Membership
Tour
Register
Log in
based on metals
Follow
Industry
CPC
H01L23/53209
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L23/00
Details of semiconductor or other solid state devices
Current Industry
H01L23/53209
based on metals
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method of fabricating semiconductor devices including a fin field e...
Patent number
11,978,775
Issue date
May 7, 2024
Samsung Electronics Co., Ltd.
Doohyun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
Patent number
11,967,522
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jyh-Nan Lin
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Selective tungsten deposition at low temperatures
Patent number
11,967,525
Issue date
Apr 23, 2024
Applied Materials, Inc.
Yi Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
Patent number
11,967,552
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Han Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
Patent number
11,955,532
Issue date
Apr 9, 2024
Intel Corporation
Jeffrey S. Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
Patent number
11,955,534
Issue date
Apr 9, 2024
Intel Corporation
Andrew W. Yeoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with detection conductor
Patent number
11,955,440
Issue date
Apr 9, 2024
Rohm Co., Ltd.
Katsuhiko Yoshihara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for forming dual metal interconnects
Patent number
11,948,885
Issue date
Apr 2, 2024
Applied Materials, Inc.
Suketu A Parikh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trench contact structures for advanced integrated circuit structure...
Patent number
11,948,997
Issue date
Apr 2, 2024
Intel Corporation
Subhash M. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of fabricating the same
Patent number
11,942,427
Issue date
Mar 26, 2024
Samsung Electronics Co., Ltd.
Seung Yong Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pedestal-based pocket integration process for embedded memory
Patent number
11,942,133
Issue date
Mar 26, 2024
Kepler Computing Inc.
Noriyuki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for routing local interconnect structure at same level as re...
Patent number
11,916,077
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of etching metals in semiconductor devices
Patent number
11,915,943
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Wei-Hao Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
Patent number
11,908,735
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Jen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having fin structure
Patent number
11,908,851
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Shun-Li Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal capping layer and methods thereof
Patent number
11,894,266
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shao-Kuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating semiconductor device with intervening layer
Patent number
11,894,268
Issue date
Feb 6, 2024
NANYA TECHNOLOGY CORPORATION
Ping Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating integrated circuit device
Patent number
11,894,267
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsia-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid conductive structures
Patent number
11,894,437
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shuen-Shin Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anti-fuse with laterally extended liner
Patent number
11,881,431
Issue date
Jan 23, 2024
International Business Machines Corporation
Chanro Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through silicon buried power rail implemented backside power distri...
Patent number
11,881,455
Issue date
Jan 23, 2024
Samsung Electronics Co., Ltd.
Saehan Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor image sensor device
Patent number
11,881,493
Issue date
Jan 23, 2024
United Microelectronics Corp.
Ming-Shing Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fin patterning for advanced integrated circuit structure fabrication
Patent number
11,881,520
Issue date
Jan 23, 2024
Intel Corporation
Curtis Ward
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect wires including relatively low resistivity cores
Patent number
11,881,432
Issue date
Jan 23, 2024
Hui Jae Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Double-sided stacked DTC structure
Patent number
11,869,988
Issue date
Jan 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ming Chyi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ferroelectric memory devices
Patent number
11,871,583
Issue date
Jan 9, 2024
Kepler Computing Inc.
Noriyuki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices
Patent number
11,862,556
Issue date
Jan 2, 2024
Samsung Electronics Co., Ltd.
Taemok Gwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cobalt based interconnects and methods of fabrication thereof
Patent number
11,862,563
Issue date
Jan 2, 2024
Tahoe Research, LTD.
Christopher J. Jezewski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
Patent number
11,862,567
Issue date
Jan 2, 2024
International Business Machines Corporation
John Bruley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with reduced resistance and method for manufac...
Patent number
11,854,973
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Fei Fan Duan
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED RING STRUCTURES
Publication number
20240145383
Publication date
May 2, 2024
Intel Corporation
June Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
Publication number
20240145384
Publication date
May 2, 2024
Micron Technology, Inc.
Akira Kaneko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240145295
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Jihyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
Publication number
20240145391
Publication date
May 2, 2024
Tahoe Research, Ltd.
Christopher J. JEZEWSKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTIFUSE DEVICE HAVING INTERCONNECT JUMPER
Publication number
20240128189
Publication date
Apr 18, 2024
Micron Technology, Inc.
Christopher G. Wieduwilt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL WIRING OF SEMICONDUCTOR DEVICE
Publication number
20240120275
Publication date
Apr 11, 2024
SK HYNIX INC.
Seong Ho CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER
Publication number
20240113024
Publication date
Apr 4, 2024
International Business Machines Corporation
Ching-Tzu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
Publication number
20240112952
Publication date
Apr 4, 2024
Intel Corporation
HUI JAE YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-THIN SEMI-METALS FOR LOW TEMPERATURE CONDUCTION
Publication number
20240113025
Publication date
Apr 4, 2024
Intel Corporation
Abhishek Anil SHARMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER
Publication number
20240096785
Publication date
Mar 21, 2024
Intel Corporation
June Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID CONDUCTIVE STRUCTURES
Publication number
20240096998
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Shuen-Shin LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE-DECKED INTERCONNECT FEATURES
Publication number
20240071913
Publication date
Feb 29, 2024
Intel Corporation
June Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TANTALUM DOPED RUTHENIUM LAYERS FOR INTERCONNECTS
Publication number
20240071927
Publication date
Feb 29, 2024
Applied Materials, Inc.
Shinjae Hwang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
INTERCONNECT STRUCTURE
Publication number
20240055351
Publication date
Feb 15, 2024
Powerchip Semiconductor Manufacturing Corporation
Shou-Zen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240047345
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing company Ltd.
CHUN-WEI CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
Publication number
20240047556
Publication date
Feb 8, 2024
Intel Corporation
Andrew W. YEOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR...
Publication number
20240038664
Publication date
Feb 1, 2024
Samsung Electronics Co., Ltd.
Joungeun YOO
B22 - CASTING POWDER METALLURGY
Information
Patent Application
INTEGRATION OF FULLY ALIGNED VIA THROUGH SELECTIVE DEPOSITION AND R...
Publication number
20240030062
Publication date
Jan 25, 2024
LAM RESEARCH CORPORATION
Dennis M. Hausmann
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SU...
Publication number
20240030035
Publication date
Jan 25, 2024
ASM IP HOLDING B.V.
Jerry Peijun Chen
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240030131
Publication date
Jan 25, 2024
RENESAS ELECTRONICS CORPORATION
Eisuke KODAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metal Gates of Transistors Having Reduced Resistivity
Publication number
20240021473
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Ching TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
Publication number
20240014133
Publication date
Jan 11, 2024
International Business Machines Corporation
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE, FABRICATION METHOD FOR SEMICONDUCTOR STRUC...
Publication number
20240006319
Publication date
Jan 4, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC
Shuai Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...
Publication number
20230420545
Publication date
Dec 28, 2023
Intel Corporation
Tahir GHANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING STRUCTURE CONNECTING FRONTSIDE AND B...
Publication number
20230402367
Publication date
Dec 14, 2023
Taiwan Semiconductor Manufacturing company Ltd.
CHIA-TIEN WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE
Publication number
20230402321
Publication date
Dec 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hsien CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES WITH CONTACTS EXTENDING THROUGH METAL OXIDE...
Publication number
20230395510
Publication date
Dec 7, 2023
Micron Technology, Inc.
Mithun Kumar Ramasahayam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADVANCED SEAL RING STRUCTURE AND METHOD OF MAKING THE SAME
Publication number
20230395530
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Hsien-Wei CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMPROVED CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE
Publication number
20230386911
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Chun-Yuan Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINFET STRUCTURE WITH CONTROLLED AIR GAPS
Publication number
20230386904
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Wen-Che Tsai
H01 - BASIC ELECTRIC ELEMENTS