Avoid alteration of functional structures by etching

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B81C1/00801

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00801Avoid alteration of functional structures by etching

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Micromechanical component for a sensor device or microphone device
- Patent number 12,151,936
- Issue date Nov 26, 2024
- Robert Bosch GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electromechanical system and method for fabricating MEMS havi...
- Patent number 12,103,845
- Issue date Oct 1, 2024
- United Microelectronics Corp.
- Jung-Hao Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a microelectromechanical sensor and microelect...
- Patent number 11,958,740
- Issue date Apr 16, 2024
- Robert Bosch GmbH
- Achim Kronenberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with polysilicon and etch stop layer
- Patent number 11,731,871
- Issue date Aug 22, 2023
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,427,466
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device, microphone and methods for forming a semicond...
- Patent number 11,352,253
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Markus Kahn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems (MEMS) structure to prevent stiction...
- Patent number 11,167,979
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Yen Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical component and method for producing same
- Patent number 11,148,940
- Issue date Oct 19, 2021
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Dirk Rudloff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-device having a metal-semiconductor compound layer protected...
- Patent number 11,027,969
- Issue date Jun 8, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Stephanus Louwers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS structure with an etch stop layer buried within inter-dielectr...
- Patent number 10,927,000
- Issue date Feb 23, 2021
- United Microelectronics Corp.
- Li-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS method and structure
- Patent number 10,889,493
- Issue date Jan 12, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Hau Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device, microphone and methods for forming a semicond...
- Patent number 10,858,246
- Issue date Dec 8, 2020
- Infineon Technologies AG
- Markus Kahn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar processing of suspended microelectromechanical systems (MEMS...
- Patent number 10,800,649
- Issue date Oct 13, 2020
- Analog Devices International Unlimited Company
- Michael John Flynn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated gas flow structure
- Patent number 10,794,374
- Issue date Oct 6, 2020
- The Regents of the University of Michigan
- Yogesh Gianchandani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Release chemical protection for integrated complementary metal-oxid...
- Patent number 10,683,205
- Issue date Jun 16, 2020
- Invensense, Inc.
- Michael J. Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Infrared sensor design using an epoxy film as an infrared absorptio...
- Patent number 10,570,006
- Issue date Feb 25, 2020
- Texas Instruments Incorporated
- Ricky Alan Jackson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display apparatus and method of manufacturing the same
- Patent number 10,564,507
- Issue date Feb 18, 2020
- Samsung Display Co., Ltd.
- Jaewook Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical structure having a copper circuit trace
- Patent number 10,549,983
- Issue date Feb 4, 2020
- Robert Bosch GmbH
- Christoph Kaiser
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Infrared sensor design using an epoxy film as an infrared absorptio...
- Patent number 10,526,198
- Issue date Jan 7, 2020
- Texas Instruments Incorporated
- Ricky Alan Jackson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,486,965
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,475,640
- Issue date Nov 12, 2019
- United Microelectronics Corporation
- Yan-Da Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,442,687
- Issue date Oct 15, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,407,302
- Issue date Sep 10, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,364,146
- Issue date Jul 30, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure for device with integrated microelectromechanical systems
- Patent number 10,343,902
- Issue date Jul 9, 2019
- Soitec
- Bruno Ghyselen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display apparatus and method of manufacturing the same
- Patent number 10,338,449
- Issue date Jul 2, 2019
- Samsung Display Co., Ltd.
- Jaewook Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electromechanical device including connector formed of dielectric m...
- Patent number 10,280,078
- Issue date May 7, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Wei Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,239,751
- Issue date Mar 26, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS method and structure
- Patent number 10,160,642
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Hau Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,160,643
- Issue date Dec 25, 2018
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVI...
- Publication number 20240425366
- Publication date Dec 26, 2024
- United Microelectronics Corp.
- Jung-Hao CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT
- Publication number 20240383745
- Publication date Nov 21, 2024
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF M...
- Publication number 20240375943
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF M...
- Publication number 20230382724
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE MANUFACTURING METHOD
- Publication number 20230348262
- Publication date Nov 2, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Audrey Berthelot
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE
- Publication number 20220396477
- Publication date Dec 15, 2022
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH POLYSILICON AND ETCH STOP LAYER
- Publication number 20220380209
- Publication date Dec 1, 2022
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GAS SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20220128498
- Publication date Apr 28, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Seungeon MOON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVI...
- Publication number 20220119248
- Publication date Apr 21, 2022
- United Microelectronics Corp.
- Jung-Hao CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING A CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJ...
- Publication number 20220048763
- Publication date Feb 17, 2022
- Hewlett-Packard Development Company, L.P.
- Stanley J. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROELECTROMECHANICAL SENSOR AND MICROELECT...
- Publication number 20220033256
- Publication date Feb 3, 2022
- ROBERT BOSCH GmbH
- Achim Kronenberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A MEMS Display Device With An Etch-Stop-Layer
- Publication number 20210364781
- Publication date Nov 25, 2021
- IGNITE, Inc.
- Fusao Ishii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210017018
- Publication date Jan 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device, Microphone and Methods for Forming a Semicond...
- Publication number 20210002132
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Markus Kahn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL COMPONENT AND METHOD FOR PRODUCING SAME
- Publication number 20200239303
- Publication date Jul 30, 2020
- Fraunhofer-Gesellschaft zur foerderung der Angewandten Forschung e.V.
- Dirk RUDLOFF
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS (MEMS) STRUCTURE TO PREVENT STICTION...
- Publication number 20200079642
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Yen Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190271894
- Publication date Sep 5, 2019
- SAMSUNG DISPLAY CO., LTD.
- Jaewook Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE HAVING A COPPER CIRCUIT TRACE
- Publication number 20190177156
- Publication date Jun 13, 2019
- ROBERT BOSCH GmbH
- Christoph Kaiser
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Method and Structure
- Publication number 20190119105
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Hau Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190027358
- Publication date Jan 24, 2019
- UNITED MICROELECTRONICS CORPORATION
- YAN-DA CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RELEASE CHEMICAL PROTECTION FOR INTEGRATED COMPLEMENTARY METAL-OXID...
- Publication number 20180346323
- Publication date Dec 6, 2018
- InvenSense, Inc.
- Michael J. Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PROCESS
- Publication number 20180339901
- Publication date Nov 29, 2018
- United Microelectronics Corp.
- Guo-Chih Wei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE, MICROPHONE AND METHODS FOR FORMING A SEMICOND...
- Publication number 20180237292
- Publication date Aug 23, 2018
- INFINEON TECHNOLOGIES AG
- Markus Kahn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20180044177
- Publication date Feb 15, 2018
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180011385
- Publication date Jan 11, 2018
- SAMSUNG DISPLAY CO., LTD.
- Jaewook Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE FOR DEVICE WITH INTEGRATED MICROELECTROMECHANICAL SYSTEMS
- Publication number 20170253478
- Publication date Sep 7, 2017
- SOITEC
- Bruno Ghyselen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROMECHANICAL DEVICE, RELATED MANUFACTURING METHOD, AND RELATED...
- Publication number 20170197826
- Publication date Jul 13, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Wei WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL LAYER SYSTEM
- Publication number 20170081183
- Publication date Mar 23, 2017
- ROBERT BOSCH GmbH
- Simon Armbruster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATED DEVICE WITH SELECTIVE BOND PAD PROTECTION
- Publication number 20170066648
- Publication date Mar 9, 2017
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS STRUCTURE WITH AN ETCH STOP LAYER BURIED WITHIN INTER-DIELECTR...
- Publication number 20170036905
- Publication date Feb 9, 2017
- UNITED MICROELECTRONICS CORP.
- Li-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Avoid alteration of functional structures by etching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micromechanical component for a sensor device or microphone device

Micro-electromechanical system and method for fabricating MEMS havi...

Method for producing a microelectromechanical sensor and microelect...

Actuator layer patterning with polysilicon and etch stop layer

Semiconductor package structure and method for manufacturing the same

Semiconductor device, microphone and methods for forming a semicond...

Microelectromechanical systems (MEMS) structure to prevent stiction...

Microelectromechanical component and method for producing same

Micro-device having a metal-semiconductor compound layer protected...

MEMS structure with an etch stop layer buried within inter-dielectr...

MEMS method and structure

Semiconductor device, microphone and methods for forming a semicond...

Planar processing of suspended microelectromechanical systems (MEMS...

Microfabricated gas flow structure

Release chemical protection for integrated complementary metal-oxid...

Infrared sensor design using an epoxy film as an infrared absorptio...

Display apparatus and method of manufacturing the same

Micromechanical structure having a copper circuit trace

Infrared sensor design using an epoxy film as an infrared absorptio...

Wafer-level package with enhanced performance

Method for manufacturing semiconductor device

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Structure for device with integrated microelectromechanical systems

Display apparatus and method of manufacturing the same

Electromechanical device including connector formed of dielectric m...

Wafer-level package with enhanced performance

MEMS method and structure

Wafer-level package with enhanced performance

Patents Applicationslast 30 patents

MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVI...

MICROMECHANICAL COMPONENT

DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF M...

DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF M...

MEMS DEVICE MANUFACTURING METHOD

MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE

ACTUATOR LAYER PATTERNING WITH POLYSILICON AND ETCH STOP LAYER

GAS SENSOR AND MANUFACTURING METHOD THEREOF

MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVI...

MANUFACTURING A CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJ...

METHOD FOR PRODUCING A MICROELECTROMECHANICAL SENSOR AND MICROELECT...

A MEMS Display Device With An Etch-Stop-Layer

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device, Microphone and Methods for Forming a Semicond...

MICROELECTROMECHANICAL COMPONENT AND METHOD FOR PRODUCING SAME

MICROELECTROMECHANICAL SYSTEMS (MEMS) STRUCTURE TO PREVENT STICTION...

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

MICROMECHANICAL STRUCTURE HAVING A COPPER CIRCUIT TRACE

MEMS Method and Structure

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

RELEASE CHEMICAL PROTECTION FOR INTEGRATED COMPLEMENTARY METAL-OXID...

SEMICONDUCTOR PROCESS

SEMICONDUCTOR DEVICE, MICROPHONE AND METHODS FOR FORMING A SEMICOND...

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

STRUCTURE FOR DEVICE WITH INTEGRATED MICROELECTROMECHANICAL SYSTEMS

ELECTROMECHANICAL DEVICE, RELATED MANUFACTURING METHOD, AND RELATED...

MICROMECHANICAL LAYER SYSTEM

CMOS-MEMS INTEGRATED DEVICE WITH SELECTIVE BOND PAD PROTECTION

MEMS STRUCTURE WITH AN ETCH STOP LAYER BURIED WITHIN INTER-DIELECTR...