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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/53209based on metals

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Patents Grantslast 30 patents

Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 12,362,281
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of performing chemical-mechanical polishing process in semi...
- Patent number 12,362,233
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of embedded memory devices utilizing a self assembled m...
- Patent number 12,363,913
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with different metal materials
- Patent number 12,354,957
- Issue date Jul 8, 2025
- Intel Corporation
- Carl H. Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching metals in semiconductor devices
- Patent number 12,354,881
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided stacked DTC structure
- Patent number 12,356,639
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
- Patent number 12,354,908
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal gates of transistors having reduced resistivity
- Patent number 12,347,729
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar slab vias for integrated circuit interconnects
- Patent number 12,341,092
- Issue date Jun 24, 2025
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure, electronic device including the same, and m...
- Patent number 12,341,063
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Keunwook Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,341,013
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure by diffusing manganese...
- Patent number 12,341,101
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding technology for stacking integrated circuits
- Patent number 12,315,843
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,315,792
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jongmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,315,795
- Issue date May 27, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure without barrier layer on bottom surface of via
- Patent number 12,308,282
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tz-Jun Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned conductive features
- Patent number 12,300,600
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor (FinFET) device structure with protecti...
- Patent number 12,300,538
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 12,300,601
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directed self-assembly enabled subtractive metal patterning
- Patent number 12,293,913
- Issue date May 6, 2025
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with silicide portion between conduc...
- Patent number 12,288,748
- Issue date Apr 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 12,283,523
- Issue date Apr 22, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tiantian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with identification structure, method for manu...
- Patent number 12,272,643
- Issue date Apr 8, 2025
- AP Memory Technology Corporation
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 12,266,568
- Issue date Apr 1, 2025
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact resistance between via and conductive line
- Patent number 12,266,566
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 12,255,247
- Issue date Mar 18, 2025
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing having the con...
- Patent number 12,255,136
- Issue date Mar 18, 2025
- Macronix International Co., Ltd.
- Cheng-Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including composite pad structures on stair...
- Patent number 12,255,143
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE
- Publication number 20250233018
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20250226311
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Taehun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING PAD STRUCTURES ON STAIRCASE STRUC...
- Publication number 20250201715
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20250201629
- Publication date Jun 19, 2025
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20250183121
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE
- Publication number 20250183161
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING FIN STRUCTURE
- Publication number 20250169190
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHUN-LI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE
- Publication number 20250149397
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Seonhaeng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250140608
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsia-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...
- Publication number 20250126869
- Publication date Apr 17, 2025
- Intel Corporation
- Subhash JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TRANSISTOR AND METHOD FOR FABRICATIN...
- Publication number 20250125263
- Publication date Apr 17, 2025
- SK HYNIX INC.
- Seung Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUT SHAPES FOR BACKSIDE METALS
- Publication number 20250118661
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...
- Publication number 20250118664
- Publication date Apr 10, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118671
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Su Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...
- Publication number 20250118667
- Publication date Apr 10, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming A Metal Liner For Interconnect Structures
- Publication number 20250112090
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Ge Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAPS IN TOP LAYERS OF SEMICONDUCTOR DEVICES
- Publication number 20250096139
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- John Jianhong ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20250098258
- Publication date Mar 20, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250087608
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH LINER FUSE
- Publication number 20250062225
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250062234
- Publication date Feb 20, 2025
- CXMT CORPORATION
- Xiang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICOND...
- Publication number 20250056813
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Seulji Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250046705
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Nobuhito SHIRAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250046653
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20250031366
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006639
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yuan KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS

based on metals

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Partial barrier free vias for cobalt-based interconnects and method...

Methods of performing chemical-mechanical polishing process in semi...

Fabrication of embedded memory devices utilizing a self assembled m...

Cobalt based interconnects and methods of fabrication thereof

Interconnect structures with different metal materials

Methods of etching metals in semiconductor devices

Double-sided stacked DTC structure

Amorphous layers for reducing copper diffusion and method forming same

Metal gates of transistors having reduced resistivity

Planar slab vias for integrated circuit interconnects

Interconnect structure, electronic device including the same, and m...

Method and structure for barrier-less plug

Method for forming a semiconductor structure by diffusing manganese...

Hybrid bonding technology for stacking integrated circuits

Semiconductor device

Semiconductor structure and manufacturing method thereof

Interconnect structure without barrier layer on bottom surface of via

Semiconductor device with self-aligned conductive features

Fin field effect transistor (FinFET) device structure with protecti...

Interconnect structure

Directed self-assembly enabled subtractive metal patterning

Semiconductor device structure with silicide portion between conduc...

Semiconductor device and fabrication method thereof

Semiconductor device with identification structure, method for manu...

Interconnect wires including relatively low resistivity cores

Contact resistance between via and conductive line

Trench contact structures for advanced integrated circuit structure...

Semiconductor structure and method for manufacturing having the con...

Microelectronic devices including composite pad structures on stair...

Semiconductor device including penetration via structure

Patents Applicationslast 30 patents

CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE

POWER SEMICONDUCTOR DEVICES

MICROELECTRONIC DEVICES INCLUDING PAD STRUCTURES ON STAIRCASE STRUC...

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE

METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING FIN STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE

INTEGRATED CIRCUIT STRUCTURE

EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...

SEMICONDUCTOR DEVICE INCLUDING TRANSISTOR AND METHOD FOR FABRICATIN...

CUT SHAPES FOR BACKSIDE METALS

SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...

Method Of Forming A Metal Liner For Interconnect Structures

AIRGAPS IN TOP LAYERS OF SEMICONDUCTOR DEVICES

PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

TRENCH LINER FUSE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICOND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

STAIRCASE STRUCTURE FOR MEMORY DEVICE

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL