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H01L2224/4918

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4918being disposed on at least two different sides of the body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor arrangement and method for producing the same
- Patent number 11,942,449
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with frame having arms
- Patent number 11,715,677
- Issue date Aug 1, 2023
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding techniques for backside-biased semiconductor dice and rel...
- Patent number 11,476,208
- Issue date Oct 18, 2022
- Microchip Technology Incorporated
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,469,204
- Issue date Oct 11, 2022
- Sumitomo Electric Device Innovations, Inc.
- Akitada Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with frame having arms and related methods
- Patent number 11,004,776
- Issue date May 11, 2021
- STMICROELECTRONICS, INC.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film light emitting diode
- Patent number 10,825,962
- Issue date Nov 3, 2020
- LG Innotek Co., Ltd
- Myung Cheol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding techniques for backside-biased semiconductor dice and rel...
- Patent number 10,741,507
- Issue date Aug 11, 2020
- Microchip Technology Incorporated
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips and semiconductor packages including the same
- Patent number 10,622,312
- Issue date Apr 14, 2020
- Samsung Electronics Co., Ltd.
- Myoung-soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film light emitting diode
- Patent number 10,326,059
- Issue date Jun 18, 2019
- LG Innotek Co., Ltd
- Myung Cheol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a microelectronic chip element on a wire elem...
- Patent number 9,953,953
- Issue date Apr 24, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with frame having arms and related methods
- Patent number 9,947,612
- Issue date Apr 17, 2018
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic system
- Patent number 9,748,449
- Issue date Aug 29, 2017
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microwave integrated circuit
- Patent number 9,721,909
- Issue date Aug 1, 2017
- LOCKHEED MARTIN CORPORATION
- Mahesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film light emitting diode
- Patent number 9,716,213
- Issue date Jul 25, 2017
- LG Innotek Co., Ltd
- Myung Cheol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertically packaged integrated circuit
- Patent number 9,484,320
- Issue date Nov 1, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Christopher W. Argento
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film light emitting diode
- Patent number 9,281,454
- Issue date Mar 8, 2016
- LG Innotek Co., Ltd
- Myung Cheol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC embedded substrate and method of manufacturing the same
- Patent number 9,153,553
- Issue date Oct 6, 2015
- TDK Corporation
- Kazutoshi Tsuyutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor device, semiconductor device having the...
- Patent number 9,136,455
- Issue date Sep 15, 2015
- Research & Business Foundation Sungkyunkwan University
- Su Jeong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system having planar interconnect and...
- Patent number 9,029,205
- Issue date May 12, 2015
- Stats Chippac Ltd.
- Reza Argenty Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic system
- Patent number 8,999,736
- Issue date Apr 7, 2015
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor device, semiconductor device having the...
- Patent number 9,000,593
- Issue date Apr 7, 2015
- Research & Business Foundation Sungkyunkwan University
- Su Jeong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid package
- Patent number 8,779,303
- Issue date Jul 15, 2014
- Altera Corporation
- Li-Tien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical light emitting diodes (LED) having metal substrate and spi...
- Patent number 8,680,534
- Issue date Mar 25, 2014
- Semileds Corporation
- Chuong A Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency LEDs
- Patent number 8,455,882
- Issue date Jun 4, 2013
- Cree, Inc.
- Zhimin Jamie Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film light emitting diode
- Patent number 8,445,921
- Issue date May 21, 2013
- LG Electronics, Inc.
- Myung Cheol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with common gold plated metal condu...
- Patent number 8,405,214
- Issue date Mar 26, 2013
- Nanya Technology Corp.
- Aaron Willey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film light emitting diode
- Patent number 8,384,091
- Issue date Feb 26, 2013
- LG Electronics Inc.
- Myung Cheol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package and method of manufacturing the same
- Patent number 8,349,651
- Issue date Jan 8, 2013
- Samsung Electronics Co., Ltd.
- Won-Hwa Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode module and manufacturing method thereof
- Patent number 8,304,798
- Issue date Nov 6, 2012
- Light Ocean Technology Corp.
- Chia-Min Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DISPLAY APPARATUS
- Publication number 20230215878
- Publication date Jul 6, 2023
- LG Display Co., Ltd.
- Minjae SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230111921
- Publication date Apr 13, 2023
- RENESAS ELECTRONICS CORPORATION
- Takashi TONEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20210242163
- Publication date Aug 5, 2021
- INFINEON TECHNOLOGIES AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING TECHNIQUES FOR BACKSIDE-BIASED SEMICONDUCTOR DICE AND REL...
- Publication number 20200365530
- Publication date Nov 19, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM LIGHT EMITTING DIODE
- Publication number 20190267516
- Publication date Aug 29, 2019
- LG Innotek Co., Ltd.
- Myung Cheol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE CUBE WITH ENHANCED SIDEWALL PLANARITY
- Publication number 20190189591
- Publication date Jun 20, 2019
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FRAME HAVING ARMS AND RELATED METHODS
- Publication number 20180197809
- Publication date Jul 12, 2018
- STMicroelectronics, Inc.
- Jefferson TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20170324009
- Publication date Nov 9, 2017
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FRAME HAVING ARMS AND RELATED METHODS
- Publication number 20170162479
- Publication date Jun 8, 2017
- STMICROELECTRONICS, INC.
- Jefferson TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONNECTION STRUCTURE FOR COUPLING PINS OF CHIP WITH WIRI...
- Publication number 20160293570
- Publication date Oct 6, 2016
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHIH-FANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150145145
- Publication date May 28, 2015
- TDK Corporation
- Kazutoshi TSUYUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20140185638
- Publication date Jul 3, 2014
- SAE MAGNETICS (H. K) LTD.
- Takemasa Tamanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM LIGHT EMITTING DIODE
- Publication number 20130292725
- Publication date Nov 7, 2013
- LG Electronics, Inc.
- Myung Cheol YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY PACKAGED INTEGRATED CIRCUIT
- Publication number 20130285220
- Publication date Oct 31, 2013
- CHRISTOPHER W. ARGENTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Package And Method Of Manufacturing The Same
- Publication number 20130122653
- Publication date May 16, 2013
- Won-Hwa Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH LOW INDUCTANCE
- Publication number 20130037951
- Publication date Feb 14, 2013
- Aaron Willey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE HAVING THE...
- Publication number 20130037955
- Publication date Feb 14, 2013
- Su Jeong SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY LEDS
- Publication number 20120256200
- Publication date Oct 11, 2012
- Cree, Inc.
- ZHIMIN JAMIE YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical module
- Publication number 20120147914
- Publication date Jun 14, 2012
- SAE MAGNETICS (H. K) LTD.
- Takemasa Tamanuki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEMS AND METHODS FOR PRODUCING WHITE-LIGHT LIGHT EMITTING DIODES
- Publication number 20120032184
- Publication date Feb 9, 2012
- CHUONG A. TRAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110312130
- Publication date Dec 22, 2011
- Won-Hwa Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM LIGHT EMITTING DIODE
- Publication number 20110278620
- Publication date Nov 17, 2011
- Myung Cheol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING PLANAR INTERCONNECT AND...
- Publication number 20110156275
- Publication date Jun 30, 2011
- Reza Argenty Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20110121339
- Publication date May 26, 2011
- TAIWAN SOLUTIONS SYSTEMS CORP.
- CHIA-MIN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Package
- Publication number 20110095426
- Publication date Apr 28, 2011
- Li-Tien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20100283062
- Publication date Nov 11, 2010
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100219537
- Publication date Sep 2, 2010
- Renesas Technology Corp.
- Hiroshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin film light emitting diode
- Publication number 20100207145
- Publication date Aug 19, 2010
- Myung Cheol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin film light emitting diode
- Publication number 20100171125
- Publication date Jul 8, 2010
- Myung Cheol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-Stacked Package Structure
- Publication number 20100155929
- Publication date Jun 24, 2010
- CHIPMOS TECHNOLOGY INC.
- Chun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS

being disposed on at least two different sides of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor arrangement and method for producing the same

Semiconductor device with frame having arms

Grounding techniques for backside-biased semiconductor dice and rel...

Semiconductor device

Semiconductor device with frame having arms and related methods

Thin film light emitting diode

Grounding techniques for backside-biased semiconductor dice and rel...

Semiconductor chips and semiconductor packages including the same

Thin film light emitting diode

Method for assembling a microelectronic chip element on a wire elem...

Semiconductor device with frame having arms and related methods

Optoelectronic system

Hybrid microwave integrated circuit

Thin film light emitting diode

Integrated circuit chip using top post-passivation technology and b...

Vertically packaged integrated circuit

Thin film light emitting diode

IC embedded substrate and method of manufacturing the same

Substrate for semiconductor device, semiconductor device having the...

Integrated circuit packaging system having planar interconnect and...

Optoelectronic system

Substrate for semiconductor device, semiconductor device having the...

Hybrid package

Vertical light emitting diodes (LED) having metal substrate and spi...

High efficiency LEDs

Thin film light emitting diode

Semiconductor package structure with common gold plated metal condu...

Thin film light emitting diode

Stacked package and method of manufacturing the same

Light-emitting diode module and manufacturing method thereof

Patents Applicationslast 30 patents

LIGHT EMITTING DISPLAY APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING THE SAME

GROUNDING TECHNIQUES FOR BACKSIDE-BIASED SEMICONDUCTOR DICE AND REL...

THIN FILM LIGHT EMITTING DIODE

SEMICONDUCTOR STORAGE CUBE WITH ENHANCED SIDEWALL PLANARITY

SEMICONDUCTOR DEVICE WITH FRAME HAVING ARMS AND RELATED METHODS

OPTOELECTRONIC SYSTEM

SEMICONDUCTOR DEVICE WITH FRAME HAVING ARMS AND RELATED METHODS

ELECTRONIC CONNECTION STRUCTURE FOR COUPLING PINS OF CHIP WITH WIRI...

IC EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

OPTICAL MODULE

THIN FILM LIGHT EMITTING DIODE

VERTICALLY PACKAGED INTEGRATED CIRCUIT

Stacked Package And Method Of Manufacturing The Same

SEMICONDUCTOR PACKAGE STRUCTURE WITH LOW INDUCTANCE

SUBSTRATE FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE HAVING THE...

HIGH EFFICIENCY LEDS

Optical module

SYSTEMS AND METHODS FOR PRODUCING WHITE-LIGHT LIGHT EMITTING DIODES

STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME

THIN FILM LIGHT EMITTING DIODE

INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING PLANAR INTERCONNECT AND...

LIGHT-EMITTING DIODE MODULE AND MANUFACTURING METHOD THEREOF

Hybrid Package

OPTOELECTRONIC SYSTEM

SEMICONDUCTOR DEVICE

Thin film light emitting diode

Thin film light emitting diode

Chip-Stacked Package Structure