being circular or elliptic

Industry

CPC
H01L2224/05015

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05015being circular or elliptic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Efficient redistribution layer topology
- Patent number 12,142,586
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding method and semiconductor chip structure
- Patent number 12,119,315
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming same
- Patent number 11,973,045
- Issue date Apr 30, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 11,855,022
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, redistribution layer (RDL) structure, and...
- Patent number 11,798,904
- Issue date Oct 24, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad modification
- Patent number 11,756,911
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,742,271
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Gyuho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for semiconductor packaging
- Patent number 11,705,414
- Issue date Jul 18, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
- Patent number 11,640,948
- Issue date May 2, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,581,279
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip flexible under bump metallization size
- Patent number 11,557,557
- Issue date Jan 17, 2023
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,527,502
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient redistribution layer topology
- Patent number 11,380,637
- Issue date Jul 5, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 11,380,639
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal layer patterning for minimizing mechanical stress in integrat...
- Patent number 11,322,465
- Issue date May 3, 2022
- Cirrus Logic, Inc.
- Kathryn R. Holland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 11,296,012
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 11,139,258
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure in microelectronic component
- Patent number 11,088,099
- Issue date Aug 10, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,004,814
- Issue date May 11, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus
- Patent number 10,985,081
- Issue date Apr 20, 2021
- Sony Corporation
- Yukihiro Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices having a patterned surfa...
- Patent number 10,950,564
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 10,930,605
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die structure, die stack structure and method of fabricating the same
- Patent number 10,867,943
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 10,861,810
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363572
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Akinori NII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240274556
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Won CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND APPARATUS
- Publication number 20240203972
- Publication date Jun 20, 2024
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120299
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- JIHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20240063151
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20240063153
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240055406
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Yeongseon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20240047389
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Hyeonmin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
- Publication number 20230378106
- Publication date Nov 23, 2023
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20230352351
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-LUM MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME
- Publication number 20230352428
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230317648
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230317654
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Jihoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20230299027
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shifting Contact Pad for Reducing Stress
- Publication number 20230275047
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187393
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230141447
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Wonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230132054
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Wooram MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD AND SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20230011840
- Publication date Jan 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230005867
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220399292
- Publication date Dec 15, 2022
- Rohm Co., Ltd.
- Shoji TAKEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PADS FOR REDUCED DISHING IN LOW TEMPERATURE ANNEALING AND BONDING
- Publication number 20220352441
- Publication date Nov 3, 2022
- Meta Platforms Technologies, LLC
- Stephan LUTGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
- Publication number 20220328438
- Publication date Oct 13, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING STRUCTURES
- Publication number 20220328440
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PHOTONIC INTERPOSER WITH TWO METAL REDISTRIBUTION LAYERS
- Publication number 20220310540
- Publication date Sep 29, 2022
- ROCKLEY PHOTONICS LIMITED
- Michael LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220077043
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- GYUHO KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE
- Publication number 20210407939
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
- Publication number 20210384150
- Publication date Dec 9, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS

being circular or elliptic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Efficient redistribution layer topology

Chip bonding method and semiconductor chip structure

Patterned and planarized under-bump metallization

Semiconductor structure and method for forming same

Silicon photonic interposer with two metal redistribution layers

Contact pad for semiconductor device

Multi-metal contact structure

Shielding structures

Semiconductor structure, redistribution layer (RDL) structure, and...

Metal pad modification

Semiconductor package

Structure and method for semiconductor packaging

Microelectronic devices and apparatuses having a patterned surface...

Semiconductor device

Flip-chip flexible under bump metallization size

Contact pad for semiconductor device

Efficient redistribution layer topology

Shielding structures

Metal layer patterning for minimizing mechanical stress in integrat...

Barrier structures between external electrical connectors

Interconnect crack arrestor structure and methods

Bonding pads with thermal pathways

Multi-metal contact structure in microelectronic component

Semiconductor device

Semiconductor device and electronic apparatus

Methods of forming microelectronic devices having a patterned surfa...

Contact pad for semiconductor device

Die structure, die stack structure and method of fabricating the same

Shielding structures

Contact structures with porous networks for solder connections, and...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

ELECTRONIC COMPONENT AND APPARATUS

MULTI-METAL CONTACT STRUCTURE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME

Semiconductor Devices and Methods of Manufacture

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

Shifting Contact Pad for Reducing Stress

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

CHIP BONDING METHOD AND SEMICONDUCTOR CHIP STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

CU PADS FOR REDUCED DISHING IN LOW TEMPERATURE ANNEALING AND BONDING

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY

SHIELDING STRUCTURES

SILICON PHOTONIC INTERPOSER WITH TWO METAL REDISTRIBUTION LAYERS

SEMICONDUCTOR PACKAGE

FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY