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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13076being mutually engaged together
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wire bond wires for interference shielding
    • Patent number 12,255,153
    • Issue date Mar 18, 2025
    • ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip package
    • Patent number 12,062,618
    • Issue date Aug 13, 2024
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Advanced device assembly structures and methods
    • Patent number 11,999,001
    • Issue date Jun 4, 2024
    • ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
    • Cyprian Emeka Uzoh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Methods of manufacturing semiconductor device with bump interconnec...
    • Patent number 12,002,783
    • Issue date Jun 4, 2024
    • SK hynix Inc.
    • Jun Yong Song
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip package
    • Patent number 11,894,306
    • Issue date Feb 6, 2024
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bond wires for interference shielding
    • Patent number 11,810,867
    • Issue date Nov 7, 2023
    • Invensas LLC
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bump-on-trace interconnect
    • Patent number 11,682,651
    • Issue date Jun 20, 2023
    • Taiwan Semiconductor Manufacturing Company
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,545,451
    • Issue date Jan 3, 2023
    • Nepes Co., Ltd.
    • Hyun Sik Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip package
    • Patent number 11,538,763
    • Issue date Dec 27, 2022
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bond wires for interference shielding
    • Patent number 11,462,483
    • Issue date Oct 4, 2022
    • Invensas LLC
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Interconnect crack arrestor structure and methods
    • Patent number 11,257,767
    • Issue date Feb 22, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Solder ball dimension management
    • Patent number 11,171,103
    • Issue date Nov 9, 2021
    • International Business Machines Corporation
    • Jason J. Bjorgaard
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for forming bump structure
    • Patent number 11,145,613
    • Issue date Oct 12, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Li-Guo Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip package
    • Patent number 11,107,768
    • Issue date Aug 31, 2021
    • Ping-Jung Yang
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Lead free solder columns and methods for making same
    • Patent number 10,937,752
    • Issue date Mar 2, 2021
    • TOPLINE CORPORATION
    • Martin B. Hart
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of forming a solder bump structure
    • Patent number 10,930,609
    • Issue date Feb 23, 2021
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stud bump structure for semiconductor package assemblies
    • Patent number 10,879,203
    • Issue date Dec 29, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Meng-Tse Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bump-on-trace interconnect
    • Patent number 10,847,493
    • Issue date Nov 24, 2020
    • Taiwan Semiconductor Manufacturing, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of forming solder bumps
    • Patent number 10,840,202
    • Issue date Nov 17, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of forming solder bumps
    • Patent number 10,833,035
    • Issue date Nov 10, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of forming solder bumps
    • Patent number 10,797,011
    • Issue date Oct 6, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Packaging through pre-formed metal pins
    • Patent number 10,734,345
    • Issue date Aug 4, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package structure with protrusion structure
    • Patent number 10,692,828
    • Issue date Jun 23, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Pei-Haw Tsao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of forming a solder bump structure
    • Patent number 10,692,829
    • Issue date Jun 23, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for fabricating glass substrate package
    • Patent number 10,622,310
    • Issue date Apr 14, 2020
    • Ping-Jung Yang
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Grant

    Method of forming a solder bump structure
    • Patent number 10,607,956
    • Issue date Mar 31, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bond wires for interference shielding
    • Patent number 10,559,537
    • Issue date Feb 11, 2020
    • Invensas Corporation
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bump-on-trace interconnect
    • Patent number 10,510,710
    • Issue date Dec 17, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for fabricating glass substrate package
    • Patent number 10,453,819
    • Issue date Oct 22, 2019
    • Ping-Jung Yang
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Grant

    Methods and apparatus for solder connections
    • Patent number 10,453,815
    • Issue date Oct 22, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME AND SEMICON...
    • Publication number 20250070068
    • Publication date Feb 27, 2025
    • WINBOND ELECTRONICS CORP.
    • Po-Chun SHAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING...
    • Publication number 20250054895
    • Publication date Feb 13, 2025
    • Sekisui Chemical Co., Ltd
    • Taro SHIOJIMA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Advanced Device Assembly Structures And Methods
    • Publication number 20250033138
    • Publication date Jan 30, 2025
    • ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
    • Cyprian Emeka Uzoh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CHIP PACKAGE
    • Publication number 20240379566
    • Publication date Nov 14, 2024
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE
    • Publication number 20240120281
    • Publication date Apr 11, 2024
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRE BOND WIRES FOR INTERFERENCE SHIELDING
    • Publication number 20240047376
    • Publication date Feb 8, 2024
    • ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND AS...
    • Publication number 20240038704
    • Publication date Feb 1, 2024
    • Micron Technology, Inc.
    • Faxing Che
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS
    • Publication number 20230299032
    • Publication date Sep 21, 2023
    • Intel Corporation
    • Bernd Waidhas
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
    • Publication number 20230238344
    • Publication date Jul 27, 2023
    • Kabushiki Kaisha Toshiba
    • Tomohiro SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE
    • Publication number 20230073104
    • Publication date Mar 9, 2023
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRE BOND WIRES FOR INTERFERENCE SHIELDING
    • Publication number 20230059375
    • Publication date Feb 23, 2023
    • Invensas LLC
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Advanced Device Assembly Structures And Methods
    • Publication number 20220097166
    • Publication date Mar 31, 2022
    • Invensas Corporation
    • Cyprian Emeka Uzoh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CHIP PACKAGE
    • Publication number 20210335714
    • Publication date Oct 28, 2021
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210288005
    • Publication date Sep 16, 2021
    • NEPES CO., LTD.
    • Hyun Sik KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOLDER BALL DIMENSION MANAGEMENT
    • Publication number 20210210448
    • Publication date Jul 8, 2021
    • International Business Machines Corporation
    • Jason J. Bjorgaard
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bump-on-Trace Interconnect
    • Publication number 20210074673
    • Publication date Mar 11, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING A SOLDER BUMP STRUCTURE
    • Publication number 20200152590
    • Publication date May 14, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BUMP-ON-TRACE INTERCONNECT
    • Publication number 20200118966
    • Publication date Apr 16, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRE BOND WIRES FOR INTERFERENCE SHIELDING
    • Publication number 20200118939
    • Publication date Apr 16, 2020
    • Invensas Corporation
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING A SOLDER BUMP STRUCTURE
    • Publication number 20200058612
    • Publication date Feb 20, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Interconnect Crack Arrestor Structure and Methods
    • Publication number 20190326228
    • Publication date Oct 24, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRE BOND WIRES FOR INTERFERENCE SHIELDING
    • Publication number 20190027444
    • Publication date Jan 24, 2019
    • Invensas Corporation
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
    • Publication number 20190027459
    • Publication date Jan 24, 2019
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FORMING BUMP STRUCTURE
    • Publication number 20190019772
    • Publication date Jan 17, 2019
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Li-Guo LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20180337154
    • Publication date Nov 22, 2018
    • NANYA TECHNOLOGY CORPORATION
    • Po-Chun LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUMP-ON-TRACE INTERCONNECT
    • Publication number 20180286830
    • Publication date Oct 4, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Packaging through Pre-Formed Metal Pins
    • Publication number 20180204816
    • Publication date Jul 19, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire Bond Wires for Interference Shielding
    • Publication number 20180061774
    • Publication date Mar 1, 2018
    • Invensas Corporation
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20180047695
    • Publication date Feb 15, 2018
    • RENESAS ELECTRONICS CORPORATION
    • Yoshikazu SHIMOTE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180047698
    • Publication date Feb 15, 2018
    • Rohm Co., Ltd.
    • Mamoru YAMAGAMI
    • H01 - BASIC ELECTRIC ELEMENTS