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H01L2224/13078

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13078being disposed next to each other

Industries

Patents Grantslast 30 patents

Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filter package structure and method for preparing same
- Patent number 11,996,379
- Issue date May 28, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving substrate and manufacturing method thereof, and micro LED b...
- Patent number 11,894,353
- Issue date Feb 6, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric and metallic nanowire bond layers
- Patent number 11,791,296
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures with conductive elements, and...
- Patent number 11,728,307
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,302,663
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including embedded conductive elements
- Patent number 11,282,817
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 11,270,964
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric and metallic nanowire bond layers
- Patent number 11,195,811
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,164,836
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
- Patent number 11,011,490
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,818,623
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 10,658,318
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bump, method for forming composite bump, and substrate
- Patent number 10,629,556
- Issue date Apr 21, 2020
- Fujitsu Limited
- Takashi Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms of forming connectors for package on package
- Patent number 10,553,561
- Issue date Feb 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for solder connections
- Patent number 10,453,815
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combing bump structure and manufacturing method thereof
- Patent number 10,446,514
- Issue date Oct 15, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-conductive array disposed on target circuit substrate and condu...
- Patent number 10,431,561
- Issue date Oct 1, 2019
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 10,340,226
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding electrode structure of flip-chip led chip and fabrication m...
- Patent number 10,276,750
- Issue date Apr 30, 2019
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhibai Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,249,586
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 10,199,358
- Issue date Feb 5, 2019
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combing bump structure and manufacturing method thereof
- Patent number 10,068,865
- Issue date Sep 4, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion-resistant solder interconnect structures and methods of f...
- Patent number 10,049,897
- Issue date Aug 14, 2018
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,049,998
- Issue date Aug 14, 2018
- Invensas Corporation
- Rajesh Katkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly of an integrated circuit chip and of a plate
- Patent number 9,941,188
- Issue date Apr 10, 2018
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper nanorod-based thermal interface material (TIM)
- Patent number 9,865,521
- Issue date Jan 9, 2018
- Intel Corporation
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with socket plug interconnection structures
- Patent number 9,842,822
- Issue date Dec 12, 2017
- SK hynix Inc.
- Hyeong Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240282736
- Publication date Aug 22, 2024
- Japan Display Inc.
- Yoichi KAMIJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282738
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...
- Publication number 20230335522
- Publication date Oct 19, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...
- Publication number 20220344295
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC AND METALLIC NANOWIRE BOND LAYERS
- Publication number 20220102307
- Publication date Mar 31, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert SUMMERFELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE DIRECT COPPER-COPPER BONDING
- Publication number 20220018036
- Publication date Jan 20, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND MICRO LED B...
- Publication number 20210091057
- Publication date Mar 25, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM SCHEME FOR BUMPING
- Publication number 20200243469
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20190326228
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180337154
- Publication date Nov 22, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED UBM AND MIXED PITCH ON A SINGLE DIE
- Publication number 20180331056
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...
- Publication number 20170148754
- Publication date May 25, 2017
- GLOBALFOUNDRIES INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE
- Publication number 20170133297
- Publication date May 11, 2017
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM)
- Publication number 20170133296
- Publication date May 11, 2017
- Intel Corporation
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20170053883
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20160336286
- Publication date Nov 17, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20150091165
- Publication date Apr 2, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20140252652
- Publication date Sep 11, 2014
- SK HYNIX INC.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20140252576
- Publication date Sep 11, 2014
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM)
- Publication number 20140246770
- Publication date Sep 4, 2014
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS
- Publication number 20140153210
- Publication date Jun 5, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROC...
- Publication number 20130341787
- Publication date Dec 26, 2013
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Application
LOW-TEMPERATURE FLIP CHIP DIE ATTACH
- Publication number 20130313726
- Publication date Nov 28, 2013
- Trent S. Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING TWO SUBSTRATES CONNECTED BY AT LEAST ONE MEC...
- Publication number 20130313704
- Publication date Nov 28, 2013
- Jean-Charles Souriau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLOCKING TYPE SOLDER CONNECTIONS FOR ALIGNMENT AND BONDING OF W...
- Publication number 20130292037
- Publication date Nov 7, 2013
- Rajesh Baskaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Profile Interposer with Stud Structure
- Publication number 20130285237
- Publication date Oct 31, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Solder Connections
- Publication number 20130277838
- Publication date Oct 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE BODY, WIRING SUBSTRATE, AND SEMICONDUCTOR DEVICE
- Publication number 20130256880
- Publication date Oct 3, 2013
- OLYMPUS CORPORATION
- Chihiro Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Direct Connections to Through Vias
- Publication number 20130241057
- Publication date Sep 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

being disposed next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Advanced device assembly structures and methods

Filter package structure and method for preparing same

Multilayer substrate

Driving substrate and manufacturing method thereof, and micro LED b...

Dielectric and metallic nanowire bond layers

Semiconductor interconnect structures with conductive elements, and...

Film scheme for bumping

Semiconductor device package including embedded conductive elements

Mixed UBM and mixed pitch on a single die

Interconnect crack arrestor structure and methods

Dielectric and metallic nanowire bond layers

Film scheme for bumping

Assembly comprising hybrid interconnecting means including intermed...

Mixed UBM and mixed pitch on a single die

Film scheme for bumping

Composite bump, method for forming composite bump, and substrate

Mechanisms of forming connectors for package on package

Methods and apparatus for solder connections

Combing bump structure and manufacturing method thereof

Pre-conductive array disposed on target circuit substrate and condu...

Interconnect crack arrestor structure and methods

Bonding electrode structure of flip-chip led chip and fabrication m...

Mixed UBM and mixed pitch on a single die

Multilayer substrate

Combing bump structure and manufacturing method thereof

Extrusion-resistant solder interconnect structures and methods of f...

Conductive connections, structures with such connections, and metho...

Assembly of an integrated circuit chip and of a plate

Copper nanorod-based thermal interface material (TIM)

Semiconductor packages with socket plug interconnection structures

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...

SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...

DIELECTRIC AND METALLIC NANOWIRE BOND LAYERS

Advanced Device Assembly Structures And Methods

LOW TEMPERATURE DIRECT COPPER-COPPER BONDING

DRIVING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND MICRO LED B...

FILM SCHEME FOR BUMPING

Interconnect Crack Arrestor Structure and Methods

COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF

MIXED UBM AND MIXED PITCH ON A SINGLE DIE

EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...

ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE

COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM)

INTEGRATED CIRCUIT PACKAGE

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

Semiconductor Device and Method of Forming Patterned Repassivation...

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

Semiconductor Device and Manufacturing Method Thereof

COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM)

ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS

CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROC...

LOW-TEMPERATURE FLIP CHIP DIE ATTACH

METHOD FOR FABRICATING TWO SUBSTRATES CONNECTED BY AT LEAST ONE MEC...

INTERLOCKING TYPE SOLDER CONNECTIONS FOR ALIGNMENT AND BONDING OF W...

Low Profile Interposer with Stud Structure

Methods and Apparatus for Solder Connections

ELECTRODE BODY, WIRING SUBSTRATE, AND SEMICONDUCTOR DEVICE

Methods and Apparatus for Direct Connections to Through Vias