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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13076being mutually engaged together
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING...
    • Publication number 20250054895
    • Publication date Feb 13, 2025
    • Sekisui Chemical Co., Ltd
    • Taro SHIOJIMA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Advanced Device Assembly Structures And Methods
    • Publication number 20250033138
    • Publication date Jan 30, 2025
    • ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
    • Cyprian Emeka Uzoh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CHIP PACKAGE
    • Publication number 20240379566
    • Publication date Nov 14, 2024
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE
    • Publication number 20240120281
    • Publication date Apr 11, 2024
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRE BOND WIRES FOR INTERFERENCE SHIELDING
    • Publication number 20240047376
    • Publication date Feb 8, 2024
    • ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND AS...
    • Publication number 20240038704
    • Publication date Feb 1, 2024
    • Micron Technology, Inc.
    • Faxing Che
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS
    • Publication number 20230299032
    • Publication date Sep 21, 2023
    • Intel Corporation
    • Bernd Waidhas
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
    • Publication number 20230238344
    • Publication date Jul 27, 2023
    • Kabushiki Kaisha Toshiba
    • Tomohiro SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE
    • Publication number 20230073104
    • Publication date Mar 9, 2023
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRE BOND WIRES FOR INTERFERENCE SHIELDING
    • Publication number 20230059375
    • Publication date Feb 23, 2023
    • Invensas LLC
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Advanced Device Assembly Structures And Methods
    • Publication number 20220097166
    • Publication date Mar 31, 2022
    • Invensas Corporation
    • Cyprian Emeka Uzoh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CHIP PACKAGE
    • Publication number 20210335714
    • Publication date Oct 28, 2021
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210288005
    • Publication date Sep 16, 2021
    • NEPES CO., LTD.
    • Hyun Sik KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOLDER BALL DIMENSION MANAGEMENT
    • Publication number 20210210448
    • Publication date Jul 8, 2021
    • International Business Machines Corporation
    • Jason J. Bjorgaard
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bump-on-Trace Interconnect
    • Publication number 20210074673
    • Publication date Mar 11, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING A SOLDER BUMP STRUCTURE
    • Publication number 20200152590
    • Publication date May 14, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BUMP-ON-TRACE INTERCONNECT
    • Publication number 20200118966
    • Publication date Apr 16, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRE BOND WIRES FOR INTERFERENCE SHIELDING
    • Publication number 20200118939
    • Publication date Apr 16, 2020
    • Invensas Corporation
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING A SOLDER BUMP STRUCTURE
    • Publication number 20200058612
    • Publication date Feb 20, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Interconnect Crack Arrestor Structure and Methods
    • Publication number 20190326228
    • Publication date Oct 24, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRE BOND WIRES FOR INTERFERENCE SHIELDING
    • Publication number 20190027444
    • Publication date Jan 24, 2019
    • Invensas Corporation
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE
    • Publication number 20190027459
    • Publication date Jan 24, 2019
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FORMING BUMP STRUCTURE
    • Publication number 20190019772
    • Publication date Jan 17, 2019
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Li-Guo LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20180337154
    • Publication date Nov 22, 2018
    • NANYA TECHNOLOGY CORPORATION
    • Po-Chun LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUMP-ON-TRACE INTERCONNECT
    • Publication number 20180286830
    • Publication date Oct 4, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Packaging through Pre-Formed Metal Pins
    • Publication number 20180204816
    • Publication date Jul 19, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire Bond Wires for Interference Shielding
    • Publication number 20180061774
    • Publication date Mar 1, 2018
    • Invensas Corporation
    • Abiola Awujoola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20180047695
    • Publication date Feb 15, 2018
    • RENESAS ELECTRONICS CORPORATION
    • Yoshikazu SHIMOTE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180047698
    • Publication date Feb 15, 2018
    • Rohm Co., Ltd.
    • Mamoru YAMAGAMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STUD BUMP STRUCTURE FOR SEMICONDUCTOR PACKAGE ASSEMBLIES
    • Publication number 20180005973
    • Publication date Jan 4, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Tse CHEN
    • H01 - BASIC ELECTRIC ELEMENTS