Barium [Ba]

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H01L2924/01056

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01056Barium [Ba]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light-emitting apparatus
- Patent number 9,960,332
- Issue date May 1, 2018
- Sharp Kabushiki Kaisha
- Masahiro Konishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for measuring analytes using large scale FET...
- Patent number 9,951,382
- Issue date Apr 24, 2018
- Life Technologies Corporation
- Jonathan M. Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Method of mounting semiconductor chips, semiconductor device obtain...
- Patent number 9,795,033
- Issue date Oct 17, 2017
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Film for semiconductor device production, method for producing film...
- Patent number 9,761,475
- Issue date Sep 12, 2017
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device, semiconductor package, and electronic device
- Patent number 9,496,226
- Issue date Nov 15, 2016
- Samsung Electronics Co., Ltd.
- Yong-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective die electrical insulation by additive process
- Patent number 9,490,230
- Issue date Nov 8, 2016
- Invensas Corporation
- Jeffrey S. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting apparatus
- Patent number 9,461,224
- Issue date Oct 4, 2016
- Sharp Kabushiki Kaisha
- Masahiro Konishi
- F21 - LIGHTING
Information Patent Grant
Electronic component assembly
- Patent number 9,426,899
- Issue date Aug 23, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 9,362,156
- Issue date Jun 7, 2016
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus and method for embedding components in small-form-factor,...
- Patent number 9,362,232
- Issue date Jun 7, 2016
- Intel Corporation
- Debabani Choudhury
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Film for flip chip type semiconductor back surface, dicing tape-int...
- Patent number 9,293,387
- Issue date Mar 22, 2016
- Nitto Denko Corporation
- Yusuke Komoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Light-reflective anisotropic conductive adhesive agent, and light e...
- Patent number 9,260,634
- Issue date Feb 16, 2016
- Dexerials Corporation
- Hidetsugu Namiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multilayer ceramic electronic device and method for manufacturing t...
- Patent number 9,226,400
- Issue date Dec 29, 2015
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for embedding components in small-form-factor,...
- Patent number 9,225,379
- Issue date Dec 29, 2015
- Intel Corporation
- Debabani Choudhury
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing a circuit substrate
- Patent number 9,185,805
- Issue date Nov 10, 2015
- Murata Manufacturing Co., Ltd.
- Yutaka Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting apparatus
- Patent number 9,178,125
- Issue date Nov 3, 2015
- Sharp Kabushiki Kaisha
- Masahiro Konishi
- F21 - LIGHTING
Information Patent Grant
Adhesive sheet for manufacturing semiconductor device, manufacturin...
- Patent number 9,153,556
- Issue date Oct 6, 2015
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective die electrical insulation by additive process
- Patent number 9,147,583
- Issue date Sep 29, 2015
- Invensas Corporation
- Jeffrey S. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for measuring analytes using large scale FET...
- Patent number 9,134,269
- Issue date Sep 15, 2015
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Nano memory, light, energy, antenna and strand-based systems and me...
- Patent number 9,117,550
- Issue date Aug 25, 2015
- Bao Q. Tran
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Wiring method, structure having wiring provided on surface, semicon...
- Patent number 9,082,635
- Issue date Jul 14, 2015
- Panasonic Corporation
- Shingo Yoshioka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Three-dimensional structure for wiring formation
- Patent number 9,082,438
- Issue date Jul 14, 2015
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 9,082,708
- Issue date Jul 14, 2015
- Sumitomo Bakelite Co., Ltd.
- Shinichi Zenbutsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Three-dimensional structure in which wiring is provided on its surface
- Patent number 9,070,393
- Issue date Jun 30, 2015
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Laminating system, IC sheet, scroll of IC sheet, and method for man...
- Patent number 9,053,401
- Issue date Jun 9, 2015
- Semiconductor Energy Laboratory Co., Ltd.
- Ryosuke Watanabe
- B32 - LAYERED PRODUCTS
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 9,035,466
- Issue date May 19, 2015
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20180334708
- Publication date Nov 22, 2018
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE
- Publication number 20160351432
- Publication date Dec 1, 2016
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140367863
- Publication date Dec 18, 2014
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING APPARATUS, SURFACE LIGHT SOURCE, AND METHOD FOR MANU...
- Publication number 20140361331
- Publication date Dec 11, 2014
- Masahiro KONISHI
- F21 - LIGHTING
Information Patent Application
APPARATUS AND METHOD FOR EMBEDDING COMPONENTS IN SMALL-FORM-FACTOR,...
- Publication number 20140342679
- Publication date Nov 20, 2014
- Debabani Choudhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
- Publication number 20140225236
- Publication date Aug 14, 2014
- Yong-Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE
- Publication number 20140183751
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION
- Publication number 20140182887
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
- Publication number 20140175677
- Publication date Jun 26, 2014
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING APPARATUS
- Publication number 20140159092
- Publication date Jun 12, 2014
- SHARP KABUSHIKI KAISHA
- Masahiro Konishi
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140141550
- Publication date May 22, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...
- Publication number 20140097004
- Publication date Apr 10, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...
- Publication number 20140090876
- Publication date Apr 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING T...
- Publication number 20140016288
- Publication date Jan 16, 2014
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20130338046
- Publication date Dec 19, 2013
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
Active Energy Ray-Curable Pressure-Sensitive Adhesive for Re-Releas...
- Publication number 20130273361
- Publication date Oct 17, 2013
- Katsuhiko KAMIYA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...
- Publication number 20130242500
- Publication date Sep 19, 2013
- MEGICA Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHEMICAL SENSOR ARRAY HAVING MULTIPLE SENSORS PER WELL
- Publication number 20130244908
- Publication date Sep 19, 2013
- Life Technologies Corporation
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
HIGH DENSITY SENSOR ARRAY WITHOUT WELLS
- Publication number 20130217587
- Publication date Aug 22, 2013
- Life Technologies Corporation
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20130210641
- Publication date Aug 15, 2013
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...
- Publication number 20130200522
- Publication date Aug 8, 2013
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...
- Publication number 20130193467
- Publication date Aug 1, 2013
- Nichia Corporation.
- Takeshi KUSUSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROCESSING A THERMAL INTERFACE MATERIAL
- Publication number 20130140014
- Publication date Jun 6, 2013
- Lakshmi Supriya
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON S...
- Publication number 20130105329
- Publication date May 2, 2013
- Atotech Deutschland GmbH
- Kai-Jens Matejat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE FILM,...
- Publication number 20130105998
- Publication date May 2, 2013
- TORAY INDUSTRIES, INC.
- Kazuyuki Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130106388
- Publication date May 2, 2013
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Barium [Ba]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for applying a bonding layer

Light-emitting apparatus

Methods and apparatus for measuring analytes using large scale FET...

Method of mounting semiconductor chips, semiconductor device obtain...

Film for semiconductor device production, method for producing film...

Epoxy resin composition for encapsulating semiconductor device and...

Method for applying a bonding layer

Integrated circuit chip using top post-passivation technology and b...

Semiconductor device, semiconductor package, and electronic device

Selective die electrical insulation by additive process

Light-emitting apparatus

Electronic component assembly

Dicing tape-integrated film for semiconductor back surface

Apparatus and method for embedding components in small-form-factor,...

Film for flip chip type semiconductor back surface, dicing tape-int...

Light-reflective anisotropic conductive adhesive agent, and light e...

Multilayer ceramic electronic device and method for manufacturing t...

Apparatus and method for embedding components in small-form-factor,...

Method of manufacturing a circuit substrate

Light-emitting apparatus

Adhesive sheet for manufacturing semiconductor device, manufacturin...

Selective die electrical insulation by additive process

Methods and apparatus for measuring analytes using large scale FET...

Nano memory, light, energy, antenna and strand-based systems and me...

Wiring method, structure having wiring provided on surface, semicon...

Three-dimensional structure for wiring formation

Semiconductor device

Three-dimensional structure in which wiring is provided on its surface

Laminating system, IC sheet, scroll of IC sheet, and method for man...

Dicing tape-integrated film for semiconductor back surface

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE

METHOD FOR APPLYING A BONDING LAYER

SEMICONDUCTOR DEVICE

LIGHT-EMITTING APPARATUS, SURFACE LIGHT SOURCE, AND METHOD FOR MANU...

APPARATUS AND METHOD FOR EMBEDDING COMPONENTS IN SMALL-FORM-FACTOR,...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE

THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

LIGHT-EMITTING APPARATUS

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...

METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...

SEMICONDUCTOR DEVICE

MULTILAYER CERAMIC ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING T...

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

Active Energy Ray-Curable Pressure-Sensitive Adhesive for Re-Releas...

INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...

CHEMICAL SENSOR ARRAY HAVING MULTIPLE SENSORS PER WELL

HIGH DENSITY SENSOR ARRAY WITHOUT WELLS

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...

SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...

METHODS OF PROCESSING A THERMAL INTERFACE MATERIAL

METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON S...

PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE FILM,...

SEMICONDUCTOR DEVICE