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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
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H01L2924/15311
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Patents Grants
last 30 patents
Information
Patent Grant
Chip package including stacked chips and chip couplers
Patent number
11,973,061
Issue date
Apr 30, 2024
Yibu Semiconductor Co., Ltd.
Weiping Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for fabricating a computing system with an int...
Patent number
11,967,528
Issue date
Apr 23, 2024
Apple Inc.
Vidhya Ramachandran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out package having a main die and a dummy die
Patent number
11,967,563
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yan-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
Patent number
11,967,567
Issue date
Apr 23, 2024
Amkor Technology Singapore Holding Pte Ltd.
Doo Soub Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC packaging with hot spot thermal management features
Patent number
11,961,779
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and fabricating method thereof
Patent number
11,961,797
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Keun Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,961,742
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming and/or configuring stacked dies
Patent number
11,961,823
Issue date
Apr 16, 2024
Xilinx, Inc.
Praful Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
Patent number
11,961,764
Issue date
Apr 16, 2024
STATS ChipPAC Pte. Ltd.
Thomas J. Strothmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structures and methods for forming the same
Patent number
11,961,791
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memories and memory components with interconnected and redundant da...
Patent number
11,955,165
Issue date
Apr 9, 2024
RAMBUS INC.
Frederick A. Ware
G11 - INFORMATION STORAGE
Information
Patent Grant
Packaged semiconductor device
Patent number
11,955,479
Issue date
Apr 9, 2024
Texas Instruments Incorporated
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package stacking using chip to wafer bonding
Patent number
11,955,462
Issue date
Apr 9, 2024
Intel Corporation
Georg Seidemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
Patent number
11,955,396
Issue date
Apr 9, 2024
Yibu Semiconductor Co., Ltd.
Weiping Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,948,808
Issue date
Apr 2, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compact opto-electronic modules and fabrication methods for such mo...
Patent number
11,942,580
Issue date
Mar 26, 2024
ams Sensors Singapore Pte. Ltd.
Simon Gubser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,942,435
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with transmissive layer and manufacturing meth...
Patent number
11,942,581
Issue date
Mar 26, 2024
Amkor Technology Singapore Holding Pte Ltd.
David Clark
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including seed structure and method of manufa...
Patent number
11,935,858
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Seungmin Baek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having reduced bump height variation
Patent number
11,935,866
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device having a redistribution layer
Patent number
11,935,856
Issue date
Mar 19, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method for manufacturing the same
Patent number
11,935,878
Issue date
Mar 19, 2024
Vanguard International Semiconductor Corporation
Hsiu-Mei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,929,261
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stack package and methods of manufacturing the same
Patent number
11,929,262
Issue date
Mar 12, 2024
Samsung Electronics Co., Ltd.
Jae-in Won
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming device and package structure
Patent number
11,929,322
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having laterally offset stacked semiconductor...
Patent number
11,929,349
Issue date
Mar 12, 2024
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid microelectronic substrates
Patent number
11,923,257
Issue date
Mar 5, 2024
Intel Corporation
Robert Starkston
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,923,280
Issue date
Mar 5, 2024
Amkor Technology Singapore Holding Pte Ltd.
Won Bae Bang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LTHC as charging barrier in info package formation
Patent number
11,923,353
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240145370
Publication date
May 2, 2024
InnoLux Corporation
Te-Hsun LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIR...
Publication number
20240145424
Publication date
May 2, 2024
Western Digital Technologies, Inc.
John Contreras
G11 - INFORMATION STORAGE
Information
Patent Application
FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...
Publication number
20240145363
Publication date
May 2, 2024
TEXAS INSTRUMENTS INCORPORATED
Vivek SRIDHARAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
Publication number
20240145305
Publication date
May 2, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240136328
Publication date
Apr 25, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Joon Young Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240136246
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240128174
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Choongbin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGING METHOD AND MULTI-CHIP PACKAGING STRUCTURE
Publication number
20240128141
Publication date
Apr 18, 2024
Luxis Precision Intelligent Manufacturing (Kunshan) Co., Ltd.
Yijun YE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
Publication number
20240128171
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Junwoo Myung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS
Publication number
20240128181
Publication date
Apr 18, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
Publication number
20240128254
Publication date
Apr 18, 2024
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE
Publication number
20240120211
Publication date
Apr 11, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
Publication number
20240120332
Publication date
Apr 11, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Semiconductor Device Assembly in Computer System
Publication number
20240104037
Publication date
Mar 28, 2024
Rambus Inc.
Scott C. Best
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
INTERPOSER CIRCUIT
Publication number
20240094289
Publication date
Mar 21, 2024
TEXAS INSTRUMENTS INCORPORATED
Lee D. Whetsel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fan-Out Stacked Package and Methods of Making the Same
Publication number
20240096722
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuo-Chung Yee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
Publication number
20240096387
Publication date
Mar 21, 2024
Rambus Inc.
Ian Shaeffer
G11 - INFORMATION STORAGE
Information
Patent Application
PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN
Publication number
20240088104
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20240087954
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
JING-CHENG LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240079356
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH HOLLOW INTERCONNECTORS
Publication number
20240063176
Publication date
Feb 22, 2024
NANYA TECHNOLOGY CORPORATION
YI-HSIEN CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-VOLATILE FIELD PROGRAMMABLE MULTICHIP PACKAGE
Publication number
20240055336
Publication date
Feb 15, 2024
iCometrue Company Ltd.
Mou-Shiung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240055311
Publication date
Feb 15, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yueh-Ting Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW TH...
Publication number
20240047295
Publication date
Feb 8, 2024
Qorvo US, Inc.
George Maxim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT PACKAGE AND METHOD OF MAKING SAME
Publication number
20240047321
Publication date
Feb 8, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Tien-Chung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...
Publication number
20240047331
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...
Publication number
20240047333
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BALL GRID ARRAY AND CONFIGURATION METHOD OF THE SAME
Publication number
20240047325
Publication date
Feb 8, 2024
Realtek Semiconductor Corp.
CHIN-YUAN LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES
Publication number
20240038679
Publication date
Feb 1, 2024
Advanced Semiconductor Engineering, Inc.
Pao-Nan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240038616
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Chieh Li
H01 - BASIC ELECTRIC ELEMENTS