being a temporary or sacrificial substrate

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H01L2224/80006

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80006being a temporary or sacrificial substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of package
- Patent number 12,166,014
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices including backside power rails and m...
- Patent number 12,166,016
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element
- Patent number 12,154,929
- Issue date Nov 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Daisuke Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-dielectric vias for direct connection and method forming same
- Patent number 12,125,820
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deep partition power delivery with deep trench capacitor
- Patent number 12,068,295
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice transfer setup and integration of micro-devices into sy...
- Patent number 12,062,638
- Issue date Aug 13, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device packages with integrated device die and dummy ele...
- Patent number 12,046,569
- Issue date Jul 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,948,929
- Issue date Apr 2, 2024
- Kioxia Corporation
- Hiroshi Nakaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 11,862,599
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,854,992
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,855,067
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices including backside power rails and m...
- Patent number 11,830,854
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directly bonded structures without intervening adhesive and methods...
- Patent number 11,817,409
- Issue date Nov 14, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for thermal dissipation
- Patent number 11,804,475
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep partition power delivery with deep trench capacitor
- Patent number 11,784,172
- Issue date Oct 10, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING HSINCHU, CO., LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 11,784,163
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin bridge and multi-die ultrafine pitch patch architecture a...
- Patent number 11,756,889
- Issue date Sep 12, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,742,565
- Issue date Aug 29, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
- Patent number 11,742,315
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 11,735,623
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuit packages
- Patent number 11,728,314
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level stacking of wafers and chips
- Patent number 11,721,663
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for multi-wafer stacking and dicing
- Patent number 11,710,717
- Issue date Jul 25, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jialan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack and method for manufacturing the same
- Patent number 11,694,980
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices with backside source power...
- Patent number 11,676,954
- Issue date Jun 13, 2023
- SanDisk Technologies LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,658,150
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device packages with integrated device die and dummy ele...
- Patent number 11,631,647
- Issue date Apr 18, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel semiconductor device and structure with image sensors an...
- Patent number 11,605,663
- Issue date Mar 14, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH LATERALLY SEPARATED SOURCE SEL...
- Publication number 20240422973
- Publication date Dec 19, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Shinsuke YADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BODY AND PREPARATION METHOD THEREFOR
- Publication number 20240404938
- Publication date Dec 5, 2024
- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
- Shijie ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES INCLUDING SELF-ALIGNED CHANNEL CAP...
- Publication number 20240407164
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Naoto NORIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAMINATED ASSEMBLY
- Publication number 20240387229
- Publication date Nov 21, 2024
- Disco Corporation
- Fumihiro INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20240387465
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITALIZED INTERCONNECT REDISTRIBUTION ENABLED CHIPLET PACKAGING
- Publication number 20240387336
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Guan-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL STACKING OF WAFERS AND CHIPS
- Publication number 20240379614
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COAXIAL DOUBLE CONTACT VI...
- Publication number 20240381644
- Publication date Nov 14, 2024
- SANDISK TECHNOLOGIES LLC
- Ryo MIZUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20240363585
- Publication date Oct 31, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A BIT-LINE-BIAS VERTICAL...
- Publication number 20240363170
- Publication date Oct 31, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Naoto NORIZUKI
- G11 - INFORMATION STORAGE
Information Patent Application
DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR
- Publication number 20240355799
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STACKS INCLUDING REPLACEMENT BLOCKS AND RELATED METHODS
- Publication number 20240357839
- Publication date Oct 24, 2024
- Nitin Ashok Deshpande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...
- Publication number 20240357812
- Publication date Oct 24, 2024
- SK HYNIX INC.
- Byung Woo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES HAVING CHANNEL CAP STRUCTURES AND...
- Publication number 20240349500
- Publication date Oct 17, 2024
- SANDISK TECHNOLOGIES LLC
- Bing ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20240334694
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Eun Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SOURCE STRUCTURE SURROU...
- Publication number 20240334698
- Publication date Oct 3, 2024
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20240334716
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Moorym Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BACKSIDE TRANSISTORS
- Publication number 20240334705
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Chang Woo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321851
- Publication date Sep 26, 2024
- SAMSUNG ELECTERONICS CO., LTD.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240321819
- Publication date Sep 26, 2024
- KIOXIA Corporation
- Miki TOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240315058
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Go OIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240306402
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Takuya FUTATSUYAMA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COAXIAL DOUBLE CONTACT VI...
- Publication number 20240306392
- Publication date Sep 12, 2024
- SANDISK TECHNOLOGIES LLC
- Ryo MIZUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240297045
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Yoshio MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARAT...
- Publication number 20240297078
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Mariko SUMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDU...
- Publication number 20240292619
- Publication date Aug 29, 2024
- Kioxia Corporation
- Yasuaki NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HETEROJUNCTION SOURCE LA...
- Publication number 20240268115
- Publication date Aug 8, 2024
- SANDISK TECHNOLOGIES LLC
- Wei CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS
- Publication number 20240266340
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chao CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240258277
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- YI EOK KWON
- H01 - BASIC ELECTRIC ELEMENTS

being a temporary or sacrificial substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of package

Packaged semiconductor devices including backside power rails and m...

Semiconductor element

Through-dielectric vias for direct connection and method forming same

Methods and devices for fabricating and assembling printable semico...

Deep partition power delivery with deep trench capacitor

Microdevice transfer setup and integration of micro-devices into sy...

Integrated device packages with integrated device die and dummy ele...

Via for semiconductor device connection and methods of forming the...

Semiconductor device and method of manufacturing the same

Bonding to alignment marks with dummy alignment marks

Semiconductor structure and manufacturing method thereof

Integrated circuit package and method

Packaged semiconductor devices including backside power rails and m...

Directly bonded structures without intervening adhesive and methods...

Semiconductor package for thermal dissipation

Deep partition power delivery with deep trench capacitor

Stacking structure, package structure and method of fabricating the...

Ultrathin bridge and multi-die ultrafine pitch patch architecture a...

Semiconductor devices and methods of manufacturing semiconductor de...

Die processing

Micro device integration into system substrate

Methods of forming integrated circuit packages

Multi-level stacking of wafers and chips

Methods for multi-wafer stacking and dicing

Semiconductor stack and method for manufacturing the same

Bonded three-dimensional memory devices with backside source power...

System on integrated chips and methods of forming same

Integrated device packages with integrated device die and dummy ele...

Multilevel semiconductor device and structure with image sensors an...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE WITH LATERALLY SEPARATED SOURCE SEL...

PACKAGE BODY AND PREPARATION METHOD THEREFOR

THREE-DIMENSIONAL MEMORY DEVICES INCLUDING SELF-ALIGNED CHANNEL CAP...

System and Method for Bonding Semiconductor Devices

METHOD OF MANUFACTURING LAMINATED ASSEMBLY

INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME

DIGITALIZED INTERCONNECT REDISTRIBUTION ENABLED CHIPLET PACKAGING

MULTI-LEVEL STACKING OF WAFERS AND CHIPS

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COAXIAL DOUBLE CONTACT VI...

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A BIT-LINE-BIAS VERTICAL...

DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR

MEMORY STACKS INCLUDING REPLACEMENT BLOCKS AND RELATED METHODS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...

THREE-DIMENSIONAL MEMORY DEVICES HAVING CHANNEL CAP STRUCTURES AND...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SOURCE STRUCTURE SURROU...

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR DEVICE INCLUDING BACKSIDE TRANSISTORS

SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR MEMORY DEVICES AND METHOD OF MANUFACTURING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COAXIAL DOUBLE CONTACT VI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARAT...

SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDU...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HETEROJUNCTION SOURCE LA...

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME