Assembly of a flat lead with an insulating support

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H01L21/4839

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4839Assembly of a flat lead with an insulating support

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package for isolation dies
- Patent number 12,243,911
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extendable inner lead for leaded package
- Patent number 12,125,780
- Issue date Oct 22, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package including lead frame and manufacturing m...
- Patent number 12,113,008
- Issue date Oct 8, 2024
- Diodes Incorporated
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated 3D semiconductor device package with transistors attached...
- Patent number 12,074,160
- Issue date Aug 27, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN semiconductor package, semiconductor package and lead frame
- Patent number 12,051,642
- Issue date Jul 30, 2024
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with thermal pad
- Patent number 12,021,019
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-die-package and method
- Patent number 12,014,973
- Issue date Jun 18, 2024
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip packaged devices with thermal pad
- Patent number 11,955,456
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 11,901,309
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a surface-mount integrated circuit package with s...
- Patent number 11,887,864
- Issue date Jan 30, 2024
- Microchip Technology Incorporated
- Wichai Kovitsophon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and packaging process for side-wall plating w...
- Patent number 11,876,003
- Issue date Jan 16, 2024
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Longnan Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging extendable lead and method therefor
- Patent number 11,869,837
- Issue date Jan 9, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,854,925
- Issue date Dec 26, 2023
- Kioxia Corporation
- Satoshi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,854,830
- Issue date Dec 26, 2023
- HAESUNG DS CO., LTD.
- Dong Jin Yoon
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Package assembly for plating with selective molding
- Patent number 11,764,075
- Issue date Sep 19, 2023
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Huiying Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) package without leadframe and direct contac...
- Patent number 11,749,534
- Issue date Sep 5, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 11,749,588
- Issue date Sep 5, 2023
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed heat-generating devices
- Patent number 11,742,265
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Hung-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount semiconductor device and method of manufacture
- Patent number 11,728,179
- Issue date Aug 15, 2023
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat lead package formation method
- Patent number 11,652,084
- Issue date May 16, 2023
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for glob top encapsulation using molding tape with elevated...
- Patent number 11,637,024
- Issue date Apr 25, 2023
- NXP B.V.
- Wiwat Tanwongwan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for fabricating semiconductor package and semiconductor pack...
- Patent number 11,569,163
- Issue date Jan 31, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Seung Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having component mounted on connection bar and...
- Patent number 11,521,918
- Issue date Dec 6, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 11,508,635
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing leadframes for semiconductor devices, corre...
- Patent number 11,462,465
- Issue date Oct 4, 2022
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, package structure comprising the same and method for ma...
- Patent number 11,462,467
- Issue date Oct 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Chia Hsiu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process for side-wall plating with a conductive film
- Patent number 11,450,534
- Issue date Sep 20, 2022
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Longnan Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with selective corrosion protection of electric connection...
- Patent number 11,410,942
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process for plating with selective molding
- Patent number 11,393,699
- Issue date Jul 19, 2022
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Huiying Ding
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DIS...
- Publication number 20250046675
- Publication date Feb 6, 2025
- Jong Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package and Manufacturing Method Thereof
- Publication number 20250038096
- Publication date Jan 30, 2025
- DIODES INCORPORATED
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20250029903
- Publication date Jan 23, 2025
- SAMSUNG DISPLAY CO., LTD.
- Ji Ye LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A PACKAGE FOR A SEMICONDUCTOR CHIP, PACKAGE FO...
- Publication number 20250014970
- Publication date Jan 9, 2025
- ams-OSRAM International GmbH
- Mazwan Mansor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEADFRAME SPACER AND METHOD THEREFOR
- Publication number 20250006598
- Publication date Jan 2, 2025
- NXP B.V.
- Yao Jung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...
- Publication number 20240413148
- Publication date Dec 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tiburcio A. MALDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395679
- Publication date Nov 28, 2024
- DOWA METALTECH CO., LTD.
- Ayumu OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20240347441
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION
- Publication number 20240258211
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES WITH DIRECT LEADFRAME ATTAC...
- Publication number 20240250042
- Publication date Jul 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD
- Publication number 20240178155
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Insert
- Publication number 20240178109
- Publication date May 30, 2024
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120269
- Publication date Apr 11, 2024
- Hyundai Motor Company
- Kyoung Kook HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDABLE INNER LEAD FOR LEADED PACKAGE
- Publication number 20240105579
- Publication date Mar 28, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
- Publication number 20240096775
- Publication date Mar 21, 2024
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
- Publication number 20240088007
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS
- Publication number 20240071892
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE INCLUDING A GEL
- Publication number 20240071851
- Publication date Feb 29, 2024
- Microchip Technology Caldicot Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF
- Publication number 20240030148
- Publication date Jan 25, 2024
- INFINEON TECHNOLOGIES AG
- Kok Kiat KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...
- Publication number 20240014123
- Publication date Jan 11, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME
- Publication number 20230411170
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- BRADLEY GLASSCOCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20230411258
- Publication date Dec 21, 2023
- STMicroelectronics S.r.l
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE INTEGRATED CIRCUIT PACKAGE
- Publication number 20230378022
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- KWANG-SOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230369195
- Publication date Nov 16, 2023
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR POWER MODULE AND METHOD OF PRODUCING SUBSTRATE FOR PO...
- Publication number 20230282589
- Publication date Sep 7, 2023
- Mitsubishi Heavy Industries, Ltd.
- Takashi Masuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH INTERNAL GULL WING LEAD STRUCTURES
- Publication number 20230187327
- Publication date Jun 15, 2023
- NXP USA, Inc.
- Pat Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...
- Publication number 20230178428
- Publication date Jun 8, 2023
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230145182
- Publication date May 11, 2023
- Shinko Electric Industries Co., Ltd.
- Hitoshi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20230136784
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Assembly of a flat lead with an insulating support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit package for isolation dies

Extendable inner lead for leaded package

Semiconductor chip package including lead frame and manufacturing m...

Isolated 3D semiconductor device package with transistors attached...

Semiconductor package having routable encapsulated conductive subst...

QFN semiconductor package, semiconductor package and lead frame

Semiconductor device package with thermal pad

Multi-die-package and method

Flip chip packaged devices with thermal pad

Semiconductor device package assemblies with direct leadframe attac...

Method of forming a surface-mount integrated circuit package with s...

Semiconductor package and packaging process for side-wall plating w...

Semiconductor device packaging extendable lead and method therefor

Semiconductor device and method of manufacturing semiconductor device

Method of manufacturing circuit board

Package assembly for plating with selective molding

Quad flat no-lead (QFN) package without leadframe and direct contac...

Semiconductor device and corresponding method

Exposed heat-generating devices

Surface mount semiconductor device and method of manufacture

Flat lead package formation method

Method for glob top encapsulation using molding tape with elevated...

Method for fabricating semiconductor package and semiconductor pack...

Semiconductor device having component mounted on connection bar and...

Semiconductor package having routable encapsulated conductive subst...

Method of manufacturing leadframes for semiconductor devices, corre...

Lead frame, package structure comprising the same and method for ma...

Packaging process for side-wall plating with a conductive film

Package with selective corrosion protection of electric connection...

Packaging process for plating with selective molding

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DIS...

Semiconductor Chip Package and Manufacturing Method Thereof

SEMICONDUCTOR PACKAGE FILM AND MANUFACTURING METHOD THEREOF

METHOD FOR PRODUCING A PACKAGE FOR A SEMICONDUCTOR CHIP, PACKAGE FO...

SEMICONDUCTOR DEVICE WITH LEADFRAME SPACER AND METHOD THEREFOR

ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION

SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES WITH DIRECT LEADFRAME ATTAC...

MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD

Semiconductor Package with Insert

POWER MODULE AND MANUFACTURING METHOD THEREOF

EXTENDABLE INNER LEAD FOR LEADED PACKAGE

ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE

POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES

MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS

ELECTRONIC DEVICE PACKAGE INCLUDING A GEL

SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...

INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

POWER MODULE INTEGRATED CIRCUIT PACKAGE

POWER MODULE AND METHOD FOR MANUFACTURING SAME

SUBSTRATE FOR POWER MODULE AND METHOD OF PRODUCING SUBSTRATE FOR PO...

LEADLESS SEMICONDUCTOR PACKAGE WITH INTERNAL GULL WING LEAD STRUCTURES

LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD