Assembly of a flat lead with an insulating support

Industry

CPC
H01L21/4839

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4839Assembly of a flat lead with an insulating support

Industries

Patents Grantslast 30 patents

Information Patent Grant
Flip chip packaged devices with thermal pad
- Patent number 11,955,456
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 11,901,309
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a surface-mount integrated circuit package with s...
- Patent number 11,887,864
- Issue date Jan 30, 2024
- Microchip Technology Incorporated
- Wichai Kovitsophon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and packaging process for side-wall plating w...
- Patent number 11,876,003
- Issue date Jan 16, 2024
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Longnan Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging extendable lead and method therefor
- Patent number 11,869,837
- Issue date Jan 9, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,854,925
- Issue date Dec 26, 2023
- Kioxia Corporation
- Satoshi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,854,830
- Issue date Dec 26, 2023
- HAESUNG DS CO., LTD.
- Dong Jin Yoon
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Package assembly for plating with selective molding
- Patent number 11,764,075
- Issue date Sep 19, 2023
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Huiying Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) package without leadframe and direct contac...
- Patent number 11,749,534
- Issue date Sep 5, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 11,749,588
- Issue date Sep 5, 2023
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed heat-generating devices
- Patent number 11,742,265
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Hung-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount semiconductor device and method of manufacture
- Patent number 11,728,179
- Issue date Aug 15, 2023
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat lead package formation method
- Patent number 11,652,084
- Issue date May 16, 2023
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for glob top encapsulation using molding tape with elevated...
- Patent number 11,637,024
- Issue date Apr 25, 2023
- NXP B.V.
- Wiwat Tanwongwan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for fabricating semiconductor package and semiconductor pack...
- Patent number 11,569,163
- Issue date Jan 31, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Seung Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having component mounted on connection bar and...
- Patent number 11,521,918
- Issue date Dec 6, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 11,508,635
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing leadframes for semiconductor devices, corre...
- Patent number 11,462,465
- Issue date Oct 4, 2022
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, package structure comprising the same and method for ma...
- Patent number 11,462,467
- Issue date Oct 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Chia Hsiu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process for side-wall plating with a conductive film
- Patent number 11,450,534
- Issue date Sep 20, 2022
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Longnan Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with selective corrosion protection of electric connection...
- Patent number 11,410,942
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process for plating with selective molding
- Patent number 11,393,699
- Issue date Jul 19, 2022
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Huiying Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die integrated circuit packages and methods of manufacturing...
- Patent number 11,328,984
- Issue date May 10, 2022
- Texas Instruments Incorporated
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose non-linear semiconductor package assembly line
- Patent number 11,302,668
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing power amplifier package embedded with input...
- Patent number 11,264,251
- Issue date Mar 1, 2022
- WAVEPIA CO., LTD.
- Sang-Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid package
- Patent number 11,189,557
- Issue date Nov 30, 2021
- NXP USA, INC.
- Akhilesh Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of a power semiconductor module
- Patent number 11,189,556
- Issue date Nov 30, 2021
- ABB Power Grids Switzerland AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for making integrated circuit packages
- Patent number 11,152,324
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Roxanna Bauzon Samson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package and semiconductor pack...
- Patent number 11,145,588
- Issue date Oct 12, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Seung Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Busbar assembly
- Patent number 11,127,672
- Issue date Sep 21, 2021
- Suncall Corporation
- Masaya Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120269
- Publication date Apr 11, 2024
- Hyundai Motor Company
- Kyoung Kook HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDABLE INNER LEAD FOR LEADED PACKAGE
- Publication number 20240105579
- Publication date Mar 28, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
- Publication number 20240096775
- Publication date Mar 21, 2024
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
- Publication number 20240088007
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS
- Publication number 20240071892
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE INCLUDING A GEL
- Publication number 20240071851
- Publication date Feb 29, 2024
- Microchip Technology Caldicot Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF
- Publication number 20240030148
- Publication date Jan 25, 2024
- INFINEON TECHNOLOGIES AG
- Kok Kiat KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...
- Publication number 20240014123
- Publication date Jan 11, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME
- Publication number 20230411170
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- BRADLEY GLASSCOCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20230411258
- Publication date Dec 21, 2023
- STMicroelectronics S.r.l
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE INTEGRATED CIRCUIT PACKAGE
- Publication number 20230378022
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- KWANG-SOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230369195
- Publication date Nov 16, 2023
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR POWER MODULE AND METHOD OF PRODUCING SUBSTRATE FOR PO...
- Publication number 20230282589
- Publication date Sep 7, 2023
- Mitsubishi Heavy Industries, Ltd.
- Takashi Masuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH INTERNAL GULL WING LEAD STRUCTURES
- Publication number 20230187327
- Publication date Jun 15, 2023
- NXP USA, Inc.
- Pat Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...
- Publication number 20230178428
- Publication date Jun 8, 2023
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230145182
- Publication date May 11, 2023
- Shinko Electric Industries Co., Ltd.
- Hitoshi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20230136784
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230132056
- Publication date Apr 27, 2023
- Mitsubishi Electric Corporation
- Shinji SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THEREOF
- Publication number 20230117806
- Publication date Apr 20, 2023
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR FABRICATING A SEMICONDUCTOR MODULE...
- Publication number 20230123783
- Publication date Apr 20, 2023
- Tomas Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF
- Publication number 20230115182
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Meng Kong Lye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
- Publication number 20230095545
- Publication date Mar 30, 2023
- Paul Armand Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRE...
- Publication number 20230031422
- Publication date Feb 2, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING EXTENDABLE LEAD AND METHOD THEREFOR
- Publication number 20230027248
- Publication date Jan 26, 2023
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGING PROCESS FOR SIDE-WALL PLATING W...
- Publication number 20230019610
- Publication date Jan 19, 2023
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Longnan JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD
- Publication number 20230005880
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LEADFRAMES FOR SEMICONDUCTOR DEVICES, CORRE...
- Publication number 20220406703
- Publication date Dec 22, 2022
- STMicroelectronics S.r.l.
- Pierangelo MAGNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating an Electrical Device Package Comprising Plat...
- Publication number 20220375883
- Publication date Nov 24, 2022
- Kok Yau Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH CONCAVE LEAD END FACES
- Publication number 20220359352
- Publication date Nov 10, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH S...
- Publication number 20220344173
- Publication date Oct 27, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Wichai Kovitsophon
- H01 - BASIC ELECTRIC ELEMENTS

Assembly of a flat lead with an insulating support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flip chip packaged devices with thermal pad

Semiconductor device package assemblies with direct leadframe attac...

Method of forming a surface-mount integrated circuit package with s...

Semiconductor package and packaging process for side-wall plating w...

Semiconductor device packaging extendable lead and method therefor

Semiconductor device and method of manufacturing semiconductor device

Method of manufacturing circuit board

Package assembly for plating with selective molding

Quad flat no-lead (QFN) package without leadframe and direct contac...

Semiconductor device and corresponding method

Exposed heat-generating devices

Surface mount semiconductor device and method of manufacture

Flat lead package formation method

Method for glob top encapsulation using molding tape with elevated...

Method for fabricating semiconductor package and semiconductor pack...

Semiconductor device having component mounted on connection bar and...

Semiconductor package having routable encapsulated conductive subst...

Method of manufacturing leadframes for semiconductor devices, corre...

Lead frame, package structure comprising the same and method for ma...

Packaging process for side-wall plating with a conductive film

Package with selective corrosion protection of electric connection...

Packaging process for plating with selective molding

Multi-die integrated circuit packages and methods of manufacturing...

Multi-purpose non-linear semiconductor package assembly line

Method of manufacturing power amplifier package embedded with input...

Hybrid package

Manufacturing of a power semiconductor module

Method and apparatus for making integrated circuit packages

Method for fabricating semiconductor package and semiconductor pack...

Busbar assembly

Patents Applicationslast 30 patents

POWER MODULE AND MANUFACTURING METHOD THEREOF

EXTENDABLE INNER LEAD FOR LEADED PACKAGE

ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE

POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES

MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS

ELECTRONIC DEVICE PACKAGE INCLUDING A GEL

SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...

INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

POWER MODULE INTEGRATED CIRCUIT PACKAGE

POWER MODULE AND METHOD FOR MANUFACTURING SAME

SUBSTRATE FOR POWER MODULE AND METHOD OF PRODUCING SUBSTRATE FOR PO...

LEADLESS SEMICONDUCTOR PACKAGE WITH INTERNAL GULL WING LEAD STRUCTURES

LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THEREOF

SEMICONDUCTOR MODULE, METHOD FOR FABRICATING A SEMICONDUCTOR MODULE...

SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF

Semiconductor Packages and Methods for Manufacturing Thereof

METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRE...

SEMICONDUCTOR DEVICE PACKAGING EXTENDABLE LEAD AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE AND PACKAGING PROCESS FOR SIDE-WALL PLATING W...

FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD

METHOD OF MANUFACTURING LEADFRAMES FOR SEMICONDUCTOR DEVICES, CORRE...

Method for Fabricating an Electrical Device Package Comprising Plat...

ELECTRONIC PACKAGE WITH CONCAVE LEAD END FACES

METHOD OF FORMING A SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH S...