applying unidirectional static pressure

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CPC
H01L2224/81208

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81208applying unidirectional static pressure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
- Patent number 11,011,490
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 10,515,918
- Issue date Dec 24, 2019
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 10,163,840
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Teck Kheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 10,141,218
- Issue date Nov 27, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a hybridized device including microelectronic c...
- Patent number 10,002,842
- Issue date Jun 19, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of self-confinement of conductive b...
- Patent number 9,899,286
- Issue date Feb 20, 2018
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip bonding method and solid-state image pickup device manufa...
- Patent number 9,685,478
- Issue date Jun 20, 2017
- Sharp Kabushiki Kaisha
- Naoki Sakota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of confining conductive bump materi...
- Patent number 9,679,811
- Issue date Jun 13, 2017
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality electrical contacts between integrated circuit chips
- Patent number 9,646,882
- Issue date May 9, 2017
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality electrical contacts between integrated circuit chips
- Patent number 9,490,212
- Issue date Nov 8, 2016
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device and electronic device
- Patent number 9,391,031
- Issue date Jul 12, 2016
- Fujitsu Limited
- Tetsuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump-on-lead interconnec...
- Patent number 9,385,101
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 9,385,024
- Issue date Jul 5, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of self-confinement of conductive b...
- Patent number 9,379,084
- Issue date Jun 28, 2016
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming narrow interconnect site...
- Patent number 9,258,904
- Issue date Feb 9, 2016
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming bump-on-lead interconnec...
- Patent number 9,064,858
- Issue date Jun 23, 2015
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of self-confinement of conductive b...
- Patent number 9,029,196
- Issue date May 12, 2015
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallurgical clamshell methods for micro land grid array fabrication
- Patent number 8,959,764
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a connection component with hollow inserts
- Patent number 8,898,896
- Issue date Dec 2, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature metal direct bonding
- Patent number 8,846,450
- Issue date Sep 30, 2014
- Ziptronix, Inc.
- Qin-yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method including deformation of supporting board to a...
- Patent number 8,748,229
- Issue date Jun 10, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor device with bristled conductiv...
- Patent number 8,735,274
- Issue date May 27, 2014
- Fujitsu Limited
- Masataka Mizukoshi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 8,669,173
- Issue date Mar 11, 2014
- Micron Technology
- Teck Kheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of confining conductive bump materi...
- Patent number 8,659,172
- Issue date Feb 25, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 8,651,363
- Issue date Feb 18, 2014
- Bondtech, Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallurgical clamshell methods for micro land grid array fabrication
- Patent number 8,651,877
- Issue date Feb 18, 2014
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect assemblies and methods of making and using same
- Patent number 8,633,601
- Issue date Jan 21, 2014
- Georgia Tech Research Corporation
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming packages
- Patent number 8,603,860
- Issue date Dec 10, 2013
- Taiwan Semiconductor Manufacturing Company, L.L.C.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump-on-lead interconnec...
- Patent number 8,574,959
- Issue date Nov 5, 2013
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING
- Publication number 20230058638
- Publication date Feb 23, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082856
- Publication date Mar 18, 2021
- Kioxia Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...
- Publication number 20190019774
- Publication date Jan 17, 2019
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELEC...
- Publication number 20180358320
- Publication date Dec 13, 2018
- Fujitsu Limited
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20150133001
- Publication date May 14, 2015
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20140370658
- Publication date Dec 18, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Connecting Element and Method for Manufacturing the Same
- Publication number 20140217593
- Publication date Aug 7, 2014
- National Chiao Tung University
- Chih CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Confining Conductive Bump Materi...
- Publication number 20140113446
- Publication date Apr 24, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20140084491
- Publication date Mar 27, 2014
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS
- Publication number 20140075747
- Publication date Mar 20, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOLD BONDING IN SEMICONDUCTOR DEVICES USING POROUS GOLD
- Publication number 20140061921
- Publication date Mar 6, 2014
- Alcatel-Lucent USA, Incorporated
- Nagesh Basavanhally
- G02 - OPTICS
Information Patent Application
Semiconductor Device and Method of Forming Bump-on-Lead Interconnec...
- Publication number 20140008792
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNEC...
- Publication number 20130277826
- Publication date Oct 24, 2013
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20130233473
- Publication date Sep 12, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...
- Publication number 20130234328
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Forming Packages
- Publication number 20130102112
- Publication date Apr 25, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20130072073
- Publication date Mar 21, 2013
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20120322202
- Publication date Dec 20, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Confining Conductive Bump Materi...
- Publication number 20120211882
- Publication date Aug 23, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Device and Method of Forming Narrow Interconnect Site...
- Publication number 20120208326
- Publication date Aug 16, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20120104603
- Publication date May 3, 2012
- Georgia Tech Research Corporation
- Nitesh Kumbhat
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT
- Publication number 20120104076
- Publication date May 3, 2012
- TADATOMO SUGA
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR MATERIAL BONDING
- Publication number 20110233792
- Publication date Sep 29, 2011
- IMEC
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Confining Conductive Bump Materi...
- Publication number 20110133334
- Publication date Jun 9, 2011
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20110111647
- Publication date May 12, 2011
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION COMPONENT WITH HOLLOW INSERTS AND METHOD FOR MAKING SAME
- Publication number 20110094789
- Publication date Apr 28, 2011
- COMMISSARIAT AL'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Francois Marion
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Device and Method of Self-Confinement of Conductive B...
- Publication number 20110084386
- Publication date Apr 14, 2011
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump-on-Lead Interconnec...
- Publication number 20110074024
- Publication date Mar 31, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110076801
- Publication date Mar 31, 2011
- Kabushiki Kaisha Toshiba
- Hideo Aoki
- H01 - BASIC ELECTRIC ELEMENTS

applying unidirectional static pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Assembly comprising hybrid interconnecting means including intermed...

Methods of fluxless micro-piercing of solder balls, and resulting d...

Methods of fluxless micro-piercing of solder balls, and resulting d...

Electronic device and method for producing an electronic device

Room temperature metal direct bonding

Method of producing a hybridized device including microelectronic c...

Semiconductor device and method of self-confinement of conductive b...

Flip-chip bonding method and solid-state image pickup device manufa...

Semiconductor device and method of confining conductive bump materi...

High quality electrical contacts between integrated circuit chips

High quality electrical contacts between integrated circuit chips

Method for manufacturing electronic device and electronic device

Semiconductor device and method of forming bump-on-lead interconnec...

Room temperature metal direct bonding

Semiconductor device and method of self-confinement of conductive b...

Semiconductor device and method of forming narrow interconnect site...

Semiconductor device and method of forming bump-on-lead interconnec...

Semiconductor device and method of self-confinement of conductive b...

Metallurgical clamshell methods for micro land grid array fabrication

Method of making a connection component with hollow inserts

Room temperature metal direct bonding

Manufacturing method including deformation of supporting board to a...

Manufacture method for semiconductor device with bristled conductiv...

Methods of fluxless micro-piercing of solder balls, and resulting d...

Semiconductor device and method of confining conductive bump materi...

Joining method and device produced by this method and joining unit

Metallurgical clamshell methods for micro land grid array fabrication

Interconnect assemblies and methods of making and using same

Process for forming packages

Semiconductor device and method of forming bump-on-lead interconnec...

Patents Applicationslast 30 patents

SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ROOM TEMPERATURE METAL DIRECT BONDING

METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...

ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELEC...

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

ROOM TEMPERATURE METAL DIRECT BONDING

Electrical Connecting Element and Method for Manufacturing the Same

Semiconductor Device and Method of Confining Conductive Bump Materi...

METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS

GOLD BONDING IN SEMICONDUCTOR DEVICES USING POROUS GOLD

Semiconductor Device and Method of Forming Bump-on-Lead Interconnec...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNEC...

ROOM TEMPERATURE METAL DIRECT BONDING

METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...

Process for Forming Packages

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

Semiconductor Device and Method of Confining Conductive Bump Materi...

Semiconductor Device and Method of Forming Narrow Interconnect Site...

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT

METHODS AND SYSTEMS FOR MATERIAL BONDING

Semiconductor Device and Method of Confining Conductive Bump Materi...

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

CONNECTION COMPONENT WITH HOLLOW INSERTS AND METHOD FOR MAKING SAME

Semiconductor Device and Method of Self-Confinement of Conductive B...

Semiconductor Device and Method of Forming Bump-on-Lead Interconnec...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE