at the center of the internal layers

Industry

CPC
H01L2224/05094

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05094at the center of the internal layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,935,852
- Issue date Mar 19, 2024
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for preventing crack in pad region and fabrica...
- Patent number 10,636,703
- Issue date Apr 28, 2020
- MagnaChip Semiconductor, Ltd.
- Jong-yeul Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and reconstituted semiconductor wafer havin...
- Patent number 10,204,881
- Issue date Feb 12, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package with redistribution layer
- Patent number 9,953,954
- Issue date Apr 24, 2018
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wiring pad and wiring formed on the sam...
- Patent number 9,640,462
- Issue date May 2, 2017
- Longitude Semiconductor S.a.r.l.
- Shoji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure having wirebonds and method of manufacturin...
- Patent number 9,613,843
- Issue date Apr 4, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions having through-substrate interconnects
- Patent number 9,583,419
- Issue date Feb 28, 2017
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump pad structure
- Patent number 9,536,847
- Issue date Jan 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Ping Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 9,397,058
- Issue date Jul 19, 2016
- STATS ChipPAC Pte. Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including passivation layer encapsulant
- Patent number 9,214,385
- Issue date Dec 15, 2015
- GLOBALFOUNDRIES Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump pad structure
- Patent number 9,171,811
- Issue date Oct 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a power MOSFET with inte...
- Patent number 9,006,099
- Issue date Apr 14, 2015
- Great Wall Semiconductor Corporation
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 8,963,326
- Issue date Feb 24, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump pad structure
- Patent number 8,907,478
- Issue date Dec 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure
- Patent number 8,878,370
- Issue date Nov 4, 2014
- Shanghai Hua Hong NEC Electronics Co., Ltd.
- Qing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming through-substrate interconnects
- Patent number 8,853,072
- Issue date Oct 7, 2014
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having penetration electrode penetrating throu...
- Patent number 8,816,478
- Issue date Aug 26, 2014
- PS4 Luxco S.A.R.L.
- Yoshiharu Kanegae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a pad and plurality of interconnects
- Patent number 8,810,039
- Issue date Aug 19, 2014
- Panasonic Corporation
- Koji Takemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump connections
- Patent number 8,778,792
- Issue date Jul 15, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,779,560
- Issue date Jul 15, 2014
- PS4 Luxco S.A.R.L.
- Seiya Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,742,584
- Issue date Jun 3, 2014
- Panasonic Corporation
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double solid metal pad with reduced area
- Patent number 8,722,529
- Issue date May 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,674,506
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside dummy plugs for 3D integration
- Patent number 8,587,121
- Issue date Nov 19, 2013
- International Business Machines Corporation
- Steven J. Koester
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double solid metal pad with reduced area
- Patent number 8,581,423
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device having electromigration resistant feed line structures
- Patent number 8,531,030
- Issue date Sep 10, 2013
- Texas Instruments Incorporated
- Gregory Eric Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,519,514
- Issue date Aug 27, 2013
- Elpida Memory, Inc.
- Seiya Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump connections
- Patent number 8,492,892
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,446,006
- Issue date May 21, 2013
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump pad structure
- Patent number 8,405,211
- Issue date Mar 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240213194
- Publication date Jun 27, 2024
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220328433
- Publication date Oct 13, 2022
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP-SCALE PACKAGE WITH REDISTRIBUTION LAYER
- Publication number 20170162540
- Publication date Jun 8, 2017
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Pad Structure
- Publication number 20150031200
- Publication date Jan 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140273453
- Publication date Sep 18, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Jun Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT
- Publication number 20140183757
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Solid Metal Pad with Reduced Area
- Publication number 20140045327
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130328188
- Publication date Dec 12, 2013
- Elpida Memory, Inc.
- Seiya Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20130234329
- Publication date Sep 12, 2013
- Intetnational Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDPAD INTEGRATED THEROMELECTRIC COOLER
- Publication number 20130187252
- Publication date Jul 25, 2013
- Henry L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PENETRATION ELECTRODE PENETRATING THROU...
- Publication number 20130181345
- Publication date Jul 18, 2013
- Elpida Memory, Inc.
- Yoshiharu Kanegae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Pad Structure
- Publication number 20130181347
- Publication date Jul 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP CONNECTIONS
- Publication number 20130140695
- Publication date Jun 6, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20130140691
- Publication date Jun 6, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING WIRING PAD AND WIRING FORMED ON THE SAM...
- Publication number 20130134584
- Publication date May 30, 2013
- Elpida Memory, Inc.
- Shoji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE
- Publication number 20130075931
- Publication date Mar 28, 2013
- SHANGHAI HUA HONG NEC ELECTRONICS CO., LTD.
- Qing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Power MOSFET With Inte...
- Publication number 20120313147
- Publication date Dec 13, 2012
- Great Wall Semiconductor Corporation
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions Having Through-Substrate Interconnects,...
- Publication number 20120306084
- Publication date Dec 6, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120168961
- Publication date Jul 5, 2012
- PANASONIC CORPORATION
- Daisuke SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DEVICE HAVING ELECTROMIGRATION RESISTANT FEED LINE STRUCTURES
- Publication number 20120153458
- Publication date Jun 21, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Gregory Eric Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP CONNECTIONS
- Publication number 20120146212
- Publication date Jun 14, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING STRUCTURES FOR UNIFORM CURRENT DENSITY IN C4 BALLS
- Publication number 20120080797
- Publication date Apr 5, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEM ICONDUCTOR DEVICE HAVING PADS AND WHICH MINIMIZES DEFECTS DUE T...
- Publication number 20120080780
- Publication date Apr 5, 2012
- PANASONIC CORPORATION
- Koji TAKEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DUMMY PLUGS FOR 3D INTEGRATION
- Publication number 20110233785
- Publication date Sep 29, 2011
- International Business Machines Corporation
- Steven J. Koester
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110207322
- Publication date Aug 25, 2011
- ELPIDA MEMORY, INC.
- Masahiro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20110147922
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20110084400
- Publication date Apr 14, 2011
- Elpida Memory, Inc.
- Seiya Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRUE CSP POWER MOSFET BASED ON BOTTOM-SOURCE LDMOS
- Publication number 20110073943
- Publication date Mar 31, 2011
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20100301488
- Publication date Dec 2, 2010
- NEC ELECTRONICS CORPORATION
- Noriaki Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Pad Structure
- Publication number 20100283148
- Publication date Nov 11, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS

at the center of the internal layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Semiconductor device for preventing crack in pad region and fabrica...

Power overlay structure and reconstituted semiconductor wafer havin...

Wafer-level chip-scale package with redistribution layer

Semiconductor device having wiring pad and wiring formed on the sam...

Power overlay structure having wirebonds and method of manufacturin...

Semiconductor constructions having through-substrate interconnects

Bump pad structure

Semiconductor device and method of forming patterned repassivation...

Semiconductor device including passivation layer encapsulant

Bump pad structure

Semiconductor device and method of forming a power MOSFET with inte...

Semiconductor device and method of forming patterned repassivation...

Bump pad structure

Bond pad structure

Methods of forming through-substrate interconnects

Semiconductor device having penetration electrode penetrating throu...

Semiconductor device having a pad and plurality of interconnects

Solder bump connections

Semiconductor device and manufacturing method thereof

Semiconductor device

Double solid metal pad with reduced area

Structures and methods to reduce maximum current density in a solde...

Backside dummy plugs for 3D integration

Double solid metal pad with reduced area

IC device having electromigration resistant feed line structures

Semiconductor device and manufacturing method thereof

Solder bump connections

Structures and methods to reduce maximum current density in a solde...

Bump pad structure

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

WAFER-LEVEL CHIP-SCALE PACKAGE WITH REDISTRIBUTION LAYER

Bump Pad Structure

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT

Double Solid Metal Pad with Reduced Area

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

BONDPAD INTEGRATED THEROMELECTRIC COOLER

SEMICONDUCTOR DEVICE HAVING PENETRATION ELECTRODE PENETRATING THROU...

Bump Pad Structure

SOLDER BUMP CONNECTIONS

Semiconductor Device and Method of Forming Patterned Repassivation...

SEMICONDUCTOR DEVICE HAVING WIRING PAD AND WIRING FORMED ON THE SAM...

BOND PAD STRUCTURE

Semiconductor Device and Method of Forming a Power MOSFET With Inte...

Semiconductor Constructions Having Through-Substrate Interconnects,...

SEMICONDUCTOR DEVICE

IC DEVICE HAVING ELECTROMIGRATION RESISTANT FEED LINE STRUCTURES

SOLDER BUMP CONNECTIONS

METAL WIRING STRUCTURES FOR UNIFORM CURRENT DENSITY IN C4 BALLS

SEM ICONDUCTOR DEVICE HAVING PADS AND WHICH MINIMIZES DEFECTS DUE T...

BACKSIDE DUMMY PLUGS FOR 3D INTEGRATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

Semiconductor device and manufacturing method thereof

TRUE CSP POWER MOSFET BASED ON BOTTOM-SOURCE LDMOS

Semiconductor device

Bump Pad Structure