Ball grid array [BGA] Bump grid array

Industry

CPC
H05K2201/10734

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10734Ball grid array [BGA] Bump grid array

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 11,974,398
- Issue date Apr 30, 2024
- Denso Corporation
- Hiroyoshi Kunieda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient wave guide transition between package and PCB using solde...
- Patent number 11,963,291
- Issue date Apr 16, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,963,311
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Woong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,942,260
- Issue date Mar 26, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device including antenna member for wireless charging
- Patent number 11,923,709
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Sungtae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid socket warp indicator
- Patent number 11,906,574
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Stephen Michael Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power system
- Patent number 11,881,344
- Issue date Jan 23, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Radio-frequency module and communication device
- Patent number 11,871,508
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Oshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging structure with embedded electronic components and method...
- Patent number 11,864,329
- Issue date Jan 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising a chip package and an overlap-free coil layout
- Patent number 11,831,208
- Issue date Nov 28, 2023
- Infineon Technologies AG
- Udo Ausserlechner
- G01 - MEASURING TESTING
Information Patent Grant
Through board via heat sink
- Patent number 11,825,593
- Issue date Nov 21, 2023
- Aptiv Technologies Limited
- Navneet Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and electronic apparatus
- Patent number 11,818,844
- Issue date Nov 14, 2023
- Canon Kabushiki Kaisha
- Yuya Karakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for providing a scalable ball grid array (BGA)...
- Patent number 11,817,378
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Nelly Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Breakout structure for an integrated circuit device
- Patent number 11,812,544
- Issue date Nov 7, 2023
- Xilinx, Inc.
- Shad Shepston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless BGA interconnect
- Patent number 11,811,182
- Issue date Nov 7, 2023
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout structure of a flexible circuit board
- Patent number 11,812,554
- Issue date Nov 7, 2023
- Chipbond Technology Corporation
- Yu-Chen Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip assemblies
- Patent number 11,805,602
- Issue date Oct 31, 2023
- Intel Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly
- Patent number 11,798,873
- Issue date Oct 24, 2023
- Vitesco Technologies GmbH
- Detlev Bagung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 11,785,707
- Issue date Oct 10, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and electronic device including the same
- Patent number 11,770,898
- Issue date Sep 26, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Investigation instrument
- Patent number 11,762,186
- Issue date Sep 19, 2023
- Scholly Fiberoptic GmbH
- Patrick Spring
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit device with edge bond dam
- Patent number 11,765,836
- Issue date Sep 19, 2023
- Xilinx, Inc.
- Bhavesh Patel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radar sensor, motor vehicle and method for producing a radar sensor
- Patent number 11,756,903
- Issue date Sep 12, 2023
- Audi AG
- Niels Koch
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Housing for receiving electronic devices and electronic system havi...
- Patent number 11,744,056
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Hee-Won Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density 3D interconnect configuration
- Patent number 11,735,526
- Issue date Aug 22, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 11,716,826
- Issue date Aug 1, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded module
- Patent number 11,696,400
- Issue date Jul 4, 2023
- RISING TECHNOLOGIES CO., LTD.
- Shuzo Akejima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,696,407
- Issue date Jul 4, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...
- Publication number 20240147624
- Publication date May 2, 2024
- Canon Kabushiki Kaisha
- NORITAKE TSUBOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...
- Publication number 20240130045
- Publication date Apr 18, 2024
- Medimaging Integrated Solution, Inc.
- SHANGYI WU
- G02 - OPTICS
Information Patent Application
PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...
- Publication number 20240107665
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPRESSION STRUCTURES FOR IC PACKAGES
- Publication number 20240105639
- Publication date Mar 28, 2024
- Apple Inc.
- Helia Rahmani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND POWER MODULE
- Publication number 20240096543
- Publication date Mar 21, 2024
- DELTA ELECTRONICS, INC.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAMERA MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240089571
- Publication date Mar 14, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- KUEI-FENG PENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Printed Circuit Board with Passthrough Signal Connections Between a...
- Publication number 20240080967
- Publication date Mar 7, 2024
- Apple Inc.
- David A. Karol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
- Publication number 20240074048
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240056520
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Youngsub KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
THROUGH BOARD VIA HEAT SINK
- Publication number 20240057246
- Publication date Feb 15, 2024
- Aptiv Technologies Limited
- Navneet GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240049389
- Publication date Feb 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY AND CONFIGURATION METHOD OF THE SAME
- Publication number 20240047325
- Publication date Feb 8, 2024
- Realtek Semiconductor Corp.
- CHIN-YUAN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED COMPONENT ARRAY STRUCTURE
- Publication number 20240015887
- Publication date Jan 11, 2024
- Tesla, Inc.
- Jin Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DYNAMIC CONTROL OF HEAT SINK PRESSURE
- Publication number 20240015880
- Publication date Jan 11, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE...
- Publication number 20240006391
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Sangho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH SINGLE RANK MEMORY CONFIGURATION USING P...
- Publication number 20240006387
- Publication date Jan 4, 2024
- GM Cruise Holdings LLC
- Ajith Sreenilayam
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE
- Publication number 20230420354
- Publication date Dec 28, 2023
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity-Stacked Printed Circuit Board Assemblies
- Publication number 20230413440
- Publication date Dec 21, 2023
- Google LLC
- Jiali Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NETWORK COMMUNICATION DEVICE HAVING ELECTROMAGNETIC SHIELDING FUNCTION
- Publication number 20230413419
- Publication date Dec 21, 2023
- SERCOMM CORPORATION
- Yujian Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLING METHOD OF ELECTRONIC MODULE
- Publication number 20230413450
- Publication date Dec 21, 2023
- Delta Electronics, Inc.
- Kun Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS
- Publication number 20230395480
- Publication date Dec 7, 2023
- Intel Corporation
- Tin Poay Chuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WIRING BOARD
- Publication number 20230371186
- Publication date Nov 16, 2023
- TOPPAN INC.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL POWER SUPPLY SYSTEM AND MANUFACTURING METHOD OF CONNECTION...
- Publication number 20230363084
- Publication date Nov 9, 2023
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Hui LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER REGULATOR INTERFACES FOR INTEGRATED CIRCUITS
- Publication number 20230363085
- Publication date Nov 9, 2023
- NVIDIA Corp.
- MingYi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Wave Guide Transition Between Package and PCB Using Solde...
- Publication number 20230345623
- Publication date Oct 26, 2023
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD-LEVEL STRUCTURE AND COMMUNICATION DEVICE
- Publication number 20230345638
- Publication date Oct 26, 2023
- Huawei Technologies Co., Ltd
- Ying LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH EMBEDDED BUMP PADS
- Publication number 20230345633
- Publication date Oct 26, 2023
- Kent Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three Dimensional Circuit Mounting Structures
- Publication number 20230337350
- Publication date Oct 19, 2023
- NVIDIA Corp.
- Joey Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN CLIENT FORM FACTOR ASSEMBLY
- Publication number 20230317705
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230319992
- Publication date Oct 5, 2023
- Shinko Electric Industries Co., Ltd.
- Koichi Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ball grid array [BGA] Bump grid array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Printed circuit board structure including a closed cavity

Efficient wave guide transition between package and PCB using solde...

Devices and methods related to dual-sided radio-frequency package w...

Printed circuit board and method of manufacturing the same

Power module

Electronic device including antenna member for wireless charging

Hybrid socket warp indicator

Power system

Radio-frequency module and communication device

Packaging structure with embedded electronic components and method...

Device comprising a chip package and an overlap-free coil layout

Through board via heat sink

Semiconductor module and electronic apparatus

Apparatus and method for providing a scalable ball grid array (BGA)...

Breakout structure for an integrated circuit device

Solderless BGA interconnect

Layout structure of a flexible circuit board

Chip assemblies

Semiconductor assembly

Circuit board and manufacturing method thereof and electronic device

Substrate structure and electronic device including the same

Investigation instrument

Integrated circuit device with edge bond dam

Radar sensor, motor vehicle and method for producing a radar sensor

Housing for receiving electronic devices and electronic system havi...

High density 3D interconnect configuration

Platforms including microelectronic packages therein coupled to a c...

Embedded module

Core layer with fully encapsulated co-axial magnetic material aroun...

Patents Applicationslast 30 patents

ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...

LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...

PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...

COMPRESSION STRUCTURES FOR IC PACKAGES

APPARATUS AND POWER MODULE

CAMERA MODULE AND MANUFACTURING METHOD THEREOF

Printed Circuit Board with Passthrough Signal Connections Between a...

SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT

WIRELESS MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

THROUGH BOARD VIA HEAT SINK

PRINTED CIRCUIT BOARD

BALL GRID ARRAY AND CONFIGURATION METHOD OF THE SAME

STACKED COMPONENT ARRAY STRUCTURE

DYNAMIC CONTROL OF HEAT SINK PRESSURE

PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE...

PRINTED CIRCUIT BOARD WITH SINGLE RANK MEMORY CONFIGURATION USING P...

ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE

Cavity-Stacked Printed Circuit Board Assemblies

NETWORK COMMUNICATION DEVICE HAVING ELECTROMAGNETIC SHIELDING FUNCTION

ASSEMBLING METHOD OF ELECTRONIC MODULE

SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS

COMPOSITE WIRING BOARD

VERTICAL POWER SUPPLY SYSTEM AND MANUFACTURING METHOD OF CONNECTION...

POWER REGULATOR INTERFACES FOR INTEGRATED CIRCUITS

Efficient Wave Guide Transition Between Package and PCB Using Solde...

BOARD-LEVEL STRUCTURE AND COMMUNICATION DEVICE

PRINTED CIRCUIT BOARD WITH EMBEDDED BUMP PADS

Three Dimensional Circuit Mounting Structures

THIN CLIENT FORM FACTOR ASSEMBLY

WIRING SUBSTRATE