Auxiliary members for bonding areas

Industry

CPC
H01L2224/0212

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0212Auxiliary members for bonding areas

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 12,051,684
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for controlling trapped ions and method of manufacturing the...
- Patent number 11,984,416
- Issue date May 14, 2024
- Infineon Technologies Austria AG
- Clemens Roessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,810,837
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to stack structures including passivati...
- Patent number 11,804,460
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,798,906
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,791,286
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Youn-ji Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 11,749,665
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,646,280
- Issue date May 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
- Patent number 11,640,948
- Issue date May 2, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 11,616,028
- Issue date Mar 28, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) structure, semiconductor device and manu...
- Patent number 11,605,605
- Issue date Mar 14, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 11,456,289
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,410,946
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Daisuke Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,282,802
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structures in electronic devices including passivation layers...
- Patent number 11,257,774
- Issue date Feb 22, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,251,144
- Issue date Feb 15, 2022
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,233,026
- Issue date Jan 25, 2022
- Murata Manufacturing Co., Ltd.
- Shintaro Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interconnect structure and method for pre...
- Patent number 11,177,194
- Issue date Nov 16, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bump planarity control
- Patent number 11,145,612
- Issue date Oct 12, 2021
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving wire bonding strength of an image sensor
- Patent number 11,133,275
- Issue date Sep 28, 2021
- Semiconductor Manufacturing International (Beijing) Corporation
- Yunlong Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,978,414
- Issue date Apr 13, 2021
- ABLIC INC.
- Shinjiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices having a patterned surfa...
- Patent number 10,950,564
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with solder regions aligned to recesses
- Patent number 10,879,198
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,941
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,840,199
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20240387499
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) CHIP WITH BUMP INTERCONNECTS EACH HAVING MU...
- Publication number 20240387429
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR CONTROLLING TRAPPED IONS
- Publication number 20240213193
- Publication date Jun 27, 2024
- Infineon Technologies Austria AG
- Clemens Roessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
- Publication number 20240113055
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240030104
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20230420440
- Publication date Dec 28, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230275051
- Publication date Aug 31, 2023
- RENESAS ELECTRONICS CORPORATION
- Teruhiro KUWAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVED LIGHT-EMITTING SUBSTRATE
- Publication number 20230275102
- Publication date Aug 31, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Zhenhai YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF AND POWER CONVERTER
- Publication number 20230253349
- Publication date Aug 10, 2023
- Mitsubishi Electric Corporation
- Yuji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME
- Publication number 20230056623
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chih-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
- Publication number 20230036317
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20230013960
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...
- Publication number 20220336396
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Jiro YOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220278088
- Publication date Sep 1, 2022
- SAMSUNG DISPLAY CO., LTD.
- Chan Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20220108962
- Publication date Apr 7, 2022
- Samsung Electronics Co., Ltd.
- Jeong-gi JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR CONTROLLING TRAPPED IONS AND METHOD OF MANUFACTURING THE...
- Publication number 20220102301
- Publication date Mar 31, 2022
- Infineon Technologies Austria AG
- Clemens Roessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220102245
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20220059478
- Publication date Feb 24, 2022
- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220013481
- Publication date Jan 13, 2022
- RENESAS ELECTRONICS CORPORATION
- Tatsuya USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210384144
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Youn-ji MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...
- Publication number 20210225787
- Publication date Jul 22, 2021
- Changxin Memory Technologies, Inc.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND APPARATUSES HAVING A PATTERNED SURFACE...
- Publication number 20210202417
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20210202454
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE AND METHOD FOR PRE...
- Publication number 20210193559
- Publication date Jun 24, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210134744
- Publication date May 6, 2021
- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20210098397
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
- Publication number 20210020585
- Publication date Jan 21, 2021
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20200294947
- Publication date Sep 17, 2020
- Murata Manufacturing Co., Ltd.
- Shintaro OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
- Publication number 20200211982
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary members for bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method to minimize stress on stack via

Face-to-face semiconductor device with fan-out porch

Device for controlling trapped ions and method of manufacturing the...

Solderless interconnection structure and method of forming same

Semiconductor device and method

Semiconductor packages

Devices and methods related to stack structures including passivati...

Semiconductor chip

Semiconductor device and semiconductor package

Face-to-face semiconductor device with fan-out porch

Method for fabricating semiconductor device

Microelectronic devices and apparatuses having a patterned surface...

Semiconductor devices having crack-inhibiting structures

Redistribution layer (RDL) structure, semiconductor device and manu...

Face-to-face semiconductor device with fan-out porch

Semiconductor apparatus

Semiconductor device structure and method for forming the same

Stack structures in electronic devices including passivation layers...

Semiconductor chip

Semiconductor device and a method of manufacturing the same

Electronic component

Semiconductor device with interconnect structure and method for pre...

Methods for bump planarity control

Method for improving wire bonding strength of an image sensor

Solderless interconnection structure and method of forming same

Semiconductor device and method of manufacturing a semiconductor de...

Methods of forming microelectronic devices having a patterned surfa...

Package with solder regions aligned to recesses

Semiconductor device and method

Methods of forming connector pad structures, interconnect structure...

Patents Applicationslast 30 patents

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

INTEGRATED CIRCUIT (IC) CHIP WITH BUMP INTERCONNECTS EACH HAVING MU...

DEVICE FOR CONTROLLING TRAPPED IONS

STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS

SEMICONDUCTOR PACKAGES

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

SEMICONDUCTOR DEVICE

CURVED LIGHT-EMITTING SUBSTRATE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF AND POWER CONVERTER

SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME

WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

SEMICONDUCTOR CHIP

DEVICE FOR CONTROLLING TRAPPED IONS AND METHOD OF MANUFACTURING THE...

SEMICONDUCTOR PACKAGES

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...

MICROELECTRONIC DEVICES AND APPARATUSES HAVING A PATTERNED SURFACE...

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE AND METHOD FOR PRE...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor Device and Method

SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES

ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...