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H01L2224/4118

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/4118being disposed on at least two different sides of the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming leadframe with clip bond...
- Patent number 12,293,972
- Issue date May 6, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with vertical passive components
- Patent number 12,230,615
- Issue date Feb 18, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Jiraphat Charoenratpratoom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,177,197
- Issue date Nov 16, 2021
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable power module
- Patent number 10,586,750
- Issue date Mar 10, 2020
- HS ELEKTRONIK SYSTEME GMBH
- Richard Sinning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with conductive clips
- Patent number 10,546,805
- Issue date Jan 28, 2020
- Texas Instruments Incorporated
- Oscar Paulo Razon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of multiple power semiconductor chips and method of man...
- Patent number 10,049,962
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die power converter
- Patent number 9,842,797
- Issue date Dec 12, 2017
- Texas Instruments Incorporated
- Brian A. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
- Patent number 9,824,949
- Issue date Nov 21, 2017
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,601,453
- Issue date Mar 21, 2017
- MagnaChip Semiconductor, Ltd.
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 9,589,929
- Issue date Mar 7, 2017
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric power semiconductor device
- Patent number 9,433,075
- Issue date Aug 30, 2016
- Mitsubishi Electric Corporation
- Junji Fujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Measuring current in a power regulator system
- Patent number 9,093,900
- Issue date Jul 28, 2015
- Texas Instruments Incorporated
- Timothy J. Hegarty
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Combined packaged power semiconductor device
- Patent number 8,686,546
- Issue date Apr 1, 2014
- Alpha & Omega Semiconductor, Inc.
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor device
- Patent number 8,669,650
- Issue date Mar 11, 2014
- Alpha & Omega Semiconductor, Inc.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH CHIP STACK
- Publication number 20250183219
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...
- Publication number 20240312882
- Publication date Sep 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Junqing HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Leadframe with Clip Bond...
- Publication number 20220208686
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
- Publication number 20220115308
- Publication date Apr 14, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
- Publication number 20210090980
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GANG CLIP
- Publication number 20210005569
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Michael Kirby Chua Quijano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH CONDUCTIVE CLIPS
- Publication number 20190206773
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Oscar Paulo RAZON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE POWER MODULE
- Publication number 20180269129
- Publication date Sep 20, 2018
- HS Elektronik Systeme GmbH
- Richard SINNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20140273344
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE POWER CONVERTER
- Publication number 20140061884
- Publication date Mar 6, 2014
- Brian A. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASURING CURRENT IN A POWER REGULATOR SYSTEM
- Publication number 20140028272
- Publication date Jan 30, 2014
- TIMOTHY J. HEGARTY
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE
- Publication number 20120248539
- Publication date Oct 4, 2012
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE POWER CONVERTER
- Publication number 20120228696
- Publication date Sep 13, 2012
- TEXAS INSTRUMENTS INCORPORATED
- BRIAN ASHLEY CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED PACKAGED POWER SEMICONDUCTOR DEVICE
- Publication number 20110309454
- Publication date Dec 22, 2011
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS

being disposed on at least two different sides of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of forming leadframe with clip bond...

Semiconductor packages with vertical passive components

Semiconductor package with solder standoff

Semiconductor package with solder standoff

Stackable power module

Method for fabricating stack die package

Integrated circuit package with conductive clips

Arrangement of multiple power semiconductor chips and method of man...

Stacked die power converter

Packaging solutions for devices and systems comprising lateral GaN...

Semiconductor package

Method for fabricating stack die package

Electric power semiconductor device

Measuring current in a power regulator system

Combined packaged power semiconductor device

Flip chip semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH CHIP STACK

CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...

Semiconductor Device and Method of Forming Leadframe with Clip Bond...

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

GANG CLIP

INTEGRATED CIRCUIT PACKAGE WITH CONDUCTIVE CLIPS

STACKABLE POWER MODULE

METHOD FOR FABRICATING STACK DIE PACKAGE

STACKED DIE POWER CONVERTER

MEASURING CURRENT IN A POWER REGULATOR SYSTEM

FLIP CHIP SEMICONDUCTOR DEVICE

STACKED DIE POWER CONVERTER

COMBINED PACKAGED POWER SEMICONDUCTOR DEVICE