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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L2924/19041
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Patents Grants
last 30 patents
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Patent Grant
Methods for low temperature bonding using nanoparticles
Patent number
11,973,056
Issue date
Apr 30, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for fabricating a computing system with an int...
Patent number
11,967,528
Issue date
Apr 23, 2024
Apple Inc.
Vidhya Ramachandran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated high voltage capacitor
Patent number
11,967,610
Issue date
Apr 23, 2024
Semtech Corporation
Christopher David Ainsworth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC packaging with hot spot thermal management features
Patent number
11,961,779
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic device assemblies and packages including multiple d...
Patent number
11,961,825
Issue date
Apr 16, 2024
Micron Technology, Inc.
Aparna U. Limaye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Regulator circuit package techniques
Patent number
11,955,437
Issue date
Apr 9, 2024
Analog Devices International Unlimited Company
Leonard Shtargot
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for thin film capacitor integration
Patent number
11,948,871
Issue date
Apr 2, 2024
Texas Instruments Incorporated
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming stacked semiconductors die assemblies
Patent number
11,948,921
Issue date
Apr 2, 2024
Randon K. Richards
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,942,431
Issue date
Mar 26, 2024
Kioxia Corporation
Nobuyuki Momo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package and manufacturing method thereof
Patent number
11,942,454
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with bonding
Patent number
11,923,230
Issue date
Mar 5, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
3D semiconductor device and structure with memory
Patent number
11,901,210
Issue date
Feb 13, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
Patent number
11,901,348
Issue date
Feb 13, 2024
Samsung Electronics Co., Ltd.
Tae-Ho Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Head and printer
Patent number
11,897,261
Issue date
Feb 13, 2024
Brother Kogyo Kabushiki Kaisha
Toru Yamashita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,894,308
Issue date
Feb 6, 2024
Advanced Semiconductor Engineering, Inc.
Sheng-Ming Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacking integrated circuits containing serializer and deserializer...
Patent number
11,894,342
Issue date
Feb 6, 2024
BroadPak Corporation
Farhang Yazdani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trench capacitor assembly for high capacitance density
Patent number
11,894,366
Issue date
Feb 6, 2024
QUALCOMM Incorporated
Jonghae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices, semiconductor device packages and method for...
Patent number
11,887,943
Issue date
Jan 30, 2024
Advanced Semiconductor Engineering, Inc.
Wen Hung Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,881,467
Issue date
Jan 23, 2024
Samsung Electronics Co., Ltd.
Jungho Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with single-crystal layers
Patent number
11,876,011
Issue date
Jan 16, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Thermal transfer structures for semiconductor die assemblies
Patent number
11,862,611
Issue date
Jan 2, 2024
Micron Technology, Inc.
Ed A. Schrock
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing a 3D semiconductor device and structure with m...
Patent number
11,862,503
Issue date
Jan 2, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with discrete blocks
Patent number
11,855,045
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
Patent number
11,855,065
Issue date
Dec 26, 2023
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having EMI shielding structure and related met...
Patent number
11,855,000
Issue date
Dec 26, 2023
Amkor Technology Singapore Holding Pte Ltd.
Young Woo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a semiconductor device having TSV formed through...
Patent number
11,854,990
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semicondutor package substrate with die cavity and redistribution l...
Patent number
11,854,922
Issue date
Dec 26, 2023
Texas Instruments Incorporated
Vivek Swaminathan Sridharan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor device and structure with...
Patent number
11,854,857
Issue date
Dec 26, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module apparatus, cooling structure, and electric vehicle or...
Patent number
11,854,937
Issue date
Dec 26, 2023
Rohm Co., Ltd.
Katsuhiko Yoshihara
B60 - VEHICLES IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
Integration of Discrete Embeddable Capacitors on Integrated Circuit...
Publication number
20240145447
Publication date
May 2, 2024
pSemi Corporation
Shishir Ray
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package-On-Package Assembly Containing A Decoupling Capacitor
Publication number
20240145452
Publication date
May 2, 2024
KYOCERA AVX Components Corporation
Laurent Desclos
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240145413
Publication date
May 2, 2024
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Makoto NISHIHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC MODULE AND ELECTRONIC APPARATUS
Publication number
20240128193
Publication date
Apr 18, 2024
Advanced Semiconductor Engineering, Inc.
Pao-Nan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SYSTEM INTEGRATION
Publication number
20240128238
Publication date
Apr 18, 2024
BroadPak Corporation
Farhang YAZDANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
Publication number
20240128254
Publication date
Apr 18, 2024
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR AND METHOD FOR FORMING THE SAME
Publication number
20240128196
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Shiang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING SAME
Publication number
20240128246
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
Kwang-Soo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
Publication number
20240120308
Publication date
Apr 11, 2024
TEXAS INSTRUMENTS INCORPORATED
Kwang-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240120304
Publication date
Apr 11, 2024
Innolux Corporation
Tzu-Sheng Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
Publication number
20240113159
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Hui SU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240105694
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Jung Hoo YUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED PASSIVE DEVICE WITH VIA FORMED IN ISOLATION TRENCH
Publication number
20240105586
Publication date
Mar 28, 2024
Saras Mirco Devices, Inc.
Courtney Timms
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240105662
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Jungho SHIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS
Publication number
20240105568
Publication date
Mar 28, 2024
QUALCOMM Incorporated
Joan Rey Villarba BUOT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIP...
Publication number
20240096802
Publication date
Mar 21, 2024
NVIDIA Corporation
Shawn Xiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Dual Die Integrated Circuit System in an Integrated Circuit Package...
Publication number
20240088112
Publication date
Mar 14, 2024
TDK - Micronas GmbH
Paolo Marozzi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING
Publication number
20240079250
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
JAEWON CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...
Publication number
20240079352
Publication date
Mar 7, 2024
QUALCOMM Incorporated
Jihong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND M...
Publication number
20240072024
Publication date
Feb 29, 2024
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...
Publication number
20240072025
Publication date
Feb 29, 2024
TEXAS INSTRUMENTS INCORPORATED
Rajen M. Murugan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...
Publication number
20240072022
Publication date
Feb 29, 2024
Micron Technology, Inc.
Seng Kim Ye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOHERTY AMPLIFIERS
Publication number
20240063756
Publication date
Feb 22, 2024
NXP USA, Inc.
Qi Hua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING A FIRST SUBSTRATE, A SECOND SUBSTRATE AND AN ELE...
Publication number
20240063195
Publication date
Feb 22, 2024
QUALCOMM Incorporated
Aniket PATIL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20240063078
Publication date
Feb 22, 2024
MEDIATEK INC.
Che-Hung KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-VOLATILE FIELD PROGRAMMABLE MULTICHIP PACKAGE
Publication number
20240055336
Publication date
Feb 15, 2024
iCometrue Company Ltd.
Mou-Shiung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, RECTIFYING ELEMENT USING SAME, AND ALTERNATOR
Publication number
20240055423
Publication date
Feb 15, 2024
HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
Masaki SHIRAISHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...
Publication number
20240038753
Publication date
Feb 1, 2024
QUALCOMM Incorporated
Aniket PATIL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SMALLER MODULE BY STACKING
Publication number
20240038743
Publication date
Feb 1, 2024
Dingyou Zhang
H01 - BASIC ELECTRIC ELEMENTS