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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/40091Arched

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module comprising a first and second connecting eleme...
- Patent number 11,837,571
- Issue date Dec 5, 2023
- Siemens Aktiengesellschaft
- Georg Zaiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bond solution for reducing thermal stress on an intermittent...
- Patent number 11,706,852
- Issue date Jul 18, 2023
- Illinois Tool Works Inc.
- Marco Carcano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,676,931
- Issue date Jun 13, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,462,504
- Issue date Oct 4, 2022
- Mitsubishi Electric Corporation
- Koichi Tokubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,270,969
- Issue date Mar 8, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having low on resistance
- Patent number 9,824,996
- Issue date Nov 21, 2017
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for producing an electronic module
- Patent number 9,768,035
- Issue date Sep 19, 2017
- Infineon Technologies AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacturing electronic component
- Patent number 9,627,342
- Issue date Apr 18, 2017
- Fuji Electric Co., Ltd.
- Takashi Saito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Monolithic Power Converter Package with Through Substrate vias
- Patent number 8,901,742
- Issue date Dec 2, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,816,514
- Issue date Aug 26, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,796,838
- Issue date Aug 5, 2014
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC/DC converter power module package incorporating a stacked contro...
- Patent number 8,679,896
- Issue date Mar 25, 2014
- National Semiconductor Corporation
- Rajeev Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,581,378
- Issue date Nov 12, 2013
- Panasonic Corporation
- Toshiyuki Yokoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-die electronic device with interposed electrically co...
- Patent number 8,519,546
- Issue date Aug 27, 2013
- STMicroelectronics S.R.L.
- Davide Giuseppe Patti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bonding material
- Patent number 8,513,534
- Issue date Aug 20, 2013
- Hitachi, Ltd.
- Toshiaki Morita
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Electronic device and method for connecting a die to a connection t...
- Patent number 8,513,811
- Issue date Aug 20, 2013
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component power structures and methods for forming the same
- Patent number 8,431,445
- Issue date Apr 30, 2013
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Brian Joseph Robert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with multiple semiconductor chips
- Patent number 8,410,591
- Issue date Apr 2, 2013
- Infineon Technologies AG
- Ralf Otremba
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,410,618
- Issue date Apr 2, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,378,467
- Issue date Feb 19, 2013
- Panasonic Corporation
- Chie Fujioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,378,468
- Issue date Feb 19, 2013
- Panasonic Corporation
- Chie Fujioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method for the production thereof
- Patent number 8,330,252
- Issue date Dec 11, 2012
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including semiconduct...
- Patent number 8,309,434
- Issue date Nov 13, 2012
- Denso Corporation
- Yasutomi Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,304,890
- Issue date Nov 6, 2012
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 8,294,258
- Issue date Oct 23, 2012
- Hitachi, Ltd.
- Katsunori Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,253,247
- Issue date Aug 28, 2012
- Renesas Electronics Corporation
- Noriko Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 8,252,632
- Issue date Aug 28, 2012
- Renesas Electronics Corporation
- Yuichi Yato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321813
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONN...
- Publication number 20240222311
- Publication date Jul 4, 2024
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS
- Publication number 20240113064
- Publication date Apr 4, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-In-One Lead Frame Package
- Publication number 20240071878
- Publication date Feb 29, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED STRUCTURE, ELECTRIC POWER CONTROL SYSTEM, AND MANUFACTURIN...
- Publication number 20230395556
- Publication date Dec 7, 2023
- Huawei Digital Power Technologies Co., Ltd.
- Zhihua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Accessible Metal Clips
- Publication number 20230048878
- Publication date Feb 16, 2023
- Hitachi Energy Switzerland AG
- Juergen Schuderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...
- Publication number 20220399300
- Publication date Dec 15, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND...
- Publication number 20220302073
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220148998
- Publication date May 12, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND SEMICONDUCTOR MODULE
- Publication number 20210288016
- Publication date Sep 16, 2021
- Fuji Electric Co., Ltd.
- Tadahiko SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20210280554
- Publication date Sep 9, 2021
- Mitsubishi Electric Corporation
- Koichi TOKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200388588
- Publication date Dec 10, 2020
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A FIRST AND SECOND CONNECTING ELEME...
- Publication number 20190348390
- Publication date Nov 14, 2019
- SIEMENS AKTIENGESELLSCHAFT
- Georg ZAISER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
- Publication number 20180090463
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT
- Publication number 20140374775
- Publication date Dec 25, 2014
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140332866
- Publication date Nov 13, 2014
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20140124565
- Publication date May 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20140084438
- Publication date Mar 27, 2014
- FUJI ELECTRIC CO., LTD.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20140001636
- Publication date Jan 2, 2014
- Fuji Electric Co., Ltd.
- Takashi SAITO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130313696
- Publication date Nov 28, 2013
- NIKO SEMICONDUCTOR CO., LTD.
- Chih-Cheng HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20130292834
- Publication date Nov 7, 2013
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monolithic Power Converter Package with Through Substrate Vias
- Publication number 20130256905
- Publication date Oct 3, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC/DC Converter Power Module Package Incorporating a Stacked Contro...
- Publication number 20130214399
- Publication date Aug 22, 2013
- National Semiconductor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130207252
- Publication date Aug 15, 2013
- RENESAS ELECTRONICS CORPORATION
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130020715
- Publication date Jan 24, 2013
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130009299
- Publication date Jan 10, 2013
- Renesas Electronics Corporation
- Keita TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC/DC CONVERTOR POWER MODULE PACKAGE INCORPORATING A STACKED CONTRO...
- Publication number 20120326287
- Publication date Dec 27, 2012
- National Semiconductor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Component Power Structures and Methods For Forming The Same
- Publication number 20120306105
- Publication date Dec 6, 2012
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Brian Joseph Robert
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module with a first substrate, a second substrate and...

Semiconductor module comprising a first and second connecting eleme...

Ribbon bond solution for reducing thermal stress on an intermittent...

Semiconductor package

Semiconductor apparatus

Semiconductor package

Die stack assembly using an edge separation structure for connectiv...

Die stack assembly using an edge separation structure for connectiv...

Semiconductor device having low on resistance

Electronic module and method for producing an electronic module

Electronic component and method of manufacturing electronic component

Monolithic Power Converter Package with Through Substrate vias

Microelectronic assembly with joined bond elements having lowered i...

Semiconductor device

DC/DC converter power module package incorporating a stacked contro...

Semiconductor device and method of manufacturing the same

Stacked multi-die electronic device with interposed electrically co...

Semiconductor device and bonding material

Electronic device and method for connecting a die to a connection t...

Multi-component power structures and methods for forming the same

Semiconductor module with multiple semiconductor chips

Microelectronic assembly with joined bond elements having lowered i...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Integrated circuit device and method for the production thereof

Method for manufacturing semiconductor device including semiconduct...

Semiconductor device

Power semiconductor module

Semiconductor device and method for manufacturing the same

Semiconductor device and manufacturing method of the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONN...

POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS

Two-In-One Lead Frame Package

PACKAGED STRUCTURE, ELECTRIC POWER CONTROL SYSTEM, AND MANUFACTURIN...

Power Semiconductor Module with Accessible Metal Clips

CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND...

SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...

SEMICONDUCTOR PACKAGE

WIRING STRUCTURE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR PACKAGE

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

SEMICONDUCTOR MODULE COMPRISING A FIRST AND SECOND CONNECTING ELEME...

SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

POWER SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

Monolithic Power Converter Package with Through Substrate Vias

DC/DC Converter Power Module Package Incorporating a Stacked Contro...

Semiconductor Device

Semiconductor Device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DC/DC CONVERTOR POWER MODULE PACKAGE INCORPORATING A STACKED CONTRO...

Multi-Component Power Structures and Methods For Forming The Same