Auxiliary members for layer connectors

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CPC
H01L2224/2612

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2612Auxiliary members for layer connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display panel, preparation method thereof, and display device
- Patent number 12,033,974
- Issue date Jul 9, 2024
- Shanghai Tianma Micro-Electronics Co,. Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure, manufacturing method for heat dissipati...
- Patent number 12,002,733
- Issue date Jun 4, 2024
- Lenovo (Singapore) Pte. Ltd.
- Masahiro Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising spacers between integrated devices
- Patent number 11,948,909
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 11,923,330
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering structure with groove portion and power module comprising...
- Patent number 11,862,537
- Issue date Jan 2, 2024
- Hyundai Motor Company
- Jun Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,721,613
- Issue date Aug 8, 2023
- Hyundai Motor Company
- Tae Hwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite dielectric...
- Patent number 11,664,341
- Issue date May 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite dielectric structure and method...
- Patent number 11,264,350
- Issue date Mar 1, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics module
- Patent number 11,183,489
- Issue date Nov 23, 2021
- Audi AG
- Andreas Apelsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,941
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor sensor chip mounting, and semiconductor...
- Patent number 10,790,217
- Issue date Sep 29, 2020
- Sekisui Chemical Co., Ltd.
- Saori Ueda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for semiconductor mounting, and semiconductor sensor
- Patent number 10,679,925
- Issue date Jun 9, 2020
- Sekisui Chemical Co., Ltd.
- Saori Ueda
- G01 - MEASURING TESTING
Information Patent Grant
Die with metallized sidewall and method of manufacturing
- Patent number 10,535,588
- Issue date Jan 14, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,442,958
- Issue date Oct 15, 2019
- Dexerials Corporation
- Yuta Araki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside spacer structures for improved thermal performance
- Patent number 10,153,224
- Issue date Dec 11, 2018
- GLOBALFOUNDRIES Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor device
- Patent number 10,083,940
- Issue date Sep 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor device
- Patent number 9,685,426
- Issue date Jun 20, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder fatigue arrest for wafer level package
- Patent number 9,583,425
- Issue date Feb 28, 2017
- Maxim Integrated Products, Inc.
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 9,484,316
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced thickness
- Patent number 9,418,922
- Issue date Aug 16, 2016
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of integrated-circuit chips and electronic device
- Patent number 9,401,349
- Issue date Jul 26, 2016
- STMicroelectronics (Grenoble 2) SAS
- Angelo Crobu
- G01 - MEASURING TESTING
Information Patent Grant
Solder, solder joint structure and method of forming solder joint s...
- Patent number 9,308,603
- Issue date Apr 12, 2016
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-die stacking structure and method for making the same
- Patent number 9,214,438
- Issue date Dec 15, 2015
- Advanced Micro Devices (Shanghai) Co., Ltd.
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS anchor and spacer structure
- Patent number 9,213,181
- Issue date Dec 15, 2015
- Pixtronix, Inc.
- Timothy J. Brosnihan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Connection arrangement of an electric and/or electronic component
- Patent number 9,177,934
- Issue date Nov 3, 2015
- Robert Bosch GmbH
- Christiane Frueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Escape routes
- Patent number 9,171,809
- Issue date Oct 27, 2015
- Flextronics AP, LLC
- Omar Garcia Lopez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240404981
- Publication date Dec 5, 2024
- DENSO CORPORATION
- Hiroki YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...
- Publication number 20240387438
- Publication date Nov 21, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240186277
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20240128224
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20230420403
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Hyeonjun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230402424
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL
- Publication number 20230378124
- Publication date Nov 23, 2023
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20230326896
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Sheng-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230299247
- Publication date Sep 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES
- Publication number 20230223375
- Publication date Jul 13, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE
- Publication number 20230187380
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- CHANGEUN JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR MODULE
- Publication number 20230170334
- Publication date Jun 1, 2023
- TOHOKU UNIVERSITY
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE COOLING-TYPE SEMICONDUCTOR DEVICE
- Publication number 20230119737
- Publication date Apr 20, 2023
- Hyundai Motor Company
- Young Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND T...
- Publication number 20230037241
- Publication date Feb 2, 2023
- Kateeva Display Technology (Shaoxing) Limited
- Erdong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20220216172
- Publication date Jul 7, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC...
- Publication number 20220084976
- Publication date Mar 17, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20220068769
- Publication date Mar 3, 2022
- Hyundai Motor Company
- Tae Hwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20220052022
- Publication date Feb 17, 2022
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Quanpeng YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING STRUCTURE AND POWER MODULE COMPRISING THE SAME
- Publication number 20220044988
- Publication date Feb 10, 2022
- Hyundai Motor Company
- Jun Hee PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC STRUCTURE AND METHOD...
- Publication number 20210296276
- Publication date Sep 23, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE
- Publication number 20210125957
- Publication date Apr 29, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE
- Publication number 20200294892
- Publication date Sep 17, 2020
- Huawei Technologies Co., Ltd
- Kairong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE ADHESIVE
- Publication number 20200172767
- Publication date Jun 4, 2020
- Takamichi MORI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIE WITH METALLIZED SIDEWALL AND METHOD OF MANUFACTURING
- Publication number 20180204786
- Publication date Jul 19, 2018
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SPACER STRUCTURES FOR IMPROVED THERMAL PERFORMANCE
- Publication number 20180076110
- Publication date Mar 15, 2018
- GLOBALFOUNDRIES INC.
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20170278827
- Publication date Sep 28, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER PARTICLES FOR BOND LINE THICKNESS CONTROL IN SINTERING PASTES
- Publication number 20170271294
- Publication date Sep 21, 2017
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20170107406
- Publication date Apr 20, 2017
- DEXERIALS CORPORATION
- Yuta ARAKI
- B32 - LAYERED PRODUCTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20160284669
- Publication date Sep 29, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary members for layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display panel, preparation method thereof, and display device

Heat dissipation structure, manufacturing method for heat dissipati...

Package comprising spacers between integrated devices

Adhesive member, display device, and manufacturing method of displa...

Soldering structure with groove portion and power module comprising...

Semiconductor device and method

Power module

Method for preparing semiconductor device with composite dielectric...

Semiconductor device with composite dielectric structure and method...

Power electronics module

Packaged semiconductor devices and methods of packaging thereof

Method and apparatus for creating a bond between objects based on f...

Semiconductor device and method

Adhesive for semiconductor sensor chip mounting, and semiconductor...

Adhesive for semiconductor mounting, and semiconductor sensor

Die with metallized sidewall and method of manufacturing

Anisotropic conductive film and production method of the same

Semiconductor devices and methods of forming thereof

Backside spacer structures for improved thermal performance

Package-on-package semiconductor device

Package-on-package semiconductor device

Solder fatigue arrest for wafer level package

Semiconductor devices and methods of forming thereof

Semiconductor device with reduced thickness

Stack of integrated-circuit chips and electronic device

Solder, solder joint structure and method of forming solder joint s...

Die-die stacking structure and method for making the same

MEMS anchor and spacer structure

Connection arrangement of an electric and/or electronic component

Escape routes

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...

SEMICONDUCTOR PACKAGE

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE

MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL

CHIP-ON-FILM PACKAGE

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES

SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE

POWER SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR MODULE

DOUBLE-SIDE COOLING-TYPE SEMICONDUCTOR DEVICE

TRANSPARENT DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND T...

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC...

POWER MODULE

DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE

SOLDERING STRUCTURE AND POWER MODULE COMPRISING THE SAME

SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC STRUCTURE AND METHOD...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

METHOD FOR FABRICATING AN ELECTRONIC DEVICE

PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE

ELECTROCONDUCTIVE ADHESIVE

DIE WITH METALLIZED SIDEWALL AND METHOD OF MANUFACTURING

BACKSIDE SPACER STRUCTURES FOR IMPROVED THERMAL PERFORMANCE

PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE

SPACER PARTICLES FOR BOND LINE THICKNESS CONTROL IN SINTERING PASTES

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE