being a solid state

Industry

CPC
H01L2924/404

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/404being a solid state

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,950,517
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,586,748
- Issue date Mar 10, 2020
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a semiconductor die having redistri...
- Patent number 10,103,076
- Issue date Oct 16, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with embedded die and its methods of fabrication
- Patent number 9,780,054
- Issue date Oct 3, 2017
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220302095
- Publication date Sep 22, 2022
- Japan Display Inc.
- Kenichi TAKEMASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407954
- Publication date Dec 30, 2021
- Rohm Co., Ltd.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20200176344
- Publication date Jun 4, 2020
- Samsung Electronics Co. Ltd.
- Soo-Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MEMBER TO BE TREATED AND LAMINATE
- Publication number 20200009845
- Publication date Jan 9, 2020
- FUJIFILM CORPORATION
- Shotaro OGAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20180366380
- Publication date Dec 20, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20170309559
- Publication date Oct 26, 2017
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20170148692
- Publication date May 25, 2017
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160329304
- Publication date Nov 10, 2016
- Koichi Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING STACKED SEMICONDUCTOR PACKAGE
- Publication number 20150311187
- Publication date Oct 29, 2015
- Samsung Electronics Co., Ltd.
- Young-ho JOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION
- Publication number 20150050781
- Publication date Feb 19, 2015
- lintel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with embedded die and its methods of fabrication
- Publication number 20110215464
- Publication date Sep 8, 2011
- Intel Corporation
- John Stephen Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

being a solid state

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Printed circuit board and semiconductor package

Printed circuit board and semiconductor package

Semiconductor package including a semiconductor die having redistri...

Semiconductor package with embedded die and its methods of fabrication

Patents Applicationslast 30 patents

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING MEMBER TO BE TREATED AND LAMINATE

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING STACKED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION

Semiconductor package with embedded die and its methods of fabrication