being rectangular or square

Industry

CPC
H01L2224/16054

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16054being rectangular or square

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solid-state imaging device
- Patent number 10,115,695
- Issue date Oct 30, 2018
- TOHOKU-MICROTEC CO., LTD
- Makoto Motoyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device sealed in a resin section and method for manuf...
- Patent number 9,443,827
- Issue date Sep 13, 2016
- Cypress Semiconductor Corporation
- Kouichi Meguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 9,437,562
- Issue date Sep 6, 2016
- Toyota Jidosha Kabushiki Kaisha
- Takashi Ushijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump joining structure with low resistance joining member
- Patent number 9,129,884
- Issue date Sep 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method for manufacturing wi...
- Patent number 9,119,319
- Issue date Aug 25, 2015
- Shinko Electric Industries Co., Ltd.
- Wataru Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device sealed in a resin section and method for manuf...
- Patent number 7,932,616
- Issue date Apr 26, 2011
- Spansion LLC
- Kouichi Meguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip edge interconnect apparatus and method
- Patent number 6,611,050
- Issue date Aug 26, 2003
- International Business Machines Corporation
- Thomas G. Ference
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED DEVICE COMPRISING ELONGATED PADS
- Publication number 20240297129
- Publication date Sep 5, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON MODE SUPPRESSION CIRCUIT
- Publication number 20240274530
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Siraj Akhtar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED ELECTRONIC ASSEMBLY
- Publication number 20240164008
- Publication date May 16, 2024
- Industrial Technology Research Institute
- Li-Wei Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF
- Publication number 20240021558
- Publication date Jan 18, 2024
- Powertech Technology Inc.
- Shang-Yu CHANG-CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE OF ELECTRONIC CHIPS
- Publication number 20220375840
- Publication date Nov 24, 2022
- STMicroelectronics (Tours) SAS
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR ELECTRONIC ASSEMBLIES
- Publication number 20190318985
- Publication date Oct 17, 2019
- National Taiwan Normal University
- Jung-Hsuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20180315727
- Publication date Nov 1, 2018
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20160372442
- Publication date Dec 22, 2016
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Bing Han
- G02 - OPTICS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WI...
- Publication number 20150102510
- Publication date Apr 16, 2015
- Shinko Electric Industries Co., Ltd.
- Wataru Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150091162
- Publication date Apr 2, 2015
- Shinko Electric Industries Co., LTD.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20150061122
- Publication date Mar 5, 2015
- Toyota Jidosha Kabushiki Kaisha
- Takashi USHIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE SEALED IN A RESIN SECTION AND METHOD FOR MANUF...
- Publication number 20150041976
- Publication date Feb 12, 2015
- SPANSION LLC
- Kouichi MEGURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150014849
- Publication date Jan 15, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE SEALED IN A RESIN SECTION AND METHOD FOR MANUF...
- Publication number 20110169166
- Publication date Jul 14, 2011
- Kouichi MEGURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090020890
- Publication date Jan 22, 2009
- SPANSION LLC
- Kouichi MEGURO
- H01 - BASIC ELECTRIC ELEMENTS

being rectangular or square

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solid-state imaging device

Semiconductor device sealed in a resin section and method for manuf...

Semiconductor device and manufacturing method of semiconductor device

Solder bump joining structure with low resistance joining member

Wiring board, semiconductor device, and method for manufacturing wi...

Semiconductor device sealed in a resin section and method for manuf...

Chip edge interconnect apparatus and method

Patents Applicationslast 30 patents

INTEGRATED DEVICE COMPRISING ELONGATED PADS

COMMON MODE SUPPRESSION CIRCUIT

MOLDED ELECTRONIC ASSEMBLY

CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF

MANUFACTURE OF ELECTRONIC CHIPS

PACKAGE STRUCTURE FOR ELECTRONIC ASSEMBLIES

SOLID-STATE IMAGING DEVICE

DISPLAY DEVICE

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE SEALED IN A RESIN SECTION AND METHOD FOR MANUF...

CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE SEALED IN A RESIN SECTION AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME