applying isostatic pressure

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H01L2224/83209

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83209applying isostatic pressure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,742,321
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for bonding and electrical contact for direct bond hybrid...
- Patent number 11,508,684
- Issue date Nov 22, 2022
- Raytheon Company
- Jonathan Getty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,031,369
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 10,497,667
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering device
- Patent number 10,483,229
- Issue date Nov 19, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of bonding a substrate to a semiconductor light emitting device
- Patent number 10,158,049
- Issue date Dec 18, 2018
- Lumileds LLC
- Grigoriy Basin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum thermal bonding apparatus
- Patent number 9,451,708
- Issue date Sep 20, 2016
- MIKADO TECHNOS CO., LTD.
- Takashi Ito
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing electronic device and electronic device
- Patent number 9,391,031
- Issue date Jul 12, 2016
- Fujitsu Limited
- Tetsuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 9,385,103
- Issue date Jul 5, 2016
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, block stacked body, a...
- Patent number 9,349,714
- Issue date May 24, 2016
- Sumitomo Bakelite Co., Ltd.
- Kensuke Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for chip pressing
- Patent number 9,196,600
- Issue date Nov 24, 2015
- Ableprint Technology Co., Ltd.
- Chih-Horng Horng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixing semiconductor die in dry and pressure supported assembly pro...
- Patent number 8,999,758
- Issue date Apr 7, 2015
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collective mounting method of electronic components and manufacturi...
- Patent number 8,544,167
- Issue date Oct 1, 2013
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting method using dilatancy fluid
- Patent number 8,296,939
- Issue date Oct 30, 2012
- Sony Chemical & Information Device Corporation
- Kazutaka Furuta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip mounting method, flip-chip mounting apparatus and tool pr...
- Patent number 8,163,599
- Issue date Apr 24, 2012
- Panasonic Corporation
- Yoshihiro Tomura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mounting method
- Patent number 8,048,254
- Issue date Nov 1, 2011
- Sony Chemical & Information Device Corporation
- Takashi Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting method of electronic components, manufacturing method of e...
- Patent number 7,906,370
- Issue date Mar 15, 2011
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive-coated electronic parts on a connection sheet
- Patent number 6,841,022
- Issue date Jan 11, 2005
- Hitachi Chemical Company, Ltd.
- Isao Tsukagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for providing void-free layers for semiconductor assemblies
- Patent number 6,780,747
- Issue date Aug 24, 2004
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for providing void-free layers for semiconductor assemblies
- Patent number 6,653,172
- Issue date Nov 25, 2003
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting a plurality of electronic parts on a circuit board
- Patent number 6,479,757
- Issue date Nov 12, 2002
- Hitachi Chemical Company, Ltd.
- Isao Tsukagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for providing void free layer for semiconductor assemblies
- Patent number 6,458,681
- Issue date Oct 1, 2002
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting a plurality of electronic parts on a circuit board
- Patent number 6,158,115
- Issue date Dec 12, 2000
- Hitachi Chemical Company, Ltd.
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for providing void-free layers for semiconductor assemblies
- Patent number 6,107,123
- Issue date Aug 22, 2000
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for providing void-free layers for semiconductor assemblies
- Patent number 5,834,339
- Issue date Nov 10, 1998
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for self-alignment and planarization of semiconductor chips...
- Patent number 5,352,629
- Issue date Oct 4, 1994
- General Electric Company
- Kyung W. Paik
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20210272928
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR BONDING AND ELECTRICAL CONTACT FOR DIRECT BOND HYBRID...
- Publication number 20210210455
- Publication date Jul 8, 2021
- Raytheon Company
- Jonathan Getty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20200051950
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...
- Publication number 20170243851
- Publication date Aug 24, 2017
- ATV TECHNOLOGIE GMBH
- Ventzeslav RANGELOV
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Chip-To-Wafer Integration
- Publication number 20160155720
- Publication date Jun 2, 2016
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING WEIGHT
- Publication number 20140312102
- Publication date Oct 23, 2014
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sintering Utilizing Non-Mechanical Pressure
- Publication number 20140224409
- Publication date Aug 14, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF BONDING A SUBSTRATE TO A SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20140193931
- Publication date Jul 10, 2014
- Koninklijke Philips N.V.
- Grigoriy Basin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, BLOCK STACKED BODY, A...
- Publication number 20140183758
- Publication date Jul 3, 2014
- SUMITOMO BAKELITE CO., LTD.
- Kensuke Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20140084491
- Publication date Mar 27, 2014
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM THERMAL BONDING APPARATUS AND VACUUM THERMAL BONDING METHOD
- Publication number 20140033518
- Publication date Feb 6, 2014
- MIKADO TECHNOS CO., LTD.
- Takashi Ito
- B32 - LAYERED PRODUCTS
Information Patent Application
Device and Method for Chip Pressing
- Publication number 20130240115
- Publication date Sep 19, 2013
- Ableprint Technology Co., Ltd., a Taiwan Corporation
- Chih-Horng Horng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fixing Semiconductor Die in Dry and Pressure Supported Assembly Pro...
- Publication number 20130040424
- Publication date Feb 14, 2013
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD
- Publication number 20120279653
- Publication date Nov 8, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND A...
- Publication number 20120199988
- Publication date Aug 9, 2012
- SUMITOMO BAKELITE CO., LTD.
- Toru Meura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Printed Circuit Board Assembly Manufacturing Device And Method
- Publication number 20120018084
- Publication date Jan 26, 2012
- Samsung Electronics Co., Ltd.
- Kyung Woon Jang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLIP-CHIP MOUNTING METHOD, FLIP-CHIP MOUNTING APPARATUS AND TOOL PR...
- Publication number 20110020983
- Publication date Jan 27, 2011
- PANASONIC CORPORATION
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE, MOUNTING METHOD, PACKAGE, AND PRESSURIZING PLATE
- Publication number 20100085723
- Publication date Apr 8, 2010
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazutaka FURUTA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOUNTING METHOD
- Publication number 20090038753
- Publication date Feb 12, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B30 - PRESSES
Information Patent Application
Method for bonding electronic components
- Publication number 20080283579
- Publication date Nov 20, 2008
- ABB Research Ltd.
- Satish Gunturi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Collective mounting method of electronic components and manufacturi...
- Publication number 20080211143
- Publication date Sep 4, 2008
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting method of electronic components, manufacturing method of e...
- Publication number 20080211086
- Publication date Sep 4, 2008
- TDK Corporation
- Takaaki Morita
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus and clocked method for pressure-sintered bonding
- Publication number 20070131353
- Publication date Jun 14, 2007
- SEMIKRON Elektronik GmbH & Co. KG
- Christian Gobl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive-coated electronic parts on a connection sheet
- Publication number 20030029556
- Publication date Feb 13, 2003
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for providing void-free layers for semiconductor assemblies
- Publication number 20030027373
- Publication date Feb 6, 2003
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for providing void-free layers for semiconductor assemblies
- Publication number 20020094671
- Publication date Jul 18, 2002
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS

applying isostatic pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for bond wave propagation control

Structure for bonding and electrical contact for direct bond hybrid...

Apparatus for bond wave propagation control

Apparatus for bond wave propagation control

Sintering device

Method of bonding a substrate to a semiconductor light emitting device

Method and apparatus for chip-to-wafer integration

Vacuum thermal bonding apparatus

Method for manufacturing electronic device and electronic device

Semiconductor device manufacturing method

Method of manufacturing semiconductor device, block stacked body, a...

Device and method for chip pressing

Fixing semiconductor die in dry and pressure supported assembly pro...

Collective mounting method of electronic components and manufacturi...

Mounting method using dilatancy fluid

Flip-chip mounting method, flip-chip mounting apparatus and tool pr...

Mounting method

Mounting method of electronic components, manufacturing method of e...

Adhesive-coated electronic parts on a connection sheet

Methods for providing void-free layers for semiconductor assemblies

Methods for providing void-free layers for semiconductor assemblies

Method of mounting a plurality of electronic parts on a circuit board

Method for providing void free layer for semiconductor assemblies

Method of mounting a plurality of electronic parts on a circuit board

Methods for providing void-free layers for semiconductor assemblies

Methods for providing void-free layers for semiconductor assemblies

Process for self-alignment and planarization of semiconductor chips...

Patents Applicationslast 30 patents

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

STRUCTURE FOR BONDING AND ELECTRICAL CONTACT FOR DIRECT BOND HYBRID...

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...

Method and Apparatus for Chip-To-Wafer Integration

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING WEIGHT

Sintering Utilizing Non-Mechanical Pressure

METHOD OF BONDING A SUBSTRATE TO A SEMICONDUCTOR LIGHT EMITTING DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, BLOCK STACKED BODY, A...

METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

VACUUM THERMAL BONDING APPARATUS AND VACUUM THERMAL BONDING METHOD

Device and Method for Chip Pressing

Fixing Semiconductor Die in Dry and Pressure Supported Assembly Pro...

HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD

METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND A...

Printed Circuit Board Assembly Manufacturing Device And Method

FLIP-CHIP MOUNTING METHOD, FLIP-CHIP MOUNTING APPARATUS AND TOOL PR...

MOUNTING DEVICE, MOUNTING METHOD, PACKAGE, AND PRESSURIZING PLATE

MOUNTING METHOD

Method for bonding electronic components

Collective mounting method of electronic components and manufacturi...

Mounting method of electronic components, manufacturing method of e...

Apparatus and clocked method for pressure-sintered bonding

Adhesive-coated electronic parts on a connection sheet

Methods for providing void-free layers for semiconductor assemblies

Methods for providing void-free layers for semiconductor assemblies