as prepeg comprising a bump connector

Industry

CPC
H01L2224/81101

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81101as prepeg comprising a bump connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
- Patent number 10,943,879
- Issue date Mar 9, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging through pre-formed metal pins
- Patent number 10,734,345
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,734,347
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 10,658,267
- Issue date May 19, 2020
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,600,761
- Issue date Mar 24, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-joining of microelectronic components with conductively self-adj...
- Patent number 10,297,570
- Issue date May 21, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,290,600
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 10,199,358
- Issue date Feb 5, 2019
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,103,121
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package comprising photo sensitive fill between a...
- Patent number 10,037,941
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Vladimir Noveski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 9,972,556
- Issue date May 15, 2018
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging through pre-formed metal pins
- Patent number 9,929,118
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,728,489
- Issue date Aug 8, 2017
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 9,711,477
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow film, solder bump formation method, solder joint formation m...
- Patent number 9,656,353
- Issue date May 23, 2017
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector
- Patent number 9,439,298
- Issue date Sep 6, 2016
- Lotes Co., Ltd.
- Ted Ju
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 9,287,234
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube-solder composite structures for interconnects, proc...
- Patent number 9,214,420
- Issue date Dec 15, 2015
- Intel Corporation
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Manufacturing system for machining components and corresponding method
- Patent number 9,093,204
- Issue date Jul 28, 2015
- Xerox Corporation
- Joseph A. Swift
- G01 - MEASURING TESTING
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 9,082,754
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallurgical clamshell methods for micro land grid array fabrication
- Patent number 8,959,764
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallurgical clamshell methods for micro land grid array fabrication
- Patent number 8,651,877
- Issue date Feb 18, 2014
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with multilayer wiring structure formed within...
- Patent number 8,618,657
- Issue date Dec 31, 2013
- Kabushiki Kaisha Toshiba
- Kiichiro Higaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming electrical interconnecti...
- Patent number 8,574,964
- Issue date Nov 5, 2013
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,563,397
- Issue date Oct 22, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Akihiro Chida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and electronic device
- Patent number 8,431,830
- Issue date Apr 30, 2013
- Fujitsu Limited
- Akira Tamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbon nanotube-solder composite structures for interconnects, proc...
- Patent number 8,344,483
- Issue date Jan 1, 2013
- Intel Corporation
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electrical Component, Manufacturing System and Method
- Patent number 8,234,960
- Issue date Aug 7, 2012
- Xerox Corporation
- Joseph A. Swift
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20190259724
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging through Pre-Formed Metal Pins
- Publication number 20180204816
- Publication date Jul 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORED SOLDER DECAL STRUCTURE AND PROCESS
- Publication number 20180174949
- Publication date Jun 21, 2018
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tall and Fine Pitch Interconnects
- Publication number 20180096960
- Publication date Apr 5, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20170309588
- Publication date Oct 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20150133001
- Publication date May 14, 2015
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...
- Publication number 20140252607
- Publication date Sep 11, 2014
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METAL CORED SOLDER DECAL STRUCTURE AND PROCESS
- Publication number 20140035150
- Publication date Feb 6, 2014
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Electrical Interconnecti...
- Publication number 20140008783
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROC...
- Publication number 20130341787
- Publication date Dec 26, 2013
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20130072073
- Publication date Mar 21, 2013
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20130043583
- Publication date Feb 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Component, Manufacturing System and Method
- Publication number 20120295517
- Publication date Nov 22, 2012
- Xerox Corporation
- Joseph A. Swift
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device and Method of Forming Electrical Interconnecti...
- Publication number 20110254146
- Publication date Oct 20, 2011
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20110111647
- Publication date May 12, 2011
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND ELECTRONIC DEVICE
- Publication number 20110073355
- Publication date Mar 31, 2011
- Fujitsu Limited
- Akira TAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Component, Manufacturing System and Method
- Publication number 20110035932
- Publication date Feb 17, 2011
- Xerox Corporation
- Joseph A. Swift
- G01 - MEASURING TESTING
Information Patent Application
CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROC...
- Publication number 20100219511
- Publication date Sep 2, 2010
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100171221
- Publication date Jul 8, 2010
- Akihiro CHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...
- Publication number 20100151632
- Publication date Jun 17, 2010
- Fujitsu Limited
- Takashi KANDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Fabricating Flip-Attached and Underfilled Semiconductor...
- Publication number 20100144098
- Publication date Jun 10, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Masako WATANABE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BONDING SHEET, ELECTRONIC CIRCUIT DEVICE AND ITS MANUFACTURING METHOD
- Publication number 20100071945
- Publication date Mar 25, 2010
- EIJI HORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100032833
- Publication date Feb 11, 2010
- Kabushiki Kaisha Toshiba
- Kiichiro Higaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ATTACHING AN INTEGRATED CIRCUIT CHIP TO A MODULE
- Publication number 20090279275
- Publication date Nov 12, 2009
- Stephen Peter Ayotte
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrical component, manufacturing system and method
- Publication number 20090114421
- Publication date May 7, 2009
- Xerox Corporation.
- Joseph A. Swift
- G01 - MEASURING TESTING
Information Patent Application
Carbon nanotube-solder composite structures for interconnects, proc...
- Publication number 20070228361
- Publication date Oct 4, 2007
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Application
Semiconductor device and manufacturing method of a semiconductor de...
- Publication number 20070222039
- Publication date Sep 27, 2007
- FUJITSU LIMITED
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package featuring thin semiconductor substrate and li...
- Publication number 20070194457
- Publication date Aug 23, 2007
- NEC ELECTRONICS COROPORATION
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, AND MANUFACTURING METHOD FOR THE DEVICE
- Publication number 20070090528
- Publication date Apr 26, 2007
- NEC Corporation
- Hironobu Ikeda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

as prepeg comprising a bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer substrate

Bump-forming film, semiconductor device and manufacturing method th...

Tall and fine pitch interconnects

Packaging through pre-formed metal pins

Dummy flip chip bumps for reducing stress

Metal cored solder decal structure and process

Nanoscale interconnect array for stacked dies

3D-joining of microelectronic components with conductively self-adj...

Dummy flip chip bumps for reducing stress

Multilayer substrate

Tall and fine pitch interconnects

Integrated device package comprising photo sensitive fill between a...

Metal cored solder decal structure and process

Packaging through pre-formed metal pins

Systems, methods and devices for inter-substrate coupling

Dummy flip chip bumps for reducing stress

Reflow film, solder bump formation method, solder joint formation m...

Electrical connector

Dummy flip chip bumps for reducing stress

Carbon nanotube-solder composite structures for interconnects, proc...

Manufacturing system for machining components and corresponding method

Metal cored solder decal structure and process

Metallurgical clamshell methods for micro land grid array fabrication

Metallurgical clamshell methods for micro land grid array fabrication

Semiconductor device with multilayer wiring structure formed within...

Semiconductor device and method of forming electrical interconnecti...

Semiconductor device and manufacturing method thereof

Interposer and electronic device

Carbon nanotube-solder composite structures for interconnects, proc...

Electrical Component, Manufacturing System and Method

Patents Applicationslast 30 patents

Dummy Flip Chip Bumps for Reducing Stress

TALL AND FINE PITCH INTERCONNECTS

Packaging through Pre-Formed Metal Pins

METAL CORED SOLDER DECAL STRUCTURE AND PROCESS

Tall and Fine Pitch Interconnects

Dummy Flip Chip Bumps for Reducing Stress

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...

METAL CORED SOLDER DECAL STRUCTURE AND PROCESS

Semiconductor Device and Method of Forming Electrical Interconnecti...

CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROC...

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

Dummy Flip Chip Bumps for Reducing Stress

Electrical Component, Manufacturing System and Method

Semiconductor Device and Method of Forming Electrical Interconnecti...

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

INTERPOSER AND ELECTRONIC DEVICE

Electrical Component, Manufacturing System and Method

CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROC...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...

Method for Fabricating Flip-Attached and Underfilled Semiconductor...

BONDING SHEET, ELECTRONIC CIRCUIT DEVICE AND ITS MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF ATTACHING AN INTEGRATED CIRCUIT CHIP TO A MODULE

Electrical component, manufacturing system and method

Carbon nanotube-solder composite structures for interconnects, proc...

Semiconductor device and manufacturing method of a semiconductor de...

Semiconductor package featuring thin semiconductor substrate and li...

DEVICE, AND MANUFACTURING METHOD FOR THE DEVICE