Arrangements for heating

Industry

CPC
H01L23/345

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/345Arrangements for heating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus and electronic apparatus
- Patent number 12,185,502
- Issue date Dec 31, 2024
- Fujitsu Limited
- Shinya Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact humidity and pressure sensor with temperature control
- Patent number 12,163,938
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Vivek Saraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-die heater devices for memory devices and memory modules
- Patent number 12,073,908
- Issue date Aug 27, 2024
- Micron Technology, Inc.
- William A. Lendvay
- G11 - INFORMATION STORAGE
Information Patent Grant
Storage device unit
- Patent number 12,069,796
- Issue date Aug 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigehito Morita
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for manufacturing semiconductor structure with resistive ele...
- Patent number 12,040,178
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising heat dissipation plates
- Patent number 11,996,342
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hsiang Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and electronic device
- Patent number 11,968,812
- Issue date Apr 23, 2024
- BOE Technology Group Co., Ltd.
- Chao Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicide-sandwiched source/drain region and method of fabricating same
- Patent number 11,967,621
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power allocation to heat a processing chip of a network device
- Patent number 11,960,268
- Issue date Apr 16, 2024
- Hewlett Packard Enterprise Development LP
- Khai Chiah Chng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing an electrically operable heating body for...
- Patent number 11,958,068
- Issue date Apr 16, 2024
- KÖRBER TECHNOLOGIES GMBH
- Uwe Pelz
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Temperature-assisted device with integrated thin-film heater
- Patent number 11,942,388
- Issue date Mar 26, 2024
- International Business Machines Corporation
- Bahman Hekmatshoartabari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with heating element
- Patent number 11,908,765
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Tsung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ovenized MEMS
- Patent number 11,909,354
- Issue date Feb 20, 2024
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Closed loop temperature controlled circuit to improve device stability
- Patent number 11,856,657
- Issue date Dec 26, 2023
- STMicroelectronics Asia Pacific PTE Ltd.
- Fuchao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heated pins to couple with solder elements
- Patent number 11,830,846
- Issue date Nov 28, 2023
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal diode switch
- Patent number 11,799,020
- Issue date Oct 24, 2023
- PSIQUANTUM CORP.
- Faraz Najafi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader (IHS) with heating element
- Patent number 11,798,861
- Issue date Oct 24, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management system for electronic components with thermoelec...
- Patent number 11,765,862
- Issue date Sep 19, 2023
- BAIDU USA LLC
- Huawei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact humidity and pressure sensor with temperature control
- Patent number 11,761,936
- Issue date Sep 19, 2023
- pSemi Corporation
- Vivek Saraf
- G01 - MEASURING TESTING
Information Patent Grant
Transflective, PCM-based display device
- Patent number 11,740,493
- Issue date Aug 29, 2023
- E Ink Corporation
- Harish Bhaskaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon heater bonded to a test wafer
- Patent number 11,668,665
- Issue date Jun 6, 2023
- Tokyo Electron Limited
- Shigeru Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with resistive elements
- Patent number 11,670,501
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection in integrated circuits using pos...
- Patent number 11,621,236
- Issue date Apr 4, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and electronic package
- Patent number 11,621,237
- Issue date Apr 4, 2023
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a monitor including a second semico...
- Patent number 11,616,156
- Issue date Mar 28, 2023
- Fujitsu Optical Components Limited
- Nami Yasuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, array substrate, display device and method for fabri...
- Patent number 11,600,576
- Issue date Mar 7, 2023
- BOE Technology Group Co., Ltd.
- Chengyuan Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device temperature test on strip film frames
- Patent number 11,573,266
- Issue date Feb 7, 2023
- Texas Instruments Incorporated
- Dale Ohmart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicide-sandwiched source/drain region and method of fabricating same
- Patent number 11,563,095
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical adjustable filter sub-assembly
- Patent number 11,550,170
- Issue date Jan 10, 2023
- II-VI DELAWARE, INC.
- Li Zhang
- G02 - OPTICS
Information Patent Grant
Reflowable grid array to support grid heating
- Patent number 11,545,408
- Issue date Jan 3, 2023
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ovenized MEMS
- Publication number 20250007455
- Publication date Jan 2, 2025
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMORY CELL, THREE-DIMENSIONAL MEMORY, AND METHOD OF OPERATING THRE...
- Publication number 20240421032
- Publication date Dec 19, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Gang ZHANG
- G11 - INFORMATION STORAGE
Information Patent Application
VOLTAGE REGULATOR HAVING VARIABLE OUTPUT CAPACITANCE AND METHODS FO...
- Publication number 20240387516
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER STRUCTURE, MULTILAYER STRUCTURE, PROCESSING APPARATUS AND ME...
- Publication number 20240379483
- Publication date Nov 14, 2024
- Kokusai Electric Corporation
- Shuhei SAIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-DIE HEATER DEVICES FOR MEMORY DEVICES AND MEMORY MODULES
- Publication number 20240371414
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- William A. Lendvay
- G11 - INFORMATION STORAGE
Information Patent Application
ARRAY SUBSTRATE AND DISPLAY PANEL
- Publication number 20240332315
- Publication date Oct 3, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Bo WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240282659
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsiang Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER ELEMENTS
- Publication number 20240249992
- Publication date Jul 25, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Uppili S. RAGHUNATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER TERMINAL CONTACTS
- Publication number 20240250157
- Publication date Jul 25, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Uppili S. RAGHUNATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND ELECTRIC POWER STEERING DEVICE
- Publication number 20240243030
- Publication date Jul 18, 2024
- Mitsubishi Electric Corporation
- Katsuhiko OMAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOPARTICLE FLUOROPOLYMER ELECTRODE
- Publication number 20240230991
- Publication date Jul 11, 2024
- KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS
- Mohammad Nahid SIDDIQUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICALLY PROGRAMMABLE FUSE WITH HEATING TRANSISTORS
- Publication number 20240234305
- Publication date Jul 11, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Shesh M. Pandey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICIDE-LAYER-COUPLED DOPED PORTION OF ACTIVE REGION AND METHOD OF...
- Publication number 20240234526
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hui CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE WITH HEATING ELEMENT
- Publication number 20240186204
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Tsung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240168084
- Publication date May 23, 2024
- United Microelectronics Corp.
- Jih-Shun Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING SYSTEM ON CHIP AND THE MANUFACTURING METHOD THEREOF
- Publication number 20240162098
- Publication date May 16, 2024
- National Tsing Hua University
- Tung-Lin Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC MEMORY DEVICE ERASURE
- Publication number 20240088065
- Publication date Mar 14, 2024
- International Business Machines Corporation
- Nanbo Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...
- Publication number 20240063207
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compact Humidity and Pressure Sensor with Temperature Control
- Publication number 20240044857
- Publication date Feb 8, 2024
- pSemi Corporation
- Vivek Saraf
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE HEATERS FOR COLD TEMPERATURE OPERATION AND METHOD
- Publication number 20240006261
- Publication date Jan 4, 2024
- Intel Corporation
- Ganesh Kondapuram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE, SYSTEM AND METHOD FOR A TEMPERATURE REGULATED ELECTRICAL...
- Publication number 20230317543
- Publication date Oct 5, 2023
- FLUKE CORPORATION
- Timothy Byron Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND ELECTRONIC APPARATUS
- Publication number 20230309267
- Publication date Sep 28, 2023
- Fujitsu Limited
- Shinya SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE...
- Publication number 20230282792
- Publication date Sep 7, 2023
- LG ELECTRONICS INC.
- Eunjeong KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED THERMAL SOLUTION TO ENABLE OPERATION OF EMBEDDED PROCESS...
- Publication number 20230260864
- Publication date Aug 17, 2023
- Intel Corporation
- Ganesh Kondapuram
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MIDDLE OF THE LINE HEATER AND METHODS
- Publication number 20230223337
- Publication date Jul 13, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Mark D. Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY CIRCUIT
- Publication number 20230223363
- Publication date Jul 13, 2023
- Mitsubishi Electric Corporation
- Yuta SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FLASH MEMORY MODULE CHIP AND METHOD OF FABRICATING THE SAME
- Publication number 20230134957
- Publication date May 4, 2023
- Macronix International Co., Ltd.
- Teng-Hao Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFLECTIVE, PCM-BASED DISPLAY DEVICE
- Publication number 20230070453
- Publication date Mar 9, 2023
- E INK CORPORATION
- Harish BHASKARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230064253
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsiang Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE DEPENDENT ELECTRONIC COMPONENT HEATING SYSTEM
- Publication number 20230062660
- Publication date Mar 2, 2023
- AMETEK, INC.
- Brian Hoden
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements for heating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor apparatus and electronic apparatus

Compact humidity and pressure sensor with temperature control

On-die heater devices for memory devices and memory modules

Storage device unit

Method for manufacturing semiconductor structure with resistive ele...

Semiconductor package comprising heat dissipation plates

Display device and electronic device

Silicide-sandwiched source/drain region and method of fabricating same

Power allocation to heat a processing chip of a network device

Method for manufacturing an electrically operable heating body for...

Temperature-assisted device with integrated thin-film heater

Semiconductor structure with heating element

Ovenized MEMS

Closed loop temperature controlled circuit to improve device stability

Heated pins to couple with solder elements

Thermal diode switch

Integrated heat spreader (IHS) with heating element

Thermal management system for electronic components with thermoelec...

Compact humidity and pressure sensor with temperature control

Transflective, PCM-based display device

Silicon heater bonded to a test wafer

Semiconductor device structure with resistive elements

Electrostatic discharge protection in integrated circuits using pos...

Interposer and electronic package

Semiconductor device comprising a monitor including a second semico...

Display panel, array substrate, display device and method for fabri...

Electronic device temperature test on strip film frames

Silicide-sandwiched source/drain region and method of fabricating same

Optical adjustable filter sub-assembly

Reflowable grid array to support grid heating

Patents Applicationslast 30 patents

Ovenized MEMS

MEMORY CELL, THREE-DIMENSIONAL MEMORY, AND METHOD OF OPERATING THRE...

VOLTAGE REGULATOR HAVING VARIABLE OUTPUT CAPACITANCE AND METHODS FO...

HEATER STRUCTURE, MULTILAYER STRUCTURE, PROCESSING APPARATUS AND ME...

ON-DIE HEATER DEVICES FOR MEMORY DEVICES AND MEMORY MODULES

ARRAY SUBSTRATE AND DISPLAY PANEL

SEMICONDUCTOR PACKAGE

HEATER ELEMENTS

HEATER TERMINAL CONTACTS

ELECTRONIC DEVICE AND ELECTRIC POWER STEERING DEVICE

NANOPARTICLE FLUOROPOLYMER ELECTRODE

ELECTRONICALLY PROGRAMMABLE FUSE WITH HEATING TRANSISTORS

SILICIDE-LAYER-COUPLED DOPED PORTION OF ACTIVE REGION AND METHOD OF...

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE WITH HEATING ELEMENT

SEMICONDUCTOR STRUCTURE

SENSING SYSTEM ON CHIP AND THE MANUFACTURING METHOD THEREOF

FERROELECTRIC MEMORY DEVICE ERASURE

METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...

Compact Humidity and Pressure Sensor with Temperature Control

PACKAGE HEATERS FOR COLD TEMPERATURE OPERATION AND METHOD

STRUCTURE, SYSTEM AND METHOD FOR A TEMPERATURE REGULATED ELECTRICAL...

SEMICONDUCTOR APPARATUS AND ELECTRONIC APPARATUS

THERMOCOMPRESSION DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE...

INTEGRATED THERMAL SOLUTION TO ENABLE OPERATION OF EMBEDDED PROCESS...

MIDDLE OF THE LINE HEATER AND METHODS

HIGH FREQUENCY CIRCUIT

3D FLASH MEMORY MODULE CHIP AND METHOD OF FABRICATING THE SAME

TRANSFLECTIVE, PCM-BASED DISPLAY DEVICE

SEMICONDUCTOR PACKAGE

TEMPERATURE DEPENDENT ELECTRONIC COMPONENT HEATING SYSTEM