being a capacitor

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CPC
H01L2924/19041

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/19041being a capacitor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and antenna module comprising the same
- Patent number 12,148,708
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Yong Koon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,136,591
- Issue date Nov 5, 2024
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with near-die integrated passive device
- Patent number 12,136,613
- Issue date Nov 5, 2024
- Xilinx, Inc.
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pre-reflowed solder
- Patent number 12,132,027
- Issue date Oct 29, 2024
- Texas Instruments Incorporated
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating passive devices in package structures
- Patent number 12,132,029
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,132,078
- Issue date Oct 29, 2024
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 12,112,891
- Issue date Oct 8, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 12,113,031
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 12,100,701
- Issue date Sep 24, 2024
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Reduction of cracks in passivation layer
- Patent number 12,087,714
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 12,087,738
- Issue date Sep 10, 2024
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional metal insulator metal capacitor structure
- Patent number 12,087,811
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sai-Hooi Yeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
- Patent number 12,080,615
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device structure with a redistribution layer and a buffer layer
- Patent number 12,080,753
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure, semiconductor package and fabrication method th...
- Patent number 12,074,122
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,074,112
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electrical device
- Patent number 12,074,628
- Issue date Aug 27, 2024
- Skyworks Solutions, Inc.
- Andrew Martin Kay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB...
- Patent number 12,068,172
- Issue date Aug 20, 2024
- Intel Corporation
- Tarek A. Ibrahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Bump integration with redistribution layer
- Patent number 12,057,423
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387486
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Dahee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Organic Integrated Circuit Substrate Embedded in Inorg...
- Publication number 20240387456
- Publication date Nov 21, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CRACKS IN PASSIVATION LAYER
- Publication number 20240379593
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240379595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...
- Publication number 20240379571
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379646
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240371787
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING SOURCE STRUCTURES OVER STACK STRUCTURES, A...
- Publication number 20240371834
- Publication date Nov 7, 2024
- Lodestar Licensing Group LLC
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240371920
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INCLUDING PASSIVE COMPONENT TRAVERSING MULTIPLE SEMICONDU...
- Publication number 20240371809
- Publication date Nov 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Haritez Narisetty
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...
- Publication number 20240363559
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL METAL INSULATOR METAL CAPACITOR STRUCTURE
- Publication number 20240363681
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sai-Hooi YEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL INSULATOR METAL STRUCTURE
- Publication number 20240363505
- Publication date Oct 31, 2024
- TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240363603
- Publication date Oct 31, 2024
- MEDIATEK SINGAPORE PTE LTD
- Chang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20240363569
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT DEVICE INCLUDING INTEGRATED CAPACITOR DE...
- Publication number 20240363605
- Publication date Oct 31, 2024
- QUALCOMM Incorporated
- Darko POPOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...
- Publication number 20240363463
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332159
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CHIP AND SIGNAL PROPAGATING DEVICE
- Publication number 20240332345
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20240321591
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321812
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Takeshi MURASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240312922
- Publication date Sep 19, 2024
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...
- Publication number 20240312936
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Joon Shyan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240290750
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR
- Publication number 20240290547
- Publication date Aug 29, 2024
- TDK Corporation
- Masahiro Hiraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REGULATOR CIRCUIT PACKAGE TECHNIQUES
- Publication number 20240282714
- Publication date Aug 22, 2024
- Analog Devices International Unlimited Company
- Leonard Shtargot
- H01 - BASIC ELECTRIC ELEMENTS

being a capacitor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gallium nitride (GAN) three-dimensional integrated circuit technology

Semiconductor package and antenna module comprising the same

Integrated fan-out package and the methods of manufacturing

Through electrode substrate and semiconductor device

3D semiconductor device and structure with single-crystal layers

Chip package with near-die integrated passive device

Semiconductor device assembly with pre-reflowed solder

Integrating passive devices in package structures

Thin film capacitor and electronic circuit substrate having the same

3D semiconductor device and structure with metal layers and memory...

Multilayer capacitor and circuit board containing the same

Semiconductor device and method of making the same

Hybrid system including photonic and electronic integrated circuits...

Methods for producing a 3D semiconductor device and structure with...

Reduction of cracks in passivation layer

Semiconductor device assembly with surface-mount die support struct...

Packaged integrated circuit devices with through-body conductive vi...

Three dimensional metal insulator metal capacitor structure

Package with different types of semiconductor dies attached to a fl...

Method of manufacturing an integrated fan-out package having fan-ou...

Device structure with a redistribution layer and a buffer layer

Inductor structure, semiconductor package and fabrication method th...

Package structure

Semiconductor die contact structure and method

Packaged electrical device

Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB...

3D integrations and methods of making thereof

Multi-die fine grain integrated voltage regulation

3D semiconductor device and structure with bonding and DRAM memory...

Bump integration with redistribution layer

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

Package with Organic Integrated Circuit Substrate Embedded in Inorg...

Method for Forming a Semiconductor Device Having TSV Formed Through...

REDUCTION OF CRACKS IN PASSIVATION LAYER

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

MEMORY DEVICES INCLUDING SOURCE STRUCTURES OVER STACK STRUCTURES, A...

DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

STRUCTURE INCLUDING PASSIVE COMPONENT TRAVERSING MULTIPLE SEMICONDU...

INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...

THREE DIMENSIONAL METAL INSULATOR METAL CAPACITOR STRUCTURE

EMBEDDED METAL INSULATOR METAL STRUCTURE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

SEMICONDUCTOR PACKAGE STRUCTURE

BUMP INTEGRATION WITH REDISTRIBUTION LAYER

STACKED INTEGRATED CIRCUIT DEVICE INCLUDING INTEGRATED CAPACITOR DE...

METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INSULATING CHIP AND SIGNAL PROPAGATING DEVICE

METHOD FOR FABRICATING ELECTRONIC PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SEMICONDUCTOR PACKAGES

THIN FILM CAPACITOR

REGULATOR CIRCUIT PACKAGE TECHNIQUES