Applying energy for connecting

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H01L2224/842

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/842Applying energy for connecting

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and production method for semiconductor device
- Patent number 12,062,634
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging device, chip packaging method, and package chip
- Patent number 11,764,184
- Issue date Sep 19, 2023
- HOSIN GLOBAL ELECTRONICS CO., LTD
- Chen-Nan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density and durable semiconductor device interconnect
- Patent number 11,756,923
- Issue date Sep 12, 2023
- Infineon Technologies AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with laser-welded leadframe
- Patent number 11,749,633
- Issue date Sep 5, 2023
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a laser-connected terminal
- Patent number 11,664,342
- Issue date May 30, 2023
- Fuji Electric Co., Ltd.
- Shinji Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for die and clip attachment
- Patent number 11,289,447
- Issue date Mar 29, 2022
- Alpha Assembly Solutions, Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a composite material clip
- Patent number 10,971,457
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid top terminal for discrete power devices
- Patent number 10,872,846
- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode terminal, semiconductor device, and power conversion appa...
- Patent number 10,714,447
- Issue date Jul 14, 2020
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and conductive member for semiconductor module...
- Patent number 10,475,667
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method for the same
- Patent number 10,381,244
- Issue date Aug 13, 2019
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,199,347
- Issue date Feb 5, 2019
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising fluid cooling channel and method of ma...
- Patent number 10,037,972
- Issue date Jul 31, 2018
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing power module
- Patent number 9,673,118
- Issue date Jun 6, 2017
- Mitsubishi Electric Corporation
- Masaki Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with adhesive material pre-printed on the lea...
- Patent number 9,653,424
- Issue date May 16, 2017
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacturing electronic component
- Patent number 9,627,342
- Issue date Apr 18, 2017
- Fuji Electric Co., Ltd.
- Takashi Saito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing semiconductor device
- Patent number 9,468,993
- Issue date Oct 18, 2016
- Fuji Electric Co., Ltd.
- Toshiyuki Miyasaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor strip with contact areas having cutouts
- Patent number 9,406,592
- Issue date Aug 2, 2016
- Continental Automotive GmbH
- Nico Kohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,401,319
- Issue date Jul 26, 2016
- Mitsubishi Electric Corporation
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 9,379,049
- Issue date Jun 28, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroki Ikeuchi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device with specific lead frame for a power semicondu...
- Patent number 9,136,209
- Issue date Sep 15, 2015
- Fuji Electric Co., Ltd.
- Toshiyuki Miyasaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monolithic power converter package
- Patent number 9,041,175
- Issue date May 26, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 8,952,551
- Issue date Feb 10, 2015
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic Power Converter Package with Through Substrate vias
- Patent number 8,901,742
- Issue date Dec 2, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including underfill layers
- Patent number 8,816,509
- Issue date Aug 26, 2014
- Samsung Electronics Co., Ltd.
- Ji-Seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding systems and methods of using the same
- Patent number 8,746,537
- Issue date Jun 10, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240105560
- Publication date Mar 28, 2024
- ROHM CO., LTD.
- Yasuhiro TAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEX BONDED INTEGRATED CIRCUITS
- Publication number 20230299035
- Publication date Sep 21, 2023
- META PLATFORMS, INC.
- Sandeep Rekhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...
- Publication number 20230290765
- Publication date Sep 14, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET
- Publication number 20230154889
- Publication date May 18, 2023
- Fuji Electric Co., Ltd.
- Manabu ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20230114535
- Publication date Apr 13, 2023
- STMicroelectronics S.r.l
- Matteo DE SANTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230078615
- Publication date Mar 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yasuaki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY AND DURABLE SEMICONDUCTOR DEVICE INTERCONNECT
- Publication number 20230063259
- Publication date Mar 2, 2023
- INFINEON TECHNOLOGIES AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Laser-Welded Leadframe
- Publication number 20220406745
- Publication date Dec 22, 2022
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20220302071
- Publication date Sep 22, 2022
- Rohm Co., Ltd.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LASER-CONNECTED TERMINAL
- Publication number 20210407955
- Publication date Dec 30, 2021
- Fuji Electric Co., Ltd.
- Shinji TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407954
- Publication date Dec 30, 2021
- Rohm Co., Ltd.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A COMPOSITE MATERIAL CLIP
- Publication number 20190333874
- Publication date Oct 31, 2019
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Die and Clip Attachment
- Publication number 20180166415
- Publication date Jun 14, 2018
- Alpha Assembly Solutions Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module comprising fluid cooling channel and method of ma...
- Publication number 20160322333
- Publication date Nov 3, 2016
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT AND METHOD FOR PRODUCING THE SEMICONDUCTOR CI...
- Publication number 20150357303
- Publication date Dec 10, 2015
- CONTINENTAL AUTOMOTIVE GMBH
- Nico Kohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE...
- Publication number 20140203420
- Publication date Jul 24, 2014
- Fuji Electric Co., Ltd.
- Toshiyuki Miyasaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20140048584
- Publication date Feb 20, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...
- Publication number 20140042624
- Publication date Feb 13, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20140001636
- Publication date Jan 2, 2014
- Fuji Electric Co., Ltd.
- Takashi SAITO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130307130
- Publication date Nov 21, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20130285221
- Publication date Oct 31, 2013
- FUJI ELECTRIC CO., LTD.
- Toshiyuki Miyasaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL BONDING APPARATUS
- Publication number 20130284794
- Publication date Oct 31, 2013
- Sanyo Electric Co., Ltd.
- Takashi SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Monolithic Power Converter Package with Through Substrate Vias
- Publication number 20130256905
- Publication date Oct 3, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monolithic Power Converter Package
- Publication number 20130257524
- Publication date Oct 3, 2013
- INTERNATIONAL RECTIFIER CORPORATION (EL SEGUNDO, CA)
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130207252
- Publication date Aug 15, 2013
- RENESAS ELECTRONICS CORPORATION
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20130193588
- Publication date Aug 1, 2013
- Samsung Electronics Co., Ltd.
- Ji-Seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small-Outline Package for a Power Transistor
- Publication number 20130049079
- Publication date Feb 28, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Jorge Munoz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130009300
- Publication date Jan 10, 2013
- Renesas Electronics Corporation
- Yuichi Yato
- H01 - BASIC ELECTRIC ELEMENTS

Applying energy for connecting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and production method for semiconductor device

Semiconductor device

Substrate bonding apparatus and method of manufacturing a semicondu...

Chip packaging device, chip packaging method, and package chip

High density and durable semiconductor device interconnect

Power semiconductor module with laser-welded leadframe

Semiconductor device with a laser-connected terminal

Method for die and clip attachment

Semiconductor device comprising a composite material clip

Solid top terminal for discrete power devices

Electrode terminal, semiconductor device, and power conversion appa...

Package with vertical interconnect between carrier and clip

Semiconductor module and conductive member for semiconductor module...

Power module and fabrication method for the same

Semiconductor device

Electronic module comprising fluid cooling channel and method of ma...

Power module and method of manufacturing power module

Semiconductor package with adhesive material pre-printed on the lea...

Semiconductor module

Electronic component and method of manufacturing electronic component

Method for producing semiconductor device

Conductor strip with contact areas having cutouts

Semiconductor device

Semiconductor apparatus

Semiconductor device with specific lead frame for a power semicondu...

Monolithic power converter package

Semiconductor package and method for fabricating the same

Monolithic Power Converter Package with Through Substrate vias

Semiconductor package including underfill layers

Ultrasonic bonding systems and methods of using the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

FLEX BONDED INTEGRATED CIRCUITS

INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

HIGH DENSITY AND DURABLE SEMICONDUCTOR DEVICE INTERCONNECT

Power Semiconductor Module with Laser-Welded Leadframe

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...

SEMICONDUCTOR DEVICE WITH A LASER-CONNECTED TERMINAL

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE COMPRISING A COMPOSITE MATERIAL CLIP

Method for Die and Clip Attachment

Electronic module comprising fluid cooling channel and method of ma...

SEMICONDUCTOR CIRCUIT AND METHOD FOR PRODUCING THE SEMICONDUCTOR CI...

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE...

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

METAL BONDING APPARATUS

Monolithic Power Converter Package with Through Substrate Vias

Monolithic Power Converter Package

Semiconductor Device

SEMICONDUCTOR PACKAGE

Small-Outline Package for a Power Transistor

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME