being a conformal layer on a patterned surface

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CPC
H01L2224/05018

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05018being a conformal layer on a patterned surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,191,266
- Issue date Jan 7, 2025
- Kabushiki Kaisha Toshiba
- Emiko Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip structure
- Patent number 12,176,245
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,159,882
- Issue date Dec 3, 2024
- KYOCERA Coporation
- Hiroaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,142,588
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,142,587
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Jinho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 12,087,748
- Issue date Sep 10, 2024
- Samsung Display Co., Ltd.
- Jong Hwan Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 12,014,972
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 11,961,880
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,917,875
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Ki Kyung Youk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,862,586
- Issue date Jan 2, 2024
- Kioxia Corporation
- Mizuki Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,830,832
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,804,459
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Jinho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to stack structures including passivati...
- Patent number 11,804,460
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,616,036
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,581,279
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective layer for contact pads in fan-out interconnect structure...
- Patent number 11,515,288
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact structure having stress buffer layer formed b...
- Patent number 11,476,212
- Issue date Oct 18, 2022
- United Microelectronics Corporation
- Yu-Jie Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having a plurality of pad terminals including connec...
- Patent number 11,393,851
- Issue date Jul 19, 2022
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pads and method of manufactu...
- Patent number 11,380,638
- Issue date Jul 5, 2022
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,302,663
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,296,045
- Issue date Apr 5, 2022
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structures in electronic devices including passivation layers...
- Patent number 11,257,774
- Issue date Feb 22, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device having a step film formed betw...
- Patent number 11,245,013
- Issue date Feb 8, 2022
- Fuji Electric Co., Ltd.
- Yuichi Hashizume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,164,836
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 11,094,612
- Issue date Aug 17, 2021
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,011,491
- Issue date May 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat Tu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006718
- Publication date Jan 2, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jong Hwan CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304576
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Yuya KIYOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE
- Publication number 20240274653
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240250048
- Publication date Jul 25, 2024
- TDK Corporation
- Kosuke TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...
- Publication number 20240120298
- Publication date Apr 11, 2024
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120304
- Publication date Apr 11, 2024
- Innolux Corporation
- Tzu-Sheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK REDISTRIBUTION LAYER FEATURES
- Publication number 20240088074
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240079392
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUC...
- Publication number 20240057350
- Publication date Feb 15, 2024
- Changxin Memory Technologies, Inc.
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240055401
- Publication date Feb 15, 2024
- United Microelectronics Corp.
- Kun-Ju LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20240047389
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Hyeonmin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS
- Publication number 20240038695
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...
- Publication number 20240038694
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240030169
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Woon Chun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR
- Publication number 20240014152
- Publication date Jan 11, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure with Stress Buffer Zone and Method of Forming Same
- Publication number 20240006352
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- SyuFong LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE
- Publication number 20230411327
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230411323
- Publication date Dec 21, 2023
- RENESAS ELECTRONICS CORPORATION
- Etsuko WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230389339
- Publication date Nov 30, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
- Publication number 20230378106
- Publication date Nov 23, 2023
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230361062
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20230352418
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
- Publication number 20230343668
- Publication date Oct 26, 2023
- UTAC Headquarters Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...
- Publication number 20230343733
- Publication date Oct 26, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20230309351
- Publication date Sep 28, 2023
- SAMSUNG DISPLAY CO., LTD.
- Soyoung Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20230299023
- Publication date Sep 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS

being a conformal layer on a patterned surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and manufacturing method of semiconductor device

Semiconductor chip structure

Semiconductor device

Display device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of fabricating the same

Patterned and planarized under-bump metallization

Display device and manufacturing method thereof

Semiconductor devices including through-silicon-vias and methods of...

Semiconductor device with composite conductive features and method...

Metal-insulator-metal structure

Silicon photonic interposer with two metal redistribution layers

Display device

Semiconductor device and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Semiconductor device and method of fabricating the same

Devices and methods related to stack structures including passivati...

Semiconductor device and method of manufacturing the same

Semiconductor device

Protective layer for contact pads in fan-out interconnect structure...

Semiconductor contact structure having stress buffer layer formed b...

Display device having a plurality of pad terminals including connec...

Semiconductor device including bonding pads and method of manufactu...

Film scheme for bumping

Semiconductor device and method of manufacturing the same

Stack structures in electronic devices including passivation layers...

Silicon carbide semiconductor device having a step film formed betw...

Film scheme for bumping

Semiconductor devices including through-silicon-vias and methods of...

Semiconductor device packages and methods of manufacturing the same

Patents Applicationslast 30 patents

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

METAL-INSULATOR-METAL STRUCTURE

ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

THICK REDISTRIBUTION LAYER FEATURES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUC...

SEMICONDUCTOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS

THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR

Bonding Structure with Stress Buffer Zone and Method of Forming Same

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

Semiconductor Packages and Methods of Forming RDL and Side and Back...

WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...

DISPLAY APPARATUS

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...