Number | Name | Date | Kind |
---|---|---|---|
3401126 | Miller et al. | Sep 1968 | |
3424040 | Miller et al. | Feb 1969 | |
3869787 | Umbaugh | Mar 1975 | |
3887760 | Krieger et al. | Jun 1975 | |
3919709 | Koenig | Nov 1975 | |
4783695 | Eichelberger et al. | Nov 1988 | |
4810671 | Bhattacharyya et al. | Mar 1989 | |
4933042 | Eichelberger et al. | Jun 1990 | |
5037778 | Stark et al. | Aug 1991 | |
5043296 | Hacke et al. | Aug 1991 | |
5051811 | Williams et al. | Sep 1991 | |
5101550 | Dunaway et al. | Apr 1992 | |
5181648 | Leicht | Jan 1993 |
Number | Date | Country |
---|---|---|
54-131872 | Oct 1979 | JPX |
1309343 | Dec 1989 | JPX |
414852 | Jan 1992 | JPX |
8803705 | May 1988 | WOX |
Entry |
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"Polyimide Preform for Polyimide Film Chip Carrier", Research Disclosure No. 283, Nov. 1987, Kenneth Mason Publications Ltd., England. |
"Alignment Fixture for MCM Assembly", Research Disclosure No. 332, Dec. 1991, Kenneth Mason Publications Ltd., England. |
Microelectronic Packaging Handbook, Edited by R. Tummala, et al 1989, Van Nostrand Reinhold, pp. 366-447. |
Electronic Packaging and Interconnection Handbook by C. A. Harper, 1991, McGraw-Hill, Inc., p. 7.21. |