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H01L2224/14152

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/14152being non uniform

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,948,903
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,676,825
- Issue date Jun 13, 2023
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 11,631,648
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,616,039
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounting semiconductor components
- Patent number 11,101,238
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 10,971,377
- Issue date Apr 6, 2021
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving chip, display substrate, display device and method for manu...
- Patent number 10,971,465
- Issue date Apr 6, 2021
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 10,833,033
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,734,347
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 10,622,326
- Issue date Apr 14, 2020
- Industrial Technology Research Institute
- Chen-Tsai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,607,964
- Issue date Mar 31, 2020
- TOSHIBA MEMORY CORPORATION
- Shinya Fukayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,600,729
- Issue date Mar 24, 2020
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 10,468,366
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit, production method thereof, and electronic compo...
- Patent number 10,453,780
- Issue date Oct 22, 2019
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 10,388,622
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,290,600
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation bump electrode for chip on film
- Patent number 10,121,721
- Issue date Nov 6, 2018
- Lapis Semiconductor Co., Ltd.
- Hiroyoshi Ichikura
- G02 - OPTICS
Information Patent Grant
Semiconductor chip scale package and manufacturing method thereof
- Patent number 9,941,240
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 9,824,992
- Issue date Nov 21, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 9,711,477
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,673,161
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bump structure having a side recess and semicondu...
- Patent number 9,520,379
- Issue date Dec 13, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 9,318,458
- Issue date Apr 19, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 9,287,234
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit, production method thereof, and electronic compo...
- Patent number 9,252,087
- Issue date Feb 2, 2016
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including wiring board with semiconductor chip
- Patent number 8,963,327
- Issue date Feb 24, 2015
- Renesas Electronics Corporation
- Kozo Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and display device provided with the same
- Patent number 8,299,631
- Issue date Oct 30, 2012
- Sharp Kabushiki Kaisha
- Takeshi Horiguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250046659
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Se Ra Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...
- Publication number 20250006661
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Guangxu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240250093
- Publication date Jul 25, 2024
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Bin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT
- Publication number 20240145414
- Publication date May 2, 2024
- Wolfspeed, Inc.
- Gerard Bouisse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL
- Publication number 20230378124
- Publication date Nov 23, 2023
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230361170
- Publication date Nov 9, 2023
- MURATA MANUFACTURING CO., LTD.
- Fuminori MORISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACK COOLING WINGS
- Publication number 20230317681
- Publication date Oct 5, 2023
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20230253355
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230223373
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PILLAR CONNECTION TOPOLOGIES FOR HETEROGENEOUS PACKAGING
- Publication number 20230075505
- Publication date Mar 9, 2023
- Wolfspeed, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210407949
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Sang-Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20210193484
- Publication date Jun 24, 2021
- Murata Manufacturing Co., Ltd.
- Kenichi SHIMAMOTO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20210035938
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20200098714
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20190326240
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20190259724
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNTING SEMICONDUCTOR COMPONENTS
- Publication number 20180211935
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20180053741
- Publication date Feb 22, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20170309588
- Publication date Oct 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20170062371
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20160329293
- Publication date Nov 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT, PRODUCTION METHOD THEREOF, AND ELECTRONIC COMPO...
- Publication number 20140138706
- Publication date May 22, 2014
- Mitsubishi Electric Corporation
- Rei YONEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130299970
- Publication date Nov 14, 2013
- RENESAS ELECTRONICS CORPORATION
- Kozo HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROTATED SEMICONDUCTOR DEVICE FAN-OUT WAFER LEVEL PACKAGES AND METHO...
- Publication number 20130256883
- Publication date Oct 3, 2013
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20130043583
- Publication date Feb 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended)
- Publication number 20120080789
- Publication date Apr 5, 2012
- Sharp Kabushiki Kaisha
- Motoji Shiota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REINFORCING CHIP PACKAGES
- Publication number 20120032327
- Publication date Feb 9, 2012
- FUJITSU LIMITED
- Michael G. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND DISPLAY DEVICE PROVIDED WITH THE SAME
- Publication number 20110193239
- Publication date Aug 11, 2011
- Sharp Kabushiki Kaisha
- Takeshi Horiguchi
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE
- Publication number 20100252855
- Publication date Oct 7, 2010
- Hidenori Kamei
- H01 - BASIC ELECTRIC ELEMENTS

being non uniform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bump structure having a side recess and semiconductor structure inc...

Semiconductor package

Semiconductor chip

Bump structure having a side recess and semiconductor structure inc...

Semiconductor package

Surface mounting semiconductor components

Bonded structures for package and substrate

Semiconductor chip

Driving chip, display substrate, display device and method for manu...

Bump structure having a side recess and semiconductor structure inc...

Dummy flip chip bumps for reducing stress

Chip package structure

Semiconductor device

Semiconductor package

Bonded structures for package and substrate

Electronic circuit, production method thereof, and electronic compo...

Bump structure having a side recess and semiconductor structure inc...

Dummy flip chip bumps for reducing stress

Heat dissipation bump electrode for chip on film

Semiconductor chip scale package and manufacturing method thereof

Bump structure having a side recess and semiconductor structure inc...

Dummy flip chip bumps for reducing stress

Bonded structures for package and substrate

Method of forming bump structure having a side recess and semicondu...

Bump structure having a side recess and semiconductor structure inc...

Dummy flip chip bumps for reducing stress

Electronic circuit, production method thereof, and electronic compo...

Semiconductor device including wiring board with semiconductor chip

Semiconductor element and display device provided with the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...

DISPLAY PANEL AND DISPLAY DEVICE

RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

THREE-DIMENSIONAL STACK COOLING WINGS

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

SEMICONDUCTOR PACKAGE

METAL PILLAR CONNECTION TOPOLOGIES FOR HETEROGENEOUS PACKAGING

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

Bonded Structures for Package and Substrate

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

Dummy Flip Chip Bumps for Reducing Stress

SURFACE MOUNTING SEMICONDUCTOR COMPONENTS

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

Dummy Flip Chip Bumps for Reducing Stress

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

Bonded Structures for Package and Substrate

ELECTRONIC CIRCUIT, PRODUCTION METHOD THEREOF, AND ELECTRONIC COMPO...

SEMICONDUCTOR DEVICE

ROTATED SEMICONDUCTOR DEVICE FAN-OUT WAFER LEVEL PACKAGES AND METHO...

Dummy Flip Chip Bumps for Reducing Stress

SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended)

SYSTEMS AND METHODS FOR REINFORCING CHIP PACKAGES

SEMICONDUCTOR ELEMENT AND DISPLAY DEVICE PROVIDED WITH THE SAME

SEMICONDUCTOR LIGHT-EMITTING DEVICE