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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/53209based on metals

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 12,154,823
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package with trench to reduce slippage and display dev...
- Patent number 12,148,337
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Han
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Memory cell in wafer backside
- Patent number 12,148,682
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Biswanath Senapati
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of fabricating pedestal based memory devices using pocket in...
- Patent number 12,142,310
- Issue date Nov 12, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure for memory device
- Patent number 12,137,558
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 12,131,992
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with a contact to source/drain layers and f...
- Patent number 12,131,990
- Issue date Oct 29, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon buried power rail implemented backside power distri...
- Patent number 12,125,788
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices including strings of memory cells, and related elect...
- Patent number 12,113,019
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure with double conductors
- Patent number 12,087,685
- Issue date Sep 10, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hardened interlayer dielectric layer
- Patent number 12,087,692
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten alloys in semiconductor devices
- Patent number 12,080,648
- Issue date Sep 3, 2024
- Intel Corporation
- Yang Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less structures
- Patent number 12,080,593
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pocket integration process for embedded memory
- Patent number 12,069,866
- Issue date Aug 20, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure integrating air gaps and methods of...
- Patent number 12,068,372
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with through via extending through redistribution...
- Patent number 12,068,212
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 12,062,614
- Issue date Aug 13, 2024
- International Business Machines Corporation
- John Bruley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Prevention of contact bottom void in semiconductor fabrication
- Patent number 12,062,578
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method for forming the same
- Patent number 12,062,540
- Issue date Aug 13, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING LTD.
- Ya-Ting Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate cut and fin trim isolation for advanced integrated circuit str...
- Patent number 12,057,492
- Issue date Aug 6, 2024
- Intel Corporation
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,051,592
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having a barrier layer along the sidewall of...
- Patent number 12,046,551
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,033,889
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 12,027,458
- Issue date Jul 2, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having bit line with stepped profile
- Patent number 12,022,649
- Issue date Jun 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer feature fill
- Patent number 12,014,928
- Issue date Jun 18, 2024
- Lam Research Corporation
- Xiaolan Ba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit with metal stop ring outside the scribe seal
- Patent number 12,009,319
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact resistance between via and conductive line
- Patent number 12,009,254
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure for memory device
- Patent number 12,010,838
- Issue date Jun 11, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PHYSICALLY UNCLONABLE FUNCTION ENTROPY SOURCE
- Publication number 20240413099
- Publication date Dec 12, 2024
- Xilinx, Inc.
- James David Wesselkamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECTS FORMED THROUGH ATOMIC LAYER...
- Publication number 20240412980
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE
- Publication number 20240395612
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hsien CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS
- Publication number 20240395702
- Publication date Nov 28, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395701
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED STACKED DTC STRUCTURE
- Publication number 20240395948
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED SEAL RING STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20240387404
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240387368
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INTEGRATING AIR GAPS AND METHODS OF...
- Publication number 20240379761
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ching WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240379545
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Jeong Wan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...
- Publication number 20240379435
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-TEMPERATURE DEPOSITION PROCESSES TO FORM MOLYBDENUM-BASED MATER...
- Publication number 20240360549
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Feng Q. Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363464
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION
- Publication number 20240363429
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
- Publication number 20240355784
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240355622
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Ting CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR BARRIER-LESS PLUG
- Publication number 20240347342
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA STRUCTURES AND METHODS
- Publication number 20240339396
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20240332399
- Publication date Oct 3, 2024
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PLUG STRUCTURE
- Publication number 20240332178
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Young Gwang YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON...
- Publication number 20240332071
- Publication date Oct 3, 2024
- Intel Corporation
- Alireza Narimannezhad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BACK SIDE INTERCONNECT PATTERNING AND FRONT SIDE METAL INTERCONNECT...
- Publication number 20240332064
- Publication date Oct 3, 2024
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT METAL LINER FOR INTERCONNECT STRUCTURES
- Publication number 20240332075
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH THERMOELECTRIC COOLER
- Publication number 20240321677
- Publication date Sep 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jingjing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240312835
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD OF FABRICATING THE SAME
- Publication number 20240312971
- Publication date Sep 19, 2024
- AUO Corporation
- Chih-Tsung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...
- Publication number 20240304543
- Publication date Sep 12, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20240297119
- Publication date Sep 5, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS

based on metals

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing the same

Chip on film package with trench to reduce slippage and display dev...

Memory cell in wafer backside

Method of fabricating pedestal based memory devices using pocket in...

Contact over active gate structures for advanced integrated circuit...

Staircase structure for memory device

Semiconductor structure and method of manufacturing the same

Semiconductor structure with a contact to source/drain layers and f...

Through silicon buried power rail implemented backside power distri...

Memory devices including strings of memory cells, and related elect...

Semiconductor interconnect structure with double conductors

Hardened interlayer dielectric layer

Tungsten alloys in semiconductor devices

Barrier-less structures

Pocket integration process for embedded memory

Semiconductor device structure integrating air gaps and methods of...

Package structure with through via extending through redistribution...

Low resistance contacts including intermetallic alloy of nickel, pl...

Prevention of contact bottom void in semiconductor fabrication

Integrated circuit device and method for forming the same

Gate cut and fin trim isolation for advanced integrated circuit str...

Method and structure for barrier-less plug

Interconnect structure having a barrier layer along the sidewall of...

Semiconductor device structure and methods of forming the same

Subtractively patterned interconnect structures for integrated circ...

Memory device having bit line with stepped profile

Multi-layer feature fill

Integrated circuit with metal stop ring outside the scribe seal

Contact resistance between via and conductive line

Staircase structure for memory device

Patents Applicationslast 30 patents

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL

MULTI-DIE PHYSICALLY UNCLONABLE FUNCTION ENTROPY SOURCE

SEMICONDUCTOR DEVICE WITH INTERCONNECTS FORMED THROUGH ATOMIC LAYER...

CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE

SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DOUBLE-SIDED STACKED DTC STRUCTURE

ADVANCED SEAL RING STRUCTURE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE STRUCTURE INTEGRATING AIR GAPS AND METHODS OF...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...

LOW-TEMPERATURE DEPOSITION PROCESSES TO FORM MOLYBDENUM-BASED MATER...

PACKAGE STRUCTURE

PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION

HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS

INTEGRATED CIRCUIT DEVICE

METHOD AND STRUCTURE FOR BARRIER-LESS PLUG

SELF-ALIGNED VIA STRUCTURES AND METHODS

GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...

SEMICONDUCTOR DEVICE INCLUDING A PLUG STRUCTURE

PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON...

BACK SIDE INTERCONNECT PATTERNING AND FRONT SIDE METAL INTERCONNECT...

GRADIENT METAL LINER FOR INTERCONNECT STRUCTURES

SEMICONDUCTOR DEVICES WITH THERMOELECTRIC COOLER

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

ELECTRONIC APPARATUS AND METHOD OF FABRICATING THE SAME

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...

LIQUID METAL CONNECTION DEVICE AND METHOD