at the passive surface

Industry

CPC
H01L2924/10158

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10158at the passive surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having an antenna arranged over an active main...
- Patent number 12,094,842
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radar package with optical lens for radar waves
- Patent number 11,823,970
- Issue date Nov 21, 2023
- Infineon Technologies AG
- Bernhard Rieder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,694,990
- Issue date Jul 4, 2023
- Samsung Display Co., Ltd.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,664,330
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing reduced height s...
- Patent number 11,469,213
- Issue date Oct 11, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,410,967
- Issue date Aug 9, 2022
- Samsung Display Co., Ltd.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal airflow sensor
- Patent number 11,391,611
- Issue date Jul 19, 2022
- Hitachi Astemo, Ltd.
- Ryosuke Doi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and manufacturing method thereof and manufacturin...
- Patent number 11,342,300
- Issue date May 24, 2022
- Japan Display Inc.
- Youhei Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and apparatus comprising the same
- Patent number 11,244,936
- Issue date Feb 8, 2022
- Samsung Electronics Co., Ltd.
- Yun Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a cooling body with a groove
- Patent number 11,088,045
- Issue date Aug 10, 2021
- Mitsubishi Electric Corporation
- Noboru Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative fillet for mounting an integrated device die to a carrier
- Patent number 11,056,455
- Issue date Jul 6, 2021
- Analog Devices, Inc.
- Vikram Venkatadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 11,018,073
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,978,409
- Issue date Apr 13, 2021
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and placing a semiconductor device on a sub...
- Patent number 10,910,342
- Issue date Feb 2, 2021
- Imec VZW
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor, in particular a microphone with improved layout
- Patent number 10,822,227
- Issue date Nov 3, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Philippe Robert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 10,770,405
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 10,707,177
- Issue date Jul 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,692,861
- Issue date Jun 23, 2020
- Rohm Co., Ltd.
- Masatoshi Aketa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 10,692,827
- Issue date Jun 23, 2020
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly having an adhesion layer, and method for...
- Patent number 10,665,562
- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 10,658,238
- Issue date May 19, 2020
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit module and method of forming same
- Patent number 10,636,768
- Issue date Apr 28, 2020
- Starkey Laboratories, Inc.
- Sayed Kaysarbin Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor apparatus and equipment
- Patent number 10,622,397
- Issue date Apr 14, 2020
- Canon Kabushiki Kaisha
- Hideaki Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor backmetal (BM) and over pad metallization (OPM) struc...
- Patent number 10,600,736
- Issue date Mar 24, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,510,724
- Issue date Dec 17, 2019
- Samsung Electronics Co., Ltd.
- Jae-kyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 10,461,014
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,461,077
- Issue date Oct 29, 2019
- Rohm Co., Ltd.
- Masatoshi Aketa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS transducer package
- Patent number 10,455,309
- Issue date Oct 22, 2019
- Cirrus Logic, Inc.
- Tsjerk Hoekstra
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor dies with recesses, associated leadframes, and associ...
- Patent number 10,431,531
- Issue date Oct 1, 2019
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421020
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- YOUNG KWAN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20240379489
- Publication date Nov 14, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240297045
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Yoshio MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
- Publication number 20240162166
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MAKING THE SAME
- Publication number 20240047423
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATION STRUCTURE AND ELECTRONIC APPARATUS
- Publication number 20240038710
- Publication date Feb 1, 2024
- LENOVO (SINGAPORE) PTE. LTD.
- Junki Hashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230075665
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220328451
- Publication date Oct 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210225782
- Publication date Jul 22, 2021
- Samsung Electronics Co., Ltd.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF AND MANUFACTURIN...
- Publication number 20210066238
- Publication date Mar 4, 2021
- Japan Display Inc.
- Youhei IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210043600
- Publication date Feb 11, 2021
- SAMSUNG DISPLAY CO., LTD.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Material Having Different Thicknesses in Packages
- Publication number 20200402926
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND APPARATUS COMPRISING THE SAME
- Publication number 20190295998
- Publication date Sep 26, 2019
- Samsung Electronics Co., Ltd.
- Yun Hyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip Antennas for Semiconductor Devices and Related Manufacturin...
- Publication number 20190221531
- Publication date Jul 18, 2019
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL AIRFLOW SENSOR
- Publication number 20190178694
- Publication date Jun 13, 2019
- Hitachi Automotive Systems, Ltd.
- Ryosuke Doi
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND R...
- Publication number 20190148306
- Publication date May 16, 2019
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20190081015
- Publication date Mar 14, 2019
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...
- Publication number 20180350730
- Publication date Dec 6, 2018
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20180269126
- Publication date Sep 20, 2018
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20170372907
- Publication date Dec 28, 2017
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...
- Publication number 20170278775
- Publication date Sep 28, 2017
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170098625
- Publication date Apr 6, 2017
- Rohm Co., Ltd.
- Hirofumi TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140370660
- Publication date Dec 18, 2014
- Takumi IHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIAS FOR SEMICONDUCTOR DEVICES AND MANUFACTURING ME...
- Publication number 20140363967
- Publication date Dec 11, 2014
- Chen-Chao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20140327152
- Publication date Nov 6, 2014
- Tsang-Yu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING APPARATUS
- Publication number 20140319455
- Publication date Oct 30, 2014
- Stanley Electric Co., Ltd
- Mamoru MIYACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20140306321
- Publication date Oct 16, 2014
- LAPIS SEMICONDUCTOR CO., LTD.
- YUICHI KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20140291825
- Publication date Oct 2, 2014
- Mitsubishi Electric Corporation
- Rei YONEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS
- Publication number 20140291812
- Publication date Oct 2, 2014
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELF-ALIGNED CHIP CARRIER AND PACKAGE STRUCTURE THEREOF
- Publication number 20140286605
- Publication date Sep 25, 2014
- Wen-Chin Lee
- G02 - OPTICS

at the passive surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having an antenna arranged over an active main...

Thermal interface material having different thicknesses in packages

Radar package with optical lens for radar waves

Display device and method of manufacturing the same

Semiconductor package

Systems, methods, and apparatuses for implementing reduced height s...

Display device and method of manufacturing the same

Thermal airflow sensor

Electronic device and manufacturing method thereof and manufacturin...

Semiconductor device package and apparatus comprising the same

Semiconductor device having a cooling body with a groove

Negative fillet for mounting an integrated device die to a carrier

Heat spreading device and method

Semiconductor package

Method for transferring and placing a semiconductor device on a sub...

Pressure sensor, in particular a microphone with improved layout

Thermal interface material having different thicknesses in packages

Thermal interface material having different thicknesses in packages

Method of manufacturing a semiconductor device

Packaged microelectronic devices and methods for manufacturing pack...

Power electronics assembly having an adhesion layer, and method for...

Semiconductor packages having an electric device with a recess

Integrated circuit module and method of forming same

Semiconductor apparatus and equipment

Semiconductor backmetal (BM) and over pad metallization (OPM) struc...

Semiconductor device package

Heat spreading device and method

Method of manufacturing a semiconductor device

MEMS transducer package

Semiconductor dies with recesses, associated leadframes, and associ...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

NESTED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MAKING THE SAME

HEAT RADIATION STRUCTURE AND ELECTRONIC APPARATUS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF AND MANUFACTURIN...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Thermal Interface Material Having Different Thicknesses in Packages

SEMICONDUCTOR DEVICE PACKAGE AND APPARATUS COMPRISING THE SAME

On-Chip Antennas for Semiconductor Devices and Related Manufacturin...

THERMAL AIRFLOW SENSOR

SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND R...

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

THROUGH SILICON VIAS FOR SEMICONDUCTOR DEVICES AND MANUFACTURING ME...

CHIP PACKAGE

SEMICONDUCTOR LIGHT EMITTING APPARATUS

SEMICONDUCTOR DEVICE FABRICATION METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS

SELF-ALIGNED CHIP CARRIER AND PACKAGE STRUCTURE THEREOF