being a land array

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/15333being a land array

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated half-bridge power converter
- Patent number 11,715,720
- Issue date Aug 1, 2023
- NAVITAS SEMICONDUCTOR LIMITED
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on antenna package
- Patent number 11,233,018
- Issue date Jan 25, 2022
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit device with cantilever structure
- Patent number 10,490,516
- Issue date Nov 26, 2019
- Intel Corporation
- John G. Meyers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-surface edge pads for vertical mount packages and methods of...
- Patent number 10,354,945
- Issue date Jul 16, 2019
- Invensas Corporation
- Rajesh Katkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with recess and method of making
- Patent number 10,297,468
- Issue date May 21, 2019
- Rohm Co., Ltd.
- Yuichi Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,991,221
- Issue date Jun 5, 2018
- Renesas Electronics Corporation
- Jun Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit device with cantilever structure
- Patent number 9,871,007
- Issue date Jan 16, 2018
- Intel Corporation
- John G. Meyers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 9,852,970
- Issue date Dec 26, 2017
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,818,715
- Issue date Nov 14, 2017
- Renesas Electronics Corporation
- Jun Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch process fabrication of package-on-package microelectronic ass...
- Patent number 9,812,433
- Issue date Nov 7, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 9,693,462
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Takeshi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,659,880
- Issue date May 23, 2017
- Shinko Electric Industries Co., Ltd.
- Manabu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number 9,397,080
- Issue date Jul 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 9,293,419
- Issue date Mar 22, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Maki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid wave pattern design on chip carrier substrate and printed cir...
- Patent number 9,230,919
- Issue date Jan 5, 2016
- SanDisk Technologies Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number 8,981,559
- Issue date Mar 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallurgical clamshell methods for micro land grid array fabrication
- Patent number 8,959,764
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Co-support system and microelectronic assembly
- Patent number 8,787,034
- Issue date Jul 22, 2014
- Invensas Corporation
- Richard Dewitt Crisp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metallurgical clamshell methods for micro land grid array fabrication
- Patent number 8,651,877
- Issue date Feb 18, 2014
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid wave pattern design on chip carrier substrate and printed cir...
- Patent number 8,487,441
- Issue date Jul 16, 2013
- SanDisk Technologies Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid wave pattern design on chip carrier substrate and printed cir...
- Patent number 7,355,283
- Issue date Apr 8, 2008
- SanDisk Corporation
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP SYSTEM AND COMMUNICATION DEVICE
- Publication number 20240321771
- Publication date Sep 26, 2024
- Huawei Technologies Co., Ltd
- Bai DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HALF-BRIDGE POWER CONVERTER
- Publication number 20230387067
- Publication date Nov 30, 2023
- Navitas Semiconductor Limited
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Half-Bridge Power Converter
- Publication number 20220084978
- Publication date Mar 17, 2022
- Navitas Semiconductor Limited
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON ANTENNA PACKAGE
- Publication number 20200185342
- Publication date Jun 11, 2020
- Intel IP Corporation
- Sidharth DALMIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICE WITH CANTILEVER STRUCTURE
- Publication number 20180138133
- Publication date May 17, 2018
- Intel Corporation
- John G. Meyers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20180047696
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Jun YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, CHIP PACKAGE WITH SAME AND METHOD FOR MANUFACTURING SAME
- Publication number 20170084509
- Publication date Mar 23, 2017
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- YU-CHENG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20150303146
- Publication date Oct 22, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Maki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS MOUNTED OVER BOT...
- Publication number 20150279820
- Publication date Oct 1, 2015
- Micron Technology, Inc.
- Sensho Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20150133001
- Publication date May 14, 2015
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20150116968
- Publication date Apr 30, 2015
- Renesas Electronics Corporation
- Jun YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...
- Publication number 20150054177
- Publication date Feb 26, 2015
- SANDISK TECHNOLOGIES INC.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE HAVING COMPONENT-DISPOSING AREA AND MANUFACTURI...
- Publication number 20140138130
- Publication date May 22, 2014
- Unimicron Technology Corp.
- Cheng-Jui Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-SUPPORT SYSTEM AND MICROELECTRONIC ASSEMBLY
- Publication number 20140055941
- Publication date Feb 27, 2014
- Invensas Corporation
- Richard Dewitt Crisp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package on Package Devices and Methods of Packaging Semiconductor Dies
- Publication number 20130341786
- Publication date Dec 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...
- Publication number 20130299959
- Publication date Nov 14, 2013
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE TRANSITION HAVING VERTICAL STRUCTURE AND SINGLE C...
- Publication number 20130194754
- Publication date Aug 1, 2013
- Samsung Electronics Co Ltd.
- Dong-Yun Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20130072073
- Publication date Mar 21, 2013
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20110111647
- Publication date May 12, 2011
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...
- Publication number 20080054445
- Publication date Mar 6, 2008
- SANDISK CORPORATION
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rigid wave pattern design on chip carrier substrate and printed cir...
- Publication number 20060231943
- Publication date Oct 19, 2006
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS

being a land array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated half-bridge power converter

Package on antenna package

Packaged integrated circuit device with cantilever structure

Multi-surface edge pads for vertical mount packages and methods of...

Semiconductor device with recess and method of making

Semiconductor integrated circuit device

Packaged integrated circuit device with cantilever structure

Wiring substrate

Semiconductor integrated circuit device

Batch process fabrication of package-on-package microelectronic ass...

Printed circuit board

Semiconductor device

Package on package devices and methods of packaging semiconductor dies

Semiconductor package and semiconductor device

Rigid wave pattern design on chip carrier substrate and printed cir...

Package on package devices and methods of packaging semiconductor dies

Metallurgical clamshell methods for micro land grid array fabrication

Co-support system and microelectronic assembly

Metallurgical clamshell methods for micro land grid array fabrication

Rigid wave pattern design on chip carrier substrate and printed cir...

Rigid wave pattern design on chip carrier substrate and printed cir...

Patents Applicationslast 30 patents

CHIP SYSTEM AND COMMUNICATION DEVICE

INTEGRATED HALF-BRIDGE POWER CONVERTER

Integrated Half-Bridge Power Converter

PACKAGE ON ANTENNA PACKAGE

PACKAGED INTEGRATED CIRCUIT DEVICE WITH CANTILEVER STRUCTURE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SUBSTRATE, CHIP PACKAGE WITH SAME AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS MOUNTED OVER BOT...

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...

SUBSTRATE STRUCTURE HAVING COMPONENT-DISPOSING AREA AND MANUFACTURI...

CO-SUPPORT SYSTEM AND MICROELECTRONIC ASSEMBLY

Package on Package Devices and Methods of Packaging Semiconductor Dies

RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...

TRANSMISSION LINE TRANSITION HAVING VERTICAL STRUCTURE AND SINGLE C...

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...

Rigid wave pattern design on chip carrier substrate and printed cir...