based on metals

Industry

CPC
H01L23/53209

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53209based on metals

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Metal heterojunction structure with capping metal layer
- Patent number 12,224,179
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing a via and a metal wiring for a semiconducto...
- Patent number 12,224,237
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device having an etch-stop...
- Patent number 12,218,054
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,218,005
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsia-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with conductive contacts of differen...
- Patent number 12,218,055
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Ming-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a metal liner for interconnect structures
- Patent number 12,211,743
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Ge Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming nanocrystalline graphene
- Patent number 12,211,744
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Keunwook Shin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Advanced seal ring structure and method of making the same
- Patent number 12,199,049
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,191,270
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive interconnect formation
- Patent number 12,183,630
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a transition metal containing film on a substrate...
- Patent number 12,173,402
- Issue date Dec 24, 2024
- ASM IP Holding B.V.
- Timo Hatanpää
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 12,154,823
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package with trench to reduce slippage and display dev...
- Patent number 12,148,337
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Han
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Memory cell in wafer backside
- Patent number 12,148,682
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Biswanath Senapati
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of fabricating pedestal based memory devices using pocket in...
- Patent number 12,142,310
- Issue date Nov 12, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure for memory device
- Patent number 12,137,558
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 12,131,992
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with a contact to source/drain layers and f...
- Patent number 12,131,990
- Issue date Oct 29, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon buried power rail implemented backside power distri...
- Patent number 12,125,788
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices including strings of memory cells, and related elect...
- Patent number 12,113,019
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure with double conductors
- Patent number 12,087,685
- Issue date Sep 10, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hardened interlayer dielectric layer
- Patent number 12,087,692
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less structures
- Patent number 12,080,593
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten alloys in semiconductor devices
- Patent number 12,080,648
- Issue date Sep 3, 2024
- Intel Corporation
- Yang Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pocket integration process for embedded memory
- Patent number 12,069,866
- Issue date Aug 20, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure integrating air gaps and methods of...
- Patent number 12,068,372
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with through via extending through redistribution...
- Patent number 12,068,212
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRENCH LINER FUSE
- Publication number 20250062225
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250062234
- Publication date Feb 20, 2025
- CXMT CORPORATION
- Xiang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICOND...
- Publication number 20250056813
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Seulji Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250046705
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Nobuhito SHIRAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250046653
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20250031366
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006639
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yuan KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PHYSICALLY UNCLONABLE FUNCTION ENTROPY SOURCE
- Publication number 20240413099
- Publication date Dec 12, 2024
- Xilinx, Inc.
- James David Wesselkamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECTS FORMED THROUGH ATOMIC LAYER...
- Publication number 20240412980
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE
- Publication number 20240395612
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hsien CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS
- Publication number 20240395702
- Publication date Nov 28, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395701
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED STACKED DTC STRUCTURE
- Publication number 20240395948
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED SEAL RING STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20240387404
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240387368
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INTEGRATING AIR GAPS AND METHODS OF...
- Publication number 20240379761
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ching WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240379545
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Jeong Wan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...
- Publication number 20240379435
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-TEMPERATURE DEPOSITION PROCESSES TO FORM MOLYBDENUM-BASED MATER...
- Publication number 20240360549
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Feng Q. Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363464
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION
- Publication number 20240363429
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240355622
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Ting CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
- Publication number 20240355784
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR BARRIER-LESS PLUG
- Publication number 20240347342
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA STRUCTURES AND METHODS
- Publication number 20240339396
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20240332399
- Publication date Oct 3, 2024
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PLUG STRUCTURE
- Publication number 20240332178
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Young Gwang YOON
- H01 - BASIC ELECTRIC ELEMENTS

based on metals

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal heterojunction structure with capping metal layer

Method of manufacturing a via and a metal wiring for a semiconducto...

Method of forming an integrated circuit device having an etch-stop...

Integrated circuit device

Semiconductor device structure with conductive contacts of differen...

Method of forming a metal liner for interconnect structures

Method of forming nanocrystalline graphene

Advanced seal ring structure and method of making the same

Gate line plug structures for advanced integrated circuit structure...

Plugs for interconnect lines for advanced integrated circuit struct...

Integrated circuit package and method of forming same

Additive interconnect formation

Method of forming a transition metal containing film on a substrate...

Semiconductor device and a method of manufacturing the same

Chip on film package with trench to reduce slippage and display dev...

Memory cell in wafer backside

Method of fabricating pedestal based memory devices using pocket in...

Contact over active gate structures for advanced integrated circuit...

Staircase structure for memory device

Semiconductor structure and method of manufacturing the same

Semiconductor structure with a contact to source/drain layers and f...

Through silicon buried power rail implemented backside power distri...

Memory devices including strings of memory cells, and related elect...

Semiconductor interconnect structure with double conductors

Hardened interlayer dielectric layer

Barrier-less structures

Tungsten alloys in semiconductor devices

Pocket integration process for embedded memory

Semiconductor device structure integrating air gaps and methods of...

Package structure with through via extending through redistribution...

Patents Applicationslast 30 patents

TRENCH LINER FUSE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICOND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

STAIRCASE STRUCTURE FOR MEMORY DEVICE

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL

MULTI-DIE PHYSICALLY UNCLONABLE FUNCTION ENTROPY SOURCE

SEMICONDUCTOR DEVICE WITH INTERCONNECTS FORMED THROUGH ATOMIC LAYER...

CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE

SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DOUBLE-SIDED STACKED DTC STRUCTURE

ADVANCED SEAL RING STRUCTURE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE STRUCTURE INTEGRATING AIR GAPS AND METHODS OF...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

LOW-TEMPERATURE DEPOSITION PROCESSES TO FORM MOLYBDENUM-BASED MATER...

PACKAGE STRUCTURE

PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION

INTEGRATED CIRCUIT DEVICE

HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS

METHOD AND STRUCTURE FOR BARRIER-LESS PLUG

SELF-ALIGNED VIA STRUCTURES AND METHODS

GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...

SEMICONDUCTOR DEVICE INCLUDING A PLUG STRUCTURE