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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75314Auxiliary members on the pressing surface

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods for releasing ultra-small or ultra-thin discrete components...
- Patent number 11,728,201
- Issue date Aug 15, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved transfer of semiconductor die
- Patent number 11,152,339
- Issue date Oct 19, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,024,596
- Issue date Jun 1, 2021
- Shinkawa Ltd.
- Osamu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Setting up ultra-small or ultra-thin discrete components for easy a...
- Patent number 10,937,680
- Issue date Mar 2, 2021
- Uniqarta, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,910,354
- Issue date Feb 2, 2021
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including heating and...
- Patent number 10,669,454
- Issue date Jun 2, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices f...
- Patent number 10,636,770
- Issue date Apr 28, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for transfer of semiconductor devices
- Patent number 10,622,337
- Issue date Apr 14, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,615,153
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Semiconductor device on glass substrate
- Patent number 10,615,152
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,566,319
- Issue date Feb 18, 2020
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices
- Patent number 10,490,532
- Issue date Nov 26, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Jig for bonding a semiconductor chip, apparatus for bonding a semic...
- Patent number 10,410,990
- Issue date Sep 10, 2019
- Samsung Electronics Co., Ltd.
- Man-Hee Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for multi-direct transfer of semiconductors
- Patent number 10,373,937
- Issue date Aug 6, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Substrate with array of LEDs for backlighting a display device
- Patent number 10,361,176
- Issue date Jul 23, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device on string circuit and method of making the same
- Patent number 10,325,885
- Issue date Jun 18, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for improved direct transfer of semiconductor die
- Patent number 10,290,615
- Issue date May 14, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for simultaneously bonding multiple chips of different heigh...
- Patent number 10,147,702
- Issue date Dec 4, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, heat insulating load...
- Patent number 10,020,282
- Issue date Jul 10, 2018
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for transferring a chip to a contact substrate
- Patent number 9,401,298
- Issue date Jul 26, 2016
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device and electronic device
- Patent number 9,391,031
- Issue date Jul 12, 2016
- Fujitsu Limited
- Tetsuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate peripheral clamping to control microelectronic module BSM...
- Patent number 9,219,051
- Issue date Dec 22, 2015
- GLOBALFOUNDRIES Inc.
- Stephanie Allard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser assisted transfer welding process
- Patent number 9,161,448
- Issue date Oct 13, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming packages
- Patent number 8,603,860
- Issue date Dec 10, 2013
- Taiwan Semiconductor Manufacturing Company, L.L.C.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...
- Publication number 20240145427
- Publication date May 2, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20240120311
- Publication date Apr 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- FUTOSHI YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...
- Publication number 20240105671
- Publication date Mar 28, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
- Publication number 20230377936
- Publication date Nov 23, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20210005570
- Publication date Jan 7, 2021
- SHINKAWA LTD.
- Osamu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...
- Publication number 20200251453
- Publication date Aug 6, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20200243491
- Publication date Jul 30, 2020
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE
- Publication number 20200235081
- Publication date Jul 23, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
Apparatus and Method for Direct Transfer of Semiconductor Devices
- Publication number 20200168587
- Publication date May 28, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
- Publication number 20200135534
- Publication date Apr 30, 2020
- UNIQARTA, INC.
- Val Marinov
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20200095481
- Publication date Mar 26, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20190348405
- Publication date Nov 14, 2019
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Application
METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE
- Publication number 20190237445
- Publication date Aug 1, 2019
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR LIGHT DIFFUSION
- Publication number 20190139945
- Publication date May 9, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semic...
- Publication number 20190103376
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Man-Hee Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE PERIPHERAL CLAMPING TO CONTROL MICROELECTRONIC MODULE BSM...
- Publication number 20140359996
- Publication date Dec 11, 2014
- Stephanie Allard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sintering Utilizing Non-Mechanical Pressure
- Publication number 20140224409
- Publication date Aug 14, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20140084491
- Publication date Mar 27, 2014
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Forming Packages
- Publication number 20130102112
- Publication date Apr 25, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASSISTED TRANSFER WELDING PROCESS
- Publication number 20120115262
- Publication date May 10, 2012
- Semprius, Inc.
- Etienne Menard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BONDING APPARATUS
- Publication number 20120091186
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120091187
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board Assembly Manufacturing Device And Method
- Publication number 20120018084
- Publication date Jan 26, 2012
- Samsung Electronics Co., Ltd.
- Kyung Woon Jang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR ASSEMBLY AND MULTILAYER WIRING BOARD
- Publication number 20110279996
- Publication date Nov 17, 2011
- Yoshihiro Tomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for electronic devices
- Publication number 20110253767
- Publication date Oct 20, 2011
- RENESAS ELECTRONICS CORPORATION
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for electronic devices
- Publication number 20100291732
- Publication date Nov 18, 2010
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING DEVICE, MOUNTING METHOD, PACKAGE, AND PRESSURIZING PLATE
- Publication number 20100085723
- Publication date Apr 8, 2010
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazutaka FURUTA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Compression bonding device
- Publication number 20090314437
- Publication date Dec 24, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B30 - PRESSES
Information Patent Application
COMBINED METALLIC BONDING AND MOLDING FOR ELECTRONIC ASSEMBLIES INC...
- Publication number 20090291524
- Publication date Nov 26, 2009
- Texas Instruments Inc.
- YOSHIMI TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Mounting Method and Electronic Circuit Device
- Publication number 20090223705
- Publication date Sep 10, 2009
- Yoshihisa Yamashita
- B30 - PRESSES

Auxiliary members on the pressing surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for releasing ultra-small or ultra-thin discrete components...

Adhesive for semiconductor device, and high productivity method for...

Systems for direct transfer of semiconductor device die

Direct transfer of semiconductor devices from a substrate

Method for transfer of semiconductor devices onto glass substrates

Method for improved transfer of semiconductor die

Bonding apparatus and bonding method

Setting up ultra-small or ultra-thin discrete components for easy a...

Apparatus for direct transfer of semiconductor device die

Method for manufacturing semiconductor device including heating and...

Apparatus and method for direct transfer of semiconductor devices f...

Method and apparatus for transfer of semiconductor devices

Apparatus for direct transfer of semiconductor device die

Semiconductor device on glass substrate

Apparatus for the material-bonded connection of connection partners...

Apparatus for direct transfer of semiconductor device die

Apparatus and method for direct transfer of semiconductor devices

Jig for bonding a semiconductor chip, apparatus for bonding a semic...

Apparatus for multi-direct transfer of semiconductors

Substrate with array of LEDs for backlighting a display device

Semiconductor device on string circuit and method of making the same

Method and apparatus for improved direct transfer of semiconductor die

Laser assisted transfer welding process

Method for simultaneously bonding multiple chips of different heigh...

Method for manufacturing semiconductor device, heat insulating load...

Method and device for transferring a chip to a contact substrate

Method for manufacturing electronic device and electronic device

Laminate peripheral clamping to control microelectronic module BSM...

Laser assisted transfer welding process

Process for forming packages

Patents Applicationslast 30 patents

APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...

BONDING APPARATUS

APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...

Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...

BONDING APPARATUS AND BONDING METHOD

APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE

Apparatus and Method for Direct Transfer of Semiconductor Devices

Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE

METHOD AND APPARATUS FOR LIGHT DIFFUSION

Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semic...

LAMINATE PERIPHERAL CLAMPING TO CONTROL MICROELECTRONIC MODULE BSM...

Sintering Utilizing Non-Mechanical Pressure

METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

Process for Forming Packages

LASER ASSISTED TRANSFER WELDING PROCESS

BONDING APPARATUS

BONDING APPARATUS AND BONDING METHOD

Printed Circuit Board Assembly Manufacturing Device And Method

SEMICONDUCTOR ASSEMBLY AND MULTILAYER WIRING BOARD

Manufacturing method for electronic devices

Manufacturing method for electronic devices

MOUNTING DEVICE, MOUNTING METHOD, PACKAGE, AND PRESSURIZING PLATE

Compression bonding device

COMBINED METALLIC BONDING AND MOLDING FOR ELECTRONIC ASSEMBLIES INC...

Electronic Component Mounting Method and Electronic Circuit Device