication number
20240030181
Publication date
Jan 25, 2024
ASMPT SINGAPORE PTE. LTD
Jiapei DING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240014166
Publication date
Jan 11, 2024
Samsung Electronics Co., Ltd.
Youngdeuk KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20240008298
Publication date
Jan 4, 2024
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME
Publication number
20230420437
Publication date
Dec 28, 2023
Taiwan Semiconductor Manufacturing Company Limited
Chieh-Yen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CU-CU DIRECT WELDING FOR PACKAGING APPLICATION IN SEMICONDUCTOR IND...
Publication number
20230411347
Publication date
Dec 21, 2023
The University of Hong Kong
Mingxin Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE FOR HIGH-FREQUENCY USE AND METHOD FOR MANUFACTURING TH...
Publication number
20230411334
Publication date
Dec 21, 2023
BOARDTEK ELECTRONICS CORPORATION
CHIEN-CHENG LEE
H01 - BASIC ELECTRIC ELEMENTS